Chip-level active temperature control for improving temperature robust of a micro-gyroscope

作     者：Chen, Zhihua Liu, Lele Xiao, Dingbang Cui, Hongjuan Wang, Xinghua 

作者机构：College of Mechatronics Engineering and Automation National University of Defense Technology Changsha Hunan410073 China 

出 版 物：《Key Engineering Materials》 (Key Eng Mat)

年 卷 期：2015年第645卷

页      面：600-604页

核心收录：

学科分类：08[工学] 0811[工学-控制科学与工程] 

主　　题：Gyroscopes 

摘      要：Silicon micro-fabricated gyroscope are very sensitive to ambient temperature, this paper conducted a novel active temperature controlling system. Combined with the PTC thermistor to detect internal temperature and the inserted TEC to control the temperature, encapsulation condition inside the gyroscope was kept in a stable situation. Experimental results showed that it greatly improved the performance of the micro-gyroscope. © (2015) Trans Tech Publications, Switzerland.