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4D Electronic Systems: Transformable, Freestanding 3D Mesostructures Based on Transient Materials and Mechanical Interlocking (Adv. Funct. Mater. 40/2019)
作者机构：Center for Bio‐Integrated Electronics Northwestern University Evanston IL 60208 USA Department of Mechanical Engineering Department of Civil and Environmental Engineering Department of Materials Science and Engineering Northwestern University Evanston IL 60208 USA School of Aeronautic Science and Engineering Beihang University Beijing 100191 P. R. China School of Chemical Engineering Sungkyunkwan University (SKKU) Suwon 16419 Republic of Korea Frederick Seitz Materials Research Laboratory Department of Materials Science and Engineering University of Illinois at Urbana–Champaign Urbana IL 61801 USA Center for Bio‐Integrated Electronics Department of Mechanical Engineering Department of Civil and Environmental Engineering Department of Materials Science and Engineering Northwestern University Evanston IL 60208 USA Center for Flexible Electronics Technology Applied Mechanics Laboratory Department of Engineering Mechanics Tsinghua University Beijing 100084 P. R. China Department of Materials Science and Engineering Biomedical Engineering Neurological Surgery Chemistry Mechanical Engineering Electrical Engineering and Computer Science Simpson Querrey Institute and Feinberg Medical School Center for Bio‐Integrated Electronics Northwestern University Evanston Evanston IL 60208 USA
出 版 物：《Advanced Functional Materials》
年 卷 期：2019年第29卷第40期
主 题：3D mesostructure 4D structure freestanding microelectronics transformable
