this Volume 4764 of the conference proceedings contains 32 papers. Topics discussed include next generation masks, mask applications, pattern generation, materials and processes, enhanced techniques and data processin...
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this Volume 4764 of the conference proceedings contains 32 papers. Topics discussed include next generation masks, mask applications, pattern generation, materials and processes, enhanced techniques and data processing, metrology, inspection and repair.
this Volume 5148 of the conference proceedings contains 33 papers. Topics discussed include optical proximity correction, mask industry, metrology, defect printability and repair, inspection, data flow and process aut...
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this Volume 5148 of the conference proceedings contains 33 papers. Topics discussed include optical proximity correction, mask industry, metrology, defect printability and repair, inspection, data flow and process automation and mask optimization.
the proceedings contains 26 papers from the 20theuropeanconference on masktechnology for integratedcircuits and microcompounds. Topics discussed include: determining the transfer function of a mask fabrication pro...
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the proceedings contains 26 papers from the 20theuropeanconference on masktechnology for integratedcircuits and microcompounds. Topics discussed include: determining the transfer function of a mask fabrication process;towards systematic CD process control for e-beam lithography;optimized processes and absorber-stack materials for EUV masks;investigation of Cr etch chamber seasoning;metrological characterization of new CD photomask standards;dynamic mask defects in hot embossing lithography and predicting microfluidic response during immersion lithography scanning.
the EFQM Management Self-Assessment was applied to mask manufacturing and was found to be the driving process for business improvements at the mask shop. It offered an opportunity to learn about the organisation's...
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ISBN:
(纸本)0819431397
the EFQM Management Self-Assessment was applied to mask manufacturing and was found to be the driving process for business improvements at the mask shop. It offered an opportunity to learn about the organisation's strengths and especially the areas where improvement was necessary.
the european Foundation of Quality Management (EFQM) self-assessment is a comprehensive, systematic and regular review of an organization's activities and results referenced against a model of business excellence....
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the european Foundation of Quality Management (EFQM) self-assessment is a comprehensive, systematic and regular review of an organization's activities and results referenced against a model of business excellence. the self-assessment process allows the organization to discern clearly its strength and areas in which improvements can be made and culminates in planned improvement actions which are then monitored for progress. the EFQM self-assessment was applied to mask manufacturing and was found to be the driving process for business improvements at the mask shop. It offered an opportunity to learn about the organization's strength and especially the areas where improvement was necessary.
MGS is a layout postprocessor software including a fracturing engine for Leica's ZBA e-beam writers. Withthe ZBA series including the new ZBA300 and its ability to write submicrometer masks for advanced technolog...
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ISBN:
(纸本)0819431397
MGS is a layout postprocessor software including a fracturing engine for Leica's ZBA e-beam writers. Withthe ZBA series including the new ZBA300 and its ability to write submicrometer masks for advanced technologies two main tasks have to be mastered in data preparation: 1. Processing of large and dense layouts. 2. Contribution to increased mask quality by optimized fracturing. these challenges are not restricted to the ZBA tools only;on the contrary they are of general interest for data preparation.
the requirements of the 0.18 mu m and 0.25 mu m technologies lead to advanced specifications for the mask making technology in terms of pattern placement metrology, tighter than 52nm (3s) for the 0.25 mu m generation ...
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ISBN:
(纸本)0819431397
the requirements of the 0.18 mu m and 0.25 mu m technologies lead to advanced specifications for the mask making technology in terms of pattern placement metrology, tighter than 52nm (3s) for the 0.25 mu m generation and around 35nm (3s) for the next 0.18 mu m generation. In addition, the tremendous demand regarding cycle time reduction, performance to delivery schedule, and technical complexity on products impose to the mask manufacturer like Dupont Photomasks Inc. (DPI) the necessity to mix and match products between all the DPI sites. From this perspective, the matching of all the pattern placement metrology tools of all DPI production sites is mandatory. In order to control the tight specifications, the strategy for metrology is to implement a unique grid for registration on a world wide base at DPI and to calibrate all metrology tools and all writing tools to this standard grid. All investigations were performed on the LEICA LMS IPRO tools using the new correction software from Leica Microsystems.
MGS is a layout postprocessor software including a fracturing engine for Leica's ZBA e-beam writers. In MGS, a new hierarchy called output hierarchy, is automatically built from the design hierarchy as it is found...
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MGS is a layout postprocessor software including a fracturing engine for Leica's ZBA e-beam writers. In MGS, a new hierarchy called output hierarchy, is automatically built from the design hierarchy as it is found in the input layout file. In all hierarchical levels of the layout input is looked for candidates to be transferred to the output hierarchy. Criteria for structure selection are, number of calls, use in array calls and dimension of structure. the goal is to achieve a 1-level output hierarchy of all disjunctive structures where one structure has the same environment at all positions where it is called.
the Ion Projection Lithography is one challenge for a semiconductor technology, starting with sub micron structures, which are beyond the facilities of conventional UV lithography. Within this field of research one of...
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ISBN:
(纸本)0819431397
the Ion Projection Lithography is one challenge for a semiconductor technology, starting with sub micron structures, which are beyond the facilities of conventional UV lithography. Within this field of research one of the most critical aspects is the development of stencil masks, because the stress formation during the various process steps affects the critical dimensions (CD) of the structures to be written. In this paper different methods for the determination of residual, stress and elastic constants of thin (< 10 mu m) membranes of doped silicon are reviewed and additionally, a novel technique is presented. First experimental results show, that they are quite different from the values of the bulk material.
the ZBA 31H+ is a variable shaped spot, vector scan electron beam lithography system operating at 20 keV. Enhancements from the previous generation system include improved deflection systems, stage metrology, pattern ...
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the ZBA 31H+ is a variable shaped spot, vector scan electron beam lithography system operating at 20 keV. Enhancements from the previous generation system include improved deflection systems, stage metrology, pattern data handling, and an address grid down to 10 nanometers. the system's specified performance enables it to produce reticles designed to support semiconductor fabrication utilizing 250 nanometer design rules and beyond, with high accuracy and productivity. the initial results from the Leica ZBA 31H+ shaped electron beam mask writer located at the Phototronics Advanced mask Shop in Manchester, England are presented.
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