An interconnection method based on Sn-coated Ni core-shell powder preforms for high-temperature applications

作     者：Yu, Fuwen Hang, Chunjin Zhao, Menghui Chen, Hongtao 

作者机构：Harbin Inst Technol Dept Mat Sci & Technol Shenzhen 518055 Peoples R China Harbin Inst Technol State Key Lab Adv Welding & Joining Harbin 150001 Heilongjiang Peoples R China 

出 版 物：《JOURNAL OF ALLOYS AND COMPOUNDS》 (合金与化合物杂志)

年 卷 期：2019年第776卷

页      面：791-797页

核心收录：

学科分类：080603[工学-有色金属冶金] 0806[工学-冶金工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0703[理学-化学] 

基　　金：Science and Technology Project of Shenzhen [JCYJ20160318095308401] 

主　　题：Die attach High re-melting temperature Sn-coated Ni Power devices 

摘      要：A die-attach material based on an Sn-coated Ni core-shell powder with a high re-melting temperature can be used for high-temperature applications. The outer Sn layers of the Sn-coated Ni particles possess a low melting point of 232 degrees C and can be completely converted into a Ni3Sn4 intermetallic compound with a high re-melting point of 794.5 degrees C after reflowing at a low temperature of 250 degrees C for 40 min. This dieattach material exhibits an excellent high-temperature operational capability, with a high shear strength of 40.2 MPa at 500 degrees C. The coefficient of thermal expansion (CTE) of the reflowed preform is between those of SiC and Cu, which is highly beneficial for mitigating the stress caused by the CTE mismatch between these materials. In addition, the thermal conductivity of the bondline is sufficiently high for heat dissipation during operation. (C) 2018 Elsevier B.V. All rights reserved.