Guest Editorial for IRSP 2018 Conference

作     者：Budiman, Arief Suriadi Gan, Chee Lip Pey, Kin-Leong Sukharev, Valeriy Thomas, Olivier 

作者机构：Singapore Univ Technol & Design Engn Prod Dev Singapore 487372 Singapore Nanyang Technol Univ Sch Mat Sci & Engn Singapore Singapore Singapore Univ Technol & Design Singapore 487372 Singapore Mentor Design To Silicon Calibre Fremont CA 94538 USA Aix Marseille Univ Inst Mat Microelect & Nanosci Provence F-13397 Marseille France 

出 版 物：《IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY》 (IEEE Trans. Device Mater. Reliab.)

年 卷 期：2018年第18卷第4期

页      面：487-489页

核心收录：

学科分类：0808[工学-电气工程] 08[工学] 0702[理学-物理学] 

基　　金：Arief Suriadi Budiman received the B.S. degree in mechanical engineering from the Bandung Institute of Technology  Bandung  Indonesia  the M.Eng.Sc. degree in materials engineering from Monash University  Australia  and the Ph.D. degree in materials science and engineering from the Department of Materials Science and Engineering  Stanford University  CA  USA  in 2008  under the supervision of Prof. W. D. Nix (MRS Von Hippel Award 2007). At the Center for Integrated Nanotechnologies  Los Alamos  his research program involves nanomaterials for extreme environments with potential applications in advanced energy systems including for next generation nuclear power reactors. He has contributed to several high-impact journal publications  such as Acta Materialia  Applied Physics Letters  and the Journal of Electronic Materials. He is currently with the Singapore University of Technology and Design (SUTD)  Singapore  where he is leading a dynamic  young group researching nanomaterials and nanomechanics and their implications for extending the extreme limits of materials as well as their applications in the next-generation energy technologies (solar PV  extreme environments  energy storage  etc.). In SUTD  he is currently running a multimillion dollars research grant program on Solar PV and more particularly on enabling ultrathin (<80 micron) silicon solar cells sponsored by the National Research Foundation (NRF) of Singapore’s Government. He has had extensive industrial exposures through his work and has consulted with some of the biggest names in Silicon Valley and in Solar PV research and development areas—amongst others  San Jose  CA–based SunPower Corporation and Stanford  CA–based Bay Area Photovoltaics Consortium  in addition to national energy labs/academic research experiences. He has authored/co-authored several high-impact journal publications  such as Acta Materialia  Solar Energy Materials and Solar Cells  Procedia Engineering  and Materials Science Engineering A. He has also recently published a book entitled Probing Crystal Plasticity at the Nanoscales—Synchrotron X-Ray Microdiffraction (Springer  2015). He has two U.S. patents and one pending. Dr. Budiman was a recipient of the famed Berkeley Laboratory Scientific Highlights twice for his research in 2010 and 2013 (the latter was for his novel  innovative characterization technique that enables thin silicon solar PV technology). He was with the Massachusetts Institute of Technology (MIT)  Boston  MA  USA  for one year  as one of its Outstanding (Foreign) Faculty Award Recipients to conduct research in energy (solar PV  as well as next-generation energy storage/Li-ion). He has been invited to give invited lectures/seminars on solar PV/solar cells materials and technology in various top international scientific/technological conferences  such as EU PVSEC 2016/2014  PVDAYS 2015  MRS PV WORKSHOP 2014  and SOLAR PV MIT 2015. He was also a recipient of several research awards  including the MRS Graduate Silver Award 2006 and MRS Best Paper 2006 and the Prestigious Los Alamos National Laboratory (LANL) Director’s Research Fellowship to conduct top strategic research for the energy and national security missions of the LANL 

主　　题：Special issues and sections Stress control Strain control Mechanical variables control Micromechanical devices Integrated circuits Packaging 

摘      要：Stress is always an important factor in designing next generations of electronics devices and systems. It certainly has been paramount for the success of the microelectronics industry and the next generations of 3D Integrated Circuits (IC) design and packaging technologies. The papers presented in this special section were presented at the IRSP 2018 Conference.