The past several years have been exciting for wireless communications. The public appetite for new services and equipment continues to grow. The Second Generation systems that have absorbed our attention during recent...
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ISBN:
(数字)9781461531449
ISBN:
(纸本)9780792393160;9781461363767
The past several years have been exciting for wireless communications. The public appetite for new services and equipment continues to grow. The Second Generation systems that have absorbed our attention during recent years will soon be commercial realities. In addition to these standard systems, we see an explosion of technical alternatives for meeting the demand for wireless communications. The debates about competing solutions to the same problem are a sign of the scientific and technical immaturity of our field. Here we have an application in search of technology rather than the reverse. This is a rare event in the information business. Happily, there is a growing awareness that we can act now to prevent the technology shortage from becoming more acute at the end of this decade. By then, market size and user expectations will surpass the capabilities of today's emerging systems. Third Generation Wireless Information Networks will place even greater burdens on technology than their ancestors. To discuss these issues, Rutgers University WINLAB plays host to a series of Workshops on Third Generation Wireless Information Networks. The first one, in 1989, had the flavor of a gathering of committed enthusiasts of an interesting niche of telephony. Presentations and discussions centered on the problems of existing cellular systems and technical alternatives to alleviating them. Although the more distant future was the announced theme of the Workshop, it drew only a fraction of our attention.
A modern microelectronic circuit can be compared to a large construction, a large city, on a very small area. A memory chip, a DRAM, may have up to 64 million bit locations on a surface of a few square centimeters. Ea...
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ISBN:
(数字)9781461315551
ISBN:
(纸本)9780792391159;9781461288336
A modern microelectronic circuit can be compared to a large construction, a large city, on a very small area. A memory chip, a DRAM, may have up to 64 million bit locations on a surface of a few square centimeters. Each new generation of integrated circuit- generations are measured by factors of four in overall complexity -requires a substantial increase in density from the current technology, added precision, a decrease of the size of geometric features, and an increase in the total usable surface. The microelectronic industry has set the trend. Ultra large funds have been invested in the construction of new plants to produce the ultra large-scale circuits with utmost precision under the most severe conditions. The decrease in feature size to submicrons -0.7 micron is quickly becoming availabl- does not only bring technological problems. New design problems arise as well. The elements from which microelectronic circuits are build, transistors and interconnects, have different shape and behave differently than before. Phenomena that could be neglected in a four micron technology, such as the non-uniformity of the doping profile in a transistor, or the mutual capacitance between two wires, now play an important role in circuit design. This situation does not make the life of the electronic designer easier: he has to take many more parasitic effects into account, up to the point that his ideal design will not function as originally planned.
not a coincidence, but is the result of a carefully planned time of landing (sun elevation) and lander orientation (sun azimuth). * The picture was started 25 seconds after touchdown and took 15 seconds to acquire. Th...
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ISBN:
(数字)9781475725681
ISBN:
(纸本)9780792399568;9781441951809
not a coincidence, but is the result of a carefully planned time of landing (sun elevation) and lander orientation (sun azimuth). * The picture was started 25 seconds after touchdown and took 15 seconds to acquire. The alternating bright and dark vertical striations at the left side of the image and the fine particles deposited on the footpad at the right side were caused by a turbulent cloud of dust raised by the lander's retrorockets. t *F. O. Huck and S. D. Wall, "Image quality prediction: An aid to the Viking Lander imaging investigation on Mars. " Appl. Opt. 15, 1748-1766 (1976). tT. A. Mutch, A. B. Binder, F. O. Huck, E. C. Levinthal, S. Liebes, Jr. , E. C. Morris, W. R. Patterson, J. B. Pollack, C. Sagan and G. R. Taylor, "The Surface of Mars: The view from the Viking 1 Lander. " science 193, 791-801 (1976). VISUAL COMMUNICATION An Information Theory Approach Chapter 1 Introduction 1. 1 OBJECTIVE l The fundamental problem of communication, as Shannon stated it, is that of reproducing at one point either exactly or approximately a message selected at another point. In the classical model of communication (Fig. 1. 1), the infor mation source selects a desired message from a set of possible messages which the transmitter changes into the signal that is actually sent over the commu nication channel to the receiver. The receiver changes this signal back into a message, and hands this message to the destination.
Test generation is one of the most difficult tasks facing the designer of complex VLSI-based digital systems. Much of this difficulty is attributable to the almost universal use in testing of low, gate-level circuit a...
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ISBN:
(数字)9781461315278
ISBN:
(纸本)9780792390589;9781461288190
Test generation is one of the most difficult tasks facing the designer of complex VLSI-based digital systems. Much of this difficulty is attributable to the almost universal use in testing of low, gate-level circuit and fault models that predate integrated circuit technology. It is long been recognized that the testing prob lem can be alleviated by the use of higher-level methods in which multigate modules or cells are the primitive components in test generation; however, the development of such methods has proceeded very slowly. To be acceptable, high-level approaches should be applicable to most types of digital circuits, and should provide fault coverage comparable to that of traditional, low-level methods. The fault coverage problem has, perhaps, been the most intractable, due to continued reliance in the testing industry on the single stuck-line (SSL) fault model, which is tightly bound to the gate level of abstraction. This monograph presents a novel approach to solving the foregoing problem. It is based on the systematic use of multibit vectors rather than single bits to represent logic signals, including fault signals. A circuit is viewed as a collection of high-level components such as adders, multiplexers, and registers, interconnected by n-bit buses. To match this high-level circuit model, we introduce a high-level bus fault that, in effect, replaces a large number of SSL faults and allows them to be tested in parallel. However, by reducing the bus size from n to one, we can obtain the traditional gate-level circuit and models.
The summer school on VLSf GAD Tools and Applications was held from July 21 through August 1, 1986 at Beatenberg in the beautiful Bernese Oberland in Switzerland. The meeting was given under the auspices of IFIP WG 10....
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ISBN:
(数字)9781461319856
ISBN:
(纸本)9781461291862
The summer school on VLSf GAD Tools and Applications was held from July 21 through August 1, 1986 at Beatenberg in the beautiful Bernese Oberland in Switzerland. The meeting was given under the auspices of IFIP WG 10. 6 VLSI, and it was sponsored by the Swiss Federal Institute of Technology Zurich, Switzerland. Eighty-one professionals were invited to participate in the summer school, including 18 lecturers. The 81 participants came from the following countries: Australia (1), Denmark (1), Federal Republic of Germany (12), France (3), Italy (4), Norway (1), South Korea (1), Sweden (5), United Kingdom (1), United States of America (13), and Switzerland (39). Our goal in the planning for the summer school was to introduce the audience into the realities of CAD tools and their applications to VLSI design. This book contains articles by all 18 invited speakers that lectured at the summer school. The reader should realize that it was not intended to publish a textbook. However, the chapters in this book are more or less self-contained treatments of the particular subjects. Chapters 1 and 2 give a broad introduction to VLSI Design. Simulation tools and their algorithmic foundations are treated in Chapters 3 to 5 and 17. Chapters 6 to 9 provide an excellent treatment of modern layout tools. The use of CAD tools and trends in the design of 32-bit microprocessors are the topics of Chapters 10 through 16. Important aspects in VLSI testing and testing strategies are given in Chapters 18 and 19.
Wireless personal communications, or wireless as it is now being called, has arrived. The hype is starting to fade, and the hard work of deploying new systems and services for personal communications is underway. In t...
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ISBN:
(数字)9781461313311
ISBN:
(纸本)9780792396765;9781461285724
Wireless personal communications, or wireless as it is now being called, has arrived. The hype is starting to fade, and the hard work of deploying new systems and services for personal communications is underway. In the United States, the FCC propelled the wireless era from infancy to mainstream with a $7.7 billion auction of 60 MHz of radio spectrum in the 180011900 MHz band. With the largest single sale of public property in the history of mankind mostly complete, the resources of the entire world are being called upon to develop inexpensive, rapidly deployable wireless systems and sub scriber units for an industry that is adding subscribers at greater than 50% annual rate. This growth is commonplace for wireless service companies throughout the world, and in the U.S., where as many as 7 licensed wireless service providers may be competing for cellularfPCS customers within the next couple of years, differentiators in cost, qual ity, service, and coverage will become critical to customer acceptance and use. Many of these issues are discussed in the papers included in this book.
Gallium Arsenide technology has come of age. GaAs integrated circuits are available today as gate arrays with an operating speed in excess of one Gigabits per second. Special purpose GaAs circuits are used in optical ...
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ISBN:
(数字)9781461315414
ISBN:
(纸本)9780792390817;9781461288268
Gallium Arsenide technology has come of age. GaAs integrated circuits are available today as gate arrays with an operating speed in excess of one Gigabits per second. Special purpose GaAs circuits are used in optical fiber digital communications systems for the purpose of regeneration, multiplexing and switching of the optical signals. As advances in fabrication and packaging techniques are made, the operat ing speed will further increase and the cost of production will reach a point where large scale application of GaAs circuits will be economical in these and other systems where speed is paramount. This book is written for students and engineers who wish to enter into this new field of electronics for the first time and who wish to embark on a serious study of the subject of GaAs circuit design. No prior knowledge of GaAs technology is assumed though some previous experience with MOS circuit design will be helpful. A good part of the book is devoted to circuit analysis, to the extent that is possible for non linear circuits. The circuit model of the GaAs transistor is derived from first principles and analytic formulas useful in predicting the approxi mate circuit performance are also derived. computer simulation is used throughout the book to show the expected performance and to study the effects of parameter variations.
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