咨询与建议

看过本文的还看了

相关文献

该作者的其他文献

文献详情 >Circuit Modeling and Performan... 收藏

Circuit Modeling and Performance Analysis of GNR@SWCNT Bundle Interconnects

作     者:ZHAO Wensheng YUAN Mengjiao WANG Xiang WANG Dawei ZHAO Wensheng;YUAN Mengjiao;WANG Xiang;WANG Dawei

作者机构:Zhejiang Provincial Key Lab of Large-Scale IC Design School of Electronics and InformationHangzhou Dianzi University 

出 版 物:《Chinese Journal of Electronics》 (电子学报(英文))

年 卷 期:2023年第32卷第6期

页      面:1271-1277页

核心收录:

学科分类:080903[工学-微电子学与固体电子学] 0809[工学-电子科学与技术(可授工学、理学学位)] 08[工学] 

基  金:supported by the Zhejiang Provincial Natural Science Foundation of China (LXR22F040001) 

主  题:Resistance Analytical models Inductance Graphene Integrated circuit interconnections Repeaters System-on-chip 

摘      要:In this paper, the single-walled carbon nanotube(SWCNT) with graphene nanoribbon(GNR)inside, namely GNR@SWCNT, is proposed as alternative conductor material for the interconnect applications. The equivalent circuit model is established, and the circuit parameters extracted analytically. By virtue of the equivalent circuit model, the signal transmission performance of GNR@SWCNT bundle interconnect is evaluated and compared with its Cu and SWCNT counterparts. The optimal repeater insertions in global-and intermediate-level GNR@SWCNT bundle interconnect are studied. Moreover, it is demonstrated that the GNR@SWCNT interconnects could provide superior performance, indicating that GNR@SWCNT structure would be beneficial for development of future carbon-based integrated circuits and systems.

读者评论 与其他读者分享你的观点

用户名:未登录
我的评分