版权所有:内蒙古大学图书馆 技术提供:维普资讯• 智图
内蒙古自治区呼和浩特市赛罕区大学西街235号 邮编: 010021
作者机构:Institute of Physics Chinese Academy of Sciences 100190 Beijing China. Songshan Lake Materials Laboratory 523808 Dongguan China. Department of Physics and Beijing Key Laboratory of Optoelectronic Functional Materials & Micro-Nano Devices Renmin University of China 100872 Beijing China. School of Materials Science and Engineering Ulsan National Institute of Science and Technology (UNIST) Ulsan 44919 Republic of Korea. School of Information and Electronics MIIT Key Laboratory for Low-Dimensional Quantum Structure and Devices Beijing Institute of Technology 100081 Beijing China. College of Engineering Peking University 100871 Beijing China. School of Physical Science and Technology Shanghai Tech University 201210 Shanghai China. University of Chinese Academy of Sciences 100049 Beijing China. Institute of Microelectronics of Chinese Academy of Sciences 100029 Beijing China. Department of Mechanical and Materials Engineering University of Nebraska-Lincoln Lincoln NE 68588 United States. Department of Electrical and Computer Engineering University of Nebraska-Lincoln Lincoln NE 68588 United States. psutter@unl.edu. Songshan Lake Materials Laboratory 523808 Dongguan China. wji@***. Institute of Physics Chinese Academy of Sciences 100190 Beijing China. xjzhou@***. Songshan Lake Materials Laboratory 523808 Dongguan China. xjzhou@***. University of Chinese Academy of Sciences 100049 Beijing China. xjzhou@***. Institute of Physics Chinese Academy of Sciences 100190 Beijing China. hjgao@***. University of Chinese Academy of Sciences 100049 Beijing China. hjgao@***.
出 版 物:《Nature communications》
年 卷 期:2020年第11卷第1期
页 面:2938页
摘 要:An amendment to this paper has been published and can be accessed via a link at the top of the paper.