A thermal resistance network model based on three-dimensional structure

作     者：Han, Lei Tong, Zhenyang 

作者机构：Southeast Univ Key Lab MEMS Minist Educ Nanjing 210096 Jiangsu Peoples R China 

出 版 物：《MEASUREMENT》 (测量)

年 卷 期：2019年第133卷

页      面：439-443页

核心收录：

学科分类：08[工学] 080401[工学-精密仪器及机械] 0804[工学-仪器科学与技术] 081102[工学-检测技术与自动化装置] 0811[工学-控制科学与工程] 

基　　金：National Natural Science Foundation of China 

主　　题：Thermal resistance network model Three dimension Iterative algorithm Thermal distribution 

摘      要：A thermal resistance network model based on three-dimensional structure is proposed in this paper. In a chip package newly developed method (three-dimensional stacked package), the thermal distribution management is essential. In order to improve the thermal design of a chip package structure, a thermal resistance network model of temperature distribution is established based on the thermal resistance network and the principle of spherical wall heat conduction. The principle of spherical wall heat conduction is adopted to calculate the complete 3-D temperature distribution at arbitrary position. For the analysis of the thermal resistance of thermal convection, the convection coefficient is calculated based on iterative algorithm. When the heating power arises from 0.27 W to 2.18 W, the errors between the calculation results and the experimental results are less than 5%. The experimental results validate the calculation results well. (C) 2018 Elsevier Ltd. All rights reserved.