Modeling and Application of Flexible Electronics Packaging

版本说明：1st ed. 2019

作     者：YongAn Huang Zhouping Yin Xiaodong Wan 

I S B N：(纸本) 9789811336263 

出 版 社：Springer Nature Singapore 

出 版 年：2019年

页      数：xiii, 287 pages :页

主 题 词：Flexible electronics. 

学科分类：080903[工学-微电子学与固体电子学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 

摘      要：This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics