Improved thermal conductivity of epoxy resin by graphene-nickel three-dimensional filler

作     者：Yanjie Liu Jiangyin Lu Yanbin Cui 

作者机构：State Key Laboratory of Multiphase Complex SystemInstitute of Process EngineeringChinese Academy of SciencesBeijing 100190China Zhengzhou Institute of Emerging Industrial TechnologyZhengzhouHenan 450000China Key Laboratory of Oil&Gas Fine ChemicalsMinistry of EducationCollege of Chemistry and Chemical EngineeringXinjiang UniversityUrumqi 830046China Dalian National Laboratory for Clean EnergyDalian 116023China 

出 版 物：《Carbon Resources Conversion》 (碳资源转化（英文）)

年 卷 期：2020年第3卷第1期

页      面：29-35页

核心收录：

学科分类：08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 

基　　金：the Fund of State Key Laboratory of Multiphase Complex Systems(No.MPCS-2019-A-03) Center for Mesoscience(No.COM2016A003) Institute of Process Engineering,and DNL Cooperation Fund(No.DNL180304),Chinese Academy of Sciences 

主　　题：Epoxy resin Graphene Ni foam Thermal conductivity Composite 

摘      要：Owing to high thermal conductivity,carbon nanotube and graphene have been used as nanofillers to improve the thermal conductivity of ***,the agglomeration of nanofillers in polymer inhibits their applications in improving the thermal conductivity of *** overcome this problem,graphene was grown on Ni foam by chemical vapor deposition in this *** graphene-nickel three-dimensional filler was added into epoxy resin to improve the thermal conductivity of epoxy *** foam can prevent the agglomeration of graphene in epoxy resin and a thermally conductive network by graphene and Ni foam was formed in epoxy *** adding graphene-nickel three-dimensional filler into epoxy resin,the thermal conductivity of graphene-nickel/epoxy composite can reach up to 2.6549 W⋅m^(-1)⋅k^(-1),which was 9 times higher than that of raw epoxy resin.