From the Publisher: An important aspect of wireless networks is the deployment of their infrastructure. In this book, the Editors have invited a number of experts from industry to write on a variety of topics associat...
ISBN:
(数字)9780306473319
ISBN:
(纸本)9780792379027
From the Publisher: An important aspect of wireless networks is the deployment of their infrastructure. In this book, the Editors have invited a number of experts from industry to write on a variety of topics associated with deployment of digital wireless networks. The first part of the book consists of an overview of systems design and engineering integration, comparison of polarization and space diversity antenna systems, and the performance of deploying smart antenna architectures in cellular and PCS networks. The second part addresses deployment of CDMA networks, based on IS-95 standards. Here the authors discuss issues related to optimization of overlaid dual model CDMA networks, embedding microcells to improve hot-spot capacity, and mitigation of intermodulation distortion in handsets. Part III deals with deployment of TDMA- based networks. The issues presented include developing hierarchical systems, reconfigurable transceivers, and deploying the GSM frequency hopping feature for enhancing existing traffic capacity. The last part, on Wireless Data Networks, is comprised of issues related to the performance of GPRS systems deployed as an upgrade on current networks and deployment of wireless LANs. Critical issues for deploying an IEEE 802.11-based WLAN are examined. Wireless Network Deployments provides practical engineering guidance for wireless and cellular engineers, researchers, technicians, and managers working in second and third generation digital wireless networks.
The modern wireless communication industry has put great demands on circuit designers for smaller, cheaper transceivers in the gigahertz frequency range. One tool which has assisted designers in satisfying these requi...
详细信息
ISBN:
(数字)9780306470387
ISBN:
(纸本)9780792379867
The modern wireless communication industry has put great demands on circuit designers for smaller, cheaper transceivers in the gigahertz frequency range. One tool which has assisted designers in satisfying these requirements is the use of on-chip inductiveelements (inductors and transformers) in silicon (Si) radio-frequency (RF) integrated circuits (ICs). These elements allow greatly improved levels of performance in Si monolithic low-noise amplifiers, power amplifiers, up-conversion and down-conversion mixers and local oscillators. Inductors can be used to improve the intermodulation distortion performance and noise figure of small-signal amplifiers and mixers. In addition, the gain of amplifier stages can be enhanced and the realization of low-cost on-chip local oscillators with good phase noise characteristics is made feasible. In order to reap these benefits, it is essential that the IC designer be able to predict and optimize the characteristics of on-chip inductiveelements. Accurate knowledge of inductance values, quality factor (Q) and the influence of ad- cent elements (on-chip proximity effects) and substrate losses is essential. In this book the analysis, modeling and application of on-chip inductive elements is considered. Using analyses based on Maxwells equations, an accurate and efficient technique is developed to model these elements over a wide frequency range. Energy loss to the conductive substrate is modeled through several mechanisms, including electrically induced displacement and conductive c- rents and by magnetically induced eddy currents. These techniques have been compiled in a user-friendly software tool ASITIC (Analysis and Simulation of Inductors and Transformers for Integrated Circuits).
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