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检索条件"任意字段=13th IEEE Symposium on Design and Diagnostics of Electronic Circuits and Systems"
683 条 记 录,以下是411-420 订阅
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Effcient Approaches to Overcome Non-Convexity Issues in Analog design Automation
Effcient Approaches to Overcome Non-Convexity Issues in Anal...
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13th International symposium on Quality electronic design (ISQED)
作者: Maji, Supriyo Mandal, Pradip Indian Inst Technol Dept Elect & Elect Commun Engn Kharagpur 721302 W Bengal India
We propose two approaches to overcome limitation of convex programming technique for analog design automation. Analog design performance constraints are cast in posynomial inequality format for suitability into convex... 详细信息
来源: 评论
Process Variation Tolerant 9T SRAM Bitcell design
Process Variation Tolerant 9T SRAM Bitcell Design
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13th International symposium on Quality electronic design (ISQED)
作者: Reddy, G. K. Jainwal, Kapil Singh, Jawar Mohanty, Saraju P. Jaypee Univ Engn & Technol Dept Elect & Commun Engn Raghogarh India Ind Inst Informat Technol Design & Mfg Dept Elect & Commun Engn Jabalpur India Univ North Texas Dept Comp Sci & Engn Denton TX 76203 USA
In this paper, a nine-transistor (9T) Static Random Access Memory (SRAM) bitcell for the low voltage and energy constraint applications is proposed. It is well known that in sub-threshold regime, reliability and proce... 详细信息
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Robust Metastability-based TRNG design in Nanometer CMOS with Sub-Vdd Pre-charge and Hybrid Self-calibration
Robust Metastability-based TRNG Design in Nanometer CMOS wit...
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13th International symposium on Quality electronic design (ISQED)
作者: Suresh, Vikram B. Burleson, Wayne P. Univ Massachusetts Dept Elect & Comp Engn Amherst MA 01003 USA
In this work, we study the impact of sub-vdd pre-charge operation of metastability-based True Random Number Generator (TRNG) and propose a hybrid self-calibration to improve the statistics of the TRNG in the presence ... 详细信息
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Metamodel-Assisted Ultra-Fast Memetic Optimization of a PLL for WiMax and MMDS Applications
Metamodel-Assisted Ultra-Fast Memetic Optimization of a PLL ...
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13th International symposium on Quality electronic design (ISQED)
作者: Garitselov, Oleg Mohanty, Saraju P. Kougianos, Elias Okobiah, Oghenekarho Univ N Texas NanoSyst Design Lab Denton TX 76203 USA
With CMOS technologies progressing deeper into the nano-scale domain the design of analog and mixed-signal components is becoming very challenging. the presence of parasitics and the complexity of calculations involve... 详细信息
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Low Complexity Cross Parity Codes for Multiple and Random Bit Error Correction
Low Complexity Cross Parity Codes for Multiple and Random Bi...
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13th International symposium on Quality electronic design (ISQED)
作者: Poolakkaparambil, Mahesh Mathew, Jimson Jabir, Abusaleh M. Mohanty, Saraju P. Oxford Brookes Univ Dept Comp Sci & Elect Oxford OX3 0BP England Univ Bristol Dept Comp Sci Bristol BS8 1TH Avon England Univ North Texas Dept Comp Sci & Engn Denton TX 76203 USA
Error detection and correction which has been used in communication and memory design is becoming increasingly important in fault tolerant logic circuit design. As a result of the aggressive technology scaling, the cu... 详细信息
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Physical-design-Friendly Hierarchical Logic Built-In Self-Test - A Case Study
Physical-Design-Friendly Hierarchical Logic Built-In Self-Te...
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13th International symposium on Quality electronic design (ISQED)
作者: Nelson, Kelvin Shanmugavadivelu, Jaga Mekkoth, Jayanth Ghanta, Venkat Wu, Jun Zhuang, Fe Chao, Hao-Jan Wu, Shianling Rao, Jie Yu, Lizhen Wang, Laung-Terng Cisco Syst 175 W Tasman Dr San Jose CA 95134 USA Cisco Syst Shanghai Peoples R China SynTest Technol Sunnyvale CA 94086 USA
this paper describes an application of a physical-design-friendly hierarchical logic built-in self-test (BIST) architecture and validation methodology on a networking system-on-chip (SOC) design. the design consists o... 详细信息
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design of an Efficient NoC Architecture using Millimeter-Wave Wireless Links
Design of an Efficient NoC Architecture using Millimeter-Wav...
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13th International symposium on Quality electronic design (ISQED)
作者: Deb, Sujay Chang, Kevin Ganguly, Amlan Yu, Xinmin Teuscher, Christof Pande, Partha Heo, Deukhyoun Belzer, Benjamin Washington State Univ Pullman WA 99164 USA Rochester Inst Technol Rochester NY USA Portland State Univ Portland OR USA
the Network-on-Chip (NoC) is an enabling technology to integrate large numbers of embedded cores on a single die. Traditional multi-core designs based on the NoC paradigm suffer from high latency and power dissipation... 详细信息
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History & Variation Trained Cache (HVT-Cache): A Process Variation Aware and Fine Grain Voltage Scalable Cache with Active Access History Monitoring
History & Variation Trained Cache (HVT-Cache): A Process Var...
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13th International symposium on Quality electronic design (ISQED)
作者: Sasan, Avesta Homayoun, Houman Amiri, Kiarash Eltawil, Ahmed Kudahi, Fadi Univ Calif Irvine Dept Elect & Comp Engn Irvine CA 92717 USA Univ Calif San Diego Dept Comp Sci & Engn San Diego CA USA
Process variability and energy consumption are the two most formidable challenges facing the semiconductor industry nowadays. To combat these challenges, we present in this paper the "History and Variation Traine... 详细信息
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Critical Area Driven Dummy Fill Insertion to Improve Manufacturing Yield
Critical Area Driven Dummy Fill Insertion to Improve Manufac...
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13th International symposium on Quality electronic design (ISQED)
作者: Dhumane, Nishant Kundu, Sandip Univ Massachusetts ECE Dept Amherst MA 01003 USA
Non-planar surface may cause incorrect transfer of patterns during lithography. In today's IC manufacturing, chemical mechanical polishing (CMP) is used for topographical planarization. Since polish rates for meta... 详细信息
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Understanding, Modeling, and Detecting Pooling Hotspots in Copper CMP
Understanding, Modeling, and Detecting Pooling Hotspots in C...
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13th International symposium on Quality electronic design (ISQED)
作者: Gower-Hall, Aaron Gbondo-Tugbawa, Tamba Weng, JenPin Tseng, Wei-tsu Economikos, Laertis Yanagisawa, Toshiaki Bashaboina, Pavan Greco, Stephen Cadence Design Syst San Jose CA 94088 USA IBM Semicond Res & Dev Ctr Hopewell Jct NY 12533 USA
Multi-step Chemical Mechanical Polishing (CMP) has been used in copper interconnect fabrication for more than a decade. During this time, advances in both the CMP-based damascene manufacturing processes and in the des... 详细信息
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