Cooperative enhancement of mechanical and tribological properties through tailoring TiN transition interface in boron nitride nanosheets reinforced copper composites

作     者：Zhong-Hua Li Liang Liu Xin You Jian-Hong Yi Rui Bao Ming-Yi Zhu Song Lu Jun-Jun Pai Zhong-Hua Li;Liang Liu;Xin You;Jian-Hong Yi;Rui Bao;Ming-Yi Zhu;Song Lu;Jun-Jun Pai

作者机构：Faculty of Materials Science and EngineeringKunming University of Science and TechnologyKunming 650093China Key Laboratory of Advanced Materials of Yunnan ProvinceKunming University of Science and TechnologyKunming 650093China 

出 版 物：《Rare Metals》 (稀有金属（英文版）)

年 卷 期：2024年第43卷第10期

页      面：5202-5215页

核心收录：

学科分类：08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 

基　　金：financially supported by Yunnan Fundamental Research Projects(No.202301BE070001-007) 

主　　题：Copper matrix composites Boron nitride nanosheets Interface structure Mechanical and frictional properties 

摘      要：Strengthening interface bonding between boron nitride nanosheets(BNNS)and copper matrix is an essential prerequisite for exploiting a new generation of copper matrix composites(CMCs)with high strength and wear ***,BNNS/Cu composites were fabricated by the powder metallurgy route,matrix-alloying(adding 1.0 wt%Ti)strategy was adopted to improve the interfacial wettability and strengthen interface adhesion.A typicalsandwich-like multiply interface structure involving TiN transition layers,BNNS and Cu matrix had been well constructed through the rational heat treatment(900℃ for 120 min).Additionally,nano-sized TiB whisker was in situ formed in the vicinity of the interface,it had linked the BNNS-Cu-TiN multiply interface,which played a role ofthreading the needleand significantly strengthened the multi-interfaces *** specific interface structure was finely characterized,and the formation mechanism of solid-state interfacial reaction feature was *** results demonstrated that the ultimate tensile strength(UTS)of BNNS/Cu-(Ti)-900℃ increased from 248 to 530 MPa(increased by 114%),and the coefficient of friction(COF)decreased from 0.51 to 0.28 than pure *** work highlights the importance of interface configuration design,which contributes to the development of CMCs with prominent comprehensive properties.