版权所有:内蒙古大学图书馆 技术提供:维普资讯• 智图
内蒙古自治区呼和浩特市赛罕区大学西街235号 邮编: 010021
作者机构:Toshiba Research and Development Center Kawasaki Japan Department of Electrical Engineering and Electronics Aoyama Gakuin University Tokyo Japan
出 版 物:《IEEE TRANSACTIONS ON MAGNETICS》 (IEEE Trans Magn)
年 卷 期:1995年第31卷第6期
页 面:2666-2668页
核心收录:
学科分类:0808[工学-电气工程] 08[工学] 0702[理学-物理学]
主 题:Fabrication Soft magnetic materials Collimators Sputtering Filling Substrates Magnetic films Materials testing Morphology Sputter etching
摘 要:Low-pressure collimation sputtering was applied to trench filling with soft magnetic materials. Collimation and substrate bias were found effective to fill the trenches with a uniform film. NiFe and CoZrNb were tested as soft magnetic materials, and it was found that NiFe was suitable for the process. Stripes of NiFe about two micron wide and one micron high, and with excellent morphology, were fabricated inside trenches by combining collimation sputtering with an etch-back process.