Numerical Simulation of Random Vibration Analysis for Ball Grid Array Package

作     者：Wenhao Luo Wei Su Xianshan Dong Zhenhua Nie Agam Tomar 

作者机构：MOE Key lab of Disaster Forecast and Control in Engineering Guangzhou China School of Mechanics and Construction Engineering Jinan University Guangzhou China Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou China Faculty of Engineering and Mathematical Sciences University of Western Australia Perth Australia 

出 版 物：《IOP Conference Series: Earth and Environmental Science》 

年 卷 期：2021年第769卷第3期

摘      要：This paper uses ANSYS Workbench (a finite element analysis software) to simulate BGA ceramic packing. The author models fixture, ceramic and metal steel. Then different thickness papers are laid on the BGA product. By random vibration analysis, the natural frequency and mode of the sample are obtained. According the results, the author discusses the relationship between different thickness papers and PSD-frequency curve. It provides a benefit instruction for the design of BGA packing.