Improved Anti-Adhesive Wear Performance of Cu/Al Pair Via Interfacial Energy Modulation

作     者：Lu, Tian-Tian Hua, Dong-Peng An, Bai-Ling Hafeez, Muhammad Arslan Pan, Jie Lu, Jun-Yong Zhou, Qing Zhang, Cheng Liu, Lin 

作者机构：School of Materials Science and Engineering State Key Lab for Materials Processing and Die & Mold Technology Huazhong University of Science and Technology Wuhan430074 China School of Materials Science and Engineering State Key Laboratory of Solidification Processing Center of Advanced Lubrication and Seal Materials Northwestern Polytechnical University Shaanxi Xi’an710072 China National Key Laboratory of Science and Technology on Vessel Integrated Power System Naval University of Engineering Wuhan430033 China 

出 版 物：《SSRN》 

年 卷 期：2023年

核心收录：

主　　题：Adhesives 

摘      要：The prevention of adhesive wear between metals is challenging due to the strong adhesion forces that arise from the interaction of asperities. Here, we propose a novel approach to enhance the anti-adhesive wear performance of Cu/Al pair through interfacial energy modulation, with potential applications in electromagnetic railgun. Our findings indicate that the interfacial energy of the Cu-Al pair can be significantly reduced by magnetron sputtering a W thin film onto the Al alloy surface. A lower coefficient of friction and a substantial alleviation in adhesion and mechanical damage of the Cu alloy are thus obtained. Molecular dynamics simulations reveal that the immiscibility and low interfacial energy of the Cu/W pair result in the formation of an amorphous interfacial layer during friction, facilitating countermotion at the contacting surfaces, thus in turn enables the low friction. This study provides a guideline for designing novel wear-resistant pairs based on interfacial energy modulation. © 2023, The Authors. All rights reserved.