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作者机构:Stanford Univ Ginzton Lab Dept Appl Phys & Elect Engn Stanford CA 94305 USA Free Univ Brussels Dept Appl Phys & Photon B-1050 Brussels Belgium
出 版 物:《IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS》 (IEEE J Sel Top Quantum Electron)
年 卷 期:2003年第9卷第2期
页 面:477-485页
核心收录:
学科分类:0808[工学-电气工程] 08[工学] 0702[理学-物理学]
基 金:DARPA/MARCO Flemish Fund for Scientific Research Defense Advanced Research Projects Agency, DARPA, (MDA972-00-1-0024) Georgia Institute of Technology, Georgia Tech University of New Mexico, UNM Fonds Wetenschappelijk Onderzoek, FWO
主 题:CMOS integrated circuits modelocked lasers optoelectronic devices optical interconnections optical pulses optical receivers synchronization wavelength division multiplexing
摘 要:Many properties of an optically interconnected system can be improved through the use of a modelocked laser. The short pulse duration, high peak power, wide spectral bandwidth, and low timing jitter of such a laser lead to these benefits. Timing advantages include simplified synchronization across large chip areas, receiver latency reduction, and data resynchronization. Lower power dissipation may be achieved through improved receiver sensitivity. Additional applications of short optical pulses include time-division multiplexing, single-source wavelength-division multiplexing, and precise time-domain testing of circuits. Several of these concepts were investigated using a high-speed chip-to-chip optical interconnect demonstration link. The link employs a modelocked laser and surface-normal optoelectronic modulators that were flip-chip bonded to silicon CMOS circuits. This paper outlines experiments that were performed on or simulated for the link, and discusses the important benefits of ultrashort optical pulses for optical interconnection.