Discusses the EMC Directive 89/336/EEC from the point of view of a small PC manufacturer. The author considers what is included, routes to compliance, product design, product testing and quality control.
Discusses the EMC Directive 89/336/EEC from the point of view of a small PC manufacturer. The author considers what is included, routes to compliance, product design, product testing and quality control.
The most usual approach to compliance with the EMC Directive is via the harmonized standards route, which involves choosing and then "applying" one or more harmonized standards from the raft of available ref...
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The most usual approach to compliance with the EMC Directive is via the harmonized standards route, which involves choosing and then "applying" one or more harmonized standards from the raft of available references that have been published in the Official Journal of the EC. Those unfamiliar with EMC but used to safety requirements have quite naturally formed the view that standards specify "a way of doing things", that is to say, they are applied at the design stage of a new product as a set of rules that determine the design choices. If you follow these rules, then you have complied with the standard. EMC standards are not like this. They are standards for testing, not for design. You cannot "design to comply with" an EMC standard, you can only demonstrate that you have complied by performing the specified test. This paper discusses some of the implications of this characteristic for product designers, and recommends design approaches which will go some way towards helping to meet the problems it causes.
When installing equipment in a large installation the main EMC considerations are the earthing of the equipment and interconnecting cabling. Unfortunately when it comes to earthing and cabling, there is not one correc...
When installing equipment in a large installation the main EMC considerations are the earthing of the equipment and interconnecting cabling. Unfortunately when it comes to earthing and cabling, there is not one correct way or set of rules that will be right in every case. However, there are regulations that must be obeyed and guidelines that will ensure the optimum EMC performance for the majority of cases. This paper will concentrate on the key issues to enable them to be applied with some understanding.
Compact integrated circuits for millimetre-wave frequencies can be realised by using coplanar waveguide technology and single- or dual-gate HEMTs, allowing a simplified chip processing and a smaller chip size. Due to ...
Compact integrated circuits for millimetre-wave frequencies can be realised by using coplanar waveguide technology and single- or dual-gate HEMTs, allowing a simplified chip processing and a smaller chip size. Due to the resulting cost reduction, this technology has the potential for meeting the targets of increasing volume markets in the field of communication or automotive applications.
A simple and effective study for microwave and millimetre-wave non-linear circuits is shown to be viable with minimum modelling and computing effort, for preliminary circuit design or quick and inexpensive active comp...
A simple and effective study for microwave and millimetre-wave non-linear circuits is shown to be viable with minimum modelling and computing effort, for preliminary circuit design or quick and inexpensive active component evaluation. Such a simple approach is also a useful tool to predict possible instabilities and allows a in-depth knowledge of the non-linear circuit behaviour both in terms of optimum loading and biasing.
It is now nearly a quarter of a century since the first GaAs FET based MMICs were demonstrated. After an initial period of experimentation and development, the medium entered true commercial exploitation in the 1980&#...
It is now nearly a quarter of a century since the first GaAs FET based MMICs were demonstrated. After an initial period of experimentation and development, the medium entered true commercial exploitation in the 1980's. At that time it was relatively expensive and found first insertion mainly in military systems but it has now found its was into many volume applications. This growth in exploitation has come about through two major causes - improved processing technologies and hence yields, and improved circuit design capability. This paper will attempt to illustrate how the improved yields have allowed circuit designers to produce complex, multifunction MMICs - in some cases, systems on a chip.
A design strategy is presented for the development of high-power high-efficiency GaAs MMIC amplifiers at microwave frequencies. The presented design strategy results in a short design time and guarantees a first pass ...
A design strategy is presented for the development of high-power high-efficiency GaAs MMIC amplifiers at microwave frequencies. The presented design strategy results in a short design time and guarantees a first pass success. The design method addressed includes proper transistor size selection, transistor characterisation at high-power conditions under optimum load conditions, large-signal parameter extraction, broadband matching techniques, stability analysis and high-speed simulation of the passive matching networks with the accuracy of electro-magnetic simulations. The design method is illustrated with several examples of broadband MESFET and HEMT amplifiers at X-band.
Prior to the advent of the commercial wireless communications market in the late 1980's, most RF circuit designs were destined for military applications. Since then, the size of the military market has declined, w...
Prior to the advent of the commercial wireless communications market in the late 1980's, most RF circuit designs were destined for military applications. Since then, the size of the military market has declined, whilst the size of the wireless communications market has grown exponentially. With the move from low volume military applications to high volume commercial applications came ever increasing pressure for reduced cost, size and weight. This paper discusses the important trade-offs which must be made when designing RF ICs for use in high volume commercial wireless products and presents techniques which can be adopted to keep the costs down to the very low levels demanded by the market.
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