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作者机构:Department of Materials Science and Engineering Southern University of Science and Technology Shenzhen 518055 China Department of Physics Southern University of Science and Technology Shenzhen 518055 China Beijing Institute of Aeronautical Materials AECC Beijing 100095 China Shenzhen Key Laboratory of Advanced Thin Films and Applications College of Physics and Energy Shenzhen University Shenzhen 518060 China Beijing Synchrotron Radiation Facility Institute of High Energy Physics Chinese Academy of Sciences Beijing 100049 China Shanghai Synchrotron Radiation Facility Shanghai Institute of Applied Physics Chinese Academy of Sciences Shanghai 201204 China
出 版 物:《Advanced Functional Materials》
年 卷 期:2019年第29卷第4期
主 题:band engineering fracture toughness Mg3+δSbxBi2−x room temperature thermoelectric materials