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作者机构:Univ Turku Dept Informat Technol FIN-20520 Turku Finland Turku Ctr Comp Sci Turku 20520 Finland
出 版 物:《MICROPROCESSORS AND MICROSYSTEMS》 (微处理机与微型系统)
年 卷 期:2011年第35卷第7期
页 面:603-612页
核心收录:
学科分类:0808[工学-电气工程] 08[工学] 0812[工学-计算机科学与技术(可授工学、理学学位)]
基 金:Turku Center for Computer Science
主 题:Network-on-Chip 3D IC design H.264 Coding Data parallel
摘 要:In this paper, we implement, analyze and compare different Network-on-Chip (NoC) architectures aiming at higher efficiencies for MPEG-4/H.264 coding. Two-dimensional (2D) and three-dimensional (3D) NoCs based on Non-Uniform Cache Access (NUCA) are analyzed. We present results using a full system simulator with realistic workloads. Experiments show the average network latencies in two 3D NoCs are reduced by 28% and 34% respectively, comparing with 20 design. It is also shown that heat dissipation is a trade-off in improving performance of 3D chips. Our analysis and experiment results provide a guideline to design efficient 3D NoCs for data parallel H.264 coding applications. Crown Copyright (C) 2011 Published by Elsevier B.V. All rights reserved.