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内蒙古自治区呼和浩特市赛罕区大学西街235号 邮编: 010021
作者机构:School of Integrated Circuits and ElectronicsBeijing Institute of TechnologyBeijing 100081China
出 版 物:《Journal of Semiconductors》 (半导体学报(英文版))
年 卷 期:2025年第46卷第1期
页 面:21-56页
核心收录:
学科分类:08[工学] 0805[工学-材料科学与工程(可授工学、理学学位)] 080502[工学-材料学]
基 金:support from the National Natural Science Foundation of China(62204015) the Beijing Natural Science Foundation(L223006)
主 题:flexible infrared sensor infrared-sensitive materials device architectures fabrication techniques design strategies
摘 要:Infrared optoelectronic sensing is the core of many critical applications such as night vision,health and medication,military,space exploration,*** including mechanical flexibility as a new dimension enables novel features of adaptability and conformability,promising for developing next-generation optoelectronic sensory applications toward reduced size,weight,price,power consumption,and enhanced performance(SWaP^(3)).However,in this emerging research frontier,challenges persist in simultaneously achieving high infrared response and good mechanical deformability in devices and integrated ***,we perform a comprehensive review of the design strategies and insights of flexible infrared optoelectronic sensors,including the fundamentals of infrared photodetectors,selection of materials and device architectures,fabrication techniques and design strategies,and the discussion of architectural and functional integration towards applications in wearable optoelectronics and advanced image ***,this article offers insights into future directions to practically realize the ultra-high performance and smart sensors enabled by infrared-sensitive materials,covering challenges in materials development and device micro-/*** for scaling these techniques across fabrication,performance,and integration are presented,alongside perspectives on potential applications in medication and health,biomimetic vision,and neuromorphic sensory systems,etc.