Liquid-metal micro-networks with strain-induced conductivity for soft electronics and robotic skin

作     者：Yeongmin Park Jaewoong Jung Younghoon Lee Dongwoo Lee Joost J.Vlassak Yong-Lae Park 

作者机构：Department of Mechanical EngineeringInstitute of Advanced Machines and DesignInstitute of Engineering ResearchSeoul National UniversitySeoul 08826Korea Department of Electrical Engineering and Computer ScienceMassachusetts Institute of Technology(MIT)CambridgeMA 02139USA School of Mechanical EngineeringSungkyunkwan UniversitySuwon 16419Korea John A.Paulson School of Engineering and Applied SciencesHarvard UniversityCambridgeMA 02138USA 

出 版 物：《npj Flexible Electronics》 (npj-柔性电子（英文）)

年 卷 期：2022年第6卷第1期

页      面：799-808页

核心收录：

学科分类：080202[工学-机械电子工程] 08[工学] 0804[工学-仪器科学与技术] 0802[工学-机械工程] 

基　　金：supported in part by the National Research Foundation of Korea (Grant NRF-2016R1A5A1938472)funded by the Korean Government (MSIT) in part by Institute of Information&communications Technology Planning&Evaluation (IITP)grant funded by the Korea government (MSIT) (Grant No.2021-0-00896) 

主　　题：strain networks conductivity 

摘      要：Thin-film devices made of room-temperature liquid metals(LMs)have contributed to the development of electronic skin for human-robot/machine interfaces but still have limitations,including degradations of performance and robustness under repeated *** this paper,we describe an interesting phenomenon of the formation of LM microscale networks(LMMNs)and propose to use the LMMNs for fabricating thin-film conductors.A simple layer-by-layer(LBL)deposition process enables the growth of a hierarchical structure of LM microdroplets that forms a conductive network(i.e.,LMMN)when *** strain-history behavior of LMMNs allows conductivity enhancement up to 2.37×10^(6) S m^(-1) in response to increased tensile *** adjusting the number of LM layers in LBL deposition,the gauge factor(0.2≤GF≤1),the linearity,and the sheet resistance of LMMN films can be easily controlled,providing high potentials in various applications,including skin-mountable circuits,energy harvesters,and soft artificial skin.