Terahertz band communication using plasma wave propagation in multilayer graphene heterostructures

作     者：Rakheja, Shaloo 

作者机构：NYU Elect & Comp Engn Brooklyn NY 11201 USA 

出 版 物：《IET CYBER-PHYSICAL SYSTEMS: THEORY & APPLICATIONS》 

年 卷 期：2018年第3卷第2期

页      面：89-98页

基　　金：Division of Computing and Communication Foundations Direct For Computer & Info Scie & Enginr 

主　　题：graphene multilayers plasmonics integrated circuit interconnections parallel plate waveguides surface plasmons Maxwell equations Fermi level terahertz band communication plasma wave propagation multilayer graphene heterostructure optoelectronic device ML graphene low-energy plasmonic interconnection geometry analysis on-chip signalling next-generation system single waveguide SWG parallel-plate waveguide PPWG surface plasmon propagation transverse magnetic direction dispersion-less quasitransverse electromagnetic mode Maxwell's equation impedance boundary condition electrostatic screening Fermi level intraband dynamical surface conductivity model plasmon generation effect 2020 ITRS technology node C 

摘      要：Graphene-based heterostructures provide a viable platform to implement optoelectronic devices that can operate in the terahertz (THz) band. In this study, the authors focus on multilayer (ML) graphene as the building block to implement high-frequency and low-energy plasmonic interconnects for on-chip signalling in next-generation systems. Two specific plasmonic interconnect geometries are analysed: single waveguide (SWG) and parallel-plate waveguide (PPWG). While SWG interconnects support propagating surface plasmons that are polarised in the transverse magnetic direction, in PPWG interconnects, nearly dispersion-less quasi-transverse electromagnetic modes are supported. The dispersion characteristics are derived by solving Maxwell s equations in the device setup in which ML graphene presents an impedance boundary condition. The effects of number of layers, electrostatic screening, and Fermi level are included in the model of intra-band dynamical surface conductivity of ML graphene. The authors also develop analytical models of energy-per-bit and bandwidth density for both SWG and PPWG interconnects. The energy dissipation includes the effect of plasmon generation, detection, and modulation circuitry within a thermal- and shot-noise-limited transmission of information. They quantify optimal interconnect length scales for which plasmonic interconnects provide lower energy and higher bandwidth when compared against their electrical (copper/low-kappa) counterparts at the 2020 ITRS technology node.