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内蒙古自治区呼和浩特市赛罕区大学西街235号 邮编: 010021
作者机构:Applied Mechanics Laboratory Department of Engineering Mechanics Center for Flexible Electronics Technology Tsinghua University Beijing 100084 P. R. China Departments of Mechanical Engineering Northwestern University Evanston IL 60208 USA The State Key Laboratory for Manufacturing and Systems Engineering School of Mechanical Engineering Xi'an Jiaotong University Xi'an 710049 P. R. China Center for Bio‐Integrated Electronics Northwestern University Evanston IL 60208 USA Department of Physics Tsinghua University Beijing 100084 P. R. China Departments of Civil and Environmental Engineering Mechanical Engineering and Materials Science and Engineering Center for Bio‐Integrated Electronics Northwestern University Evanston IL 60208 USA Department of Materials Science and Engineering Biomedical Engineering Neurological Surgery Chemistry Mechanical Engineering Electrical Engineering and Computer Science Simpson Querrey Institute and Feinberg Medical School Center for Bio‐Integrated Electronics Northwestern University Evanston IL 60208 USA
出 版 物:《Advanced Materials》
年 卷 期:2020年第32卷第14期
学科分类:08[工学] 0805[工学-材料科学与工程(可授工学、理学学位)] 080502[工学-材料学]
主 题:3D assembly 3D mesostructures analytic modeling inverse design