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检索条件"任意字段=15th European Conference on Mask Technology for Integrated Circuits and Microcomponents"
98 条 记 录,以下是11-20 订阅
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PN and SOI wafer flow process for stencil mask fabrication
PN and SOI wafer flow process for stencil mask fabrication
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15th european conference on mask technology for integrated circuits and microcomponents
作者: Butschke, J Ehrmann, A Haugeneder, E Irmscher, M Käsmaier, R Kragler, K Letzkus, F Löschner, H Mathuni, J Rangelow, IW Reuter, C Shi, F Springer, R Inst Mikroelekt Stuttgart D-70569 Stuttgart Germany
Two process flows for the fabrication of stencil masks have been developed. the PN Wafer Flow- and the SOI Wafer Flow Process. Membranes and stencil masks out of different 6" Si base wafers with 3 mu m membrane t... 详细信息
来源: 评论
mask technology for EUV lithography
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Proceedings of SPIE - the International Society for Optical Engineering 1999年 3665卷 30-39页
作者: Bujak, M. Burkhart, S. Cerjan, C. Kearney, P. Moore, C. Prisbrey, S. Sweeney, D. Tong, W. Vernon, S. Walton, C. Warrick, A. Weber, F. Wedowski, M. Wilhelmsen, K. Bokor, J. Lawrence Livermore Natl Lab
Extreme ultraviolet lithography (EUVL) is one of the leading candidates for the next generation lithography, which will decrease critical feature size to below 100 nm within 5 years. mask fabrication is one of the key... 详细信息
来源: 评论
Initial results from a Leica ZBA31H+shaped e-beam mask writer located at the Photronics advanced mask shop in Manchester, England.
Initial results from a Leica ZBA31H+shaped e-beam mask write...
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15th european conference on mask technology for integrated circuits and microcomponents
作者: Johnson, S Marshall, P Osborne, P Doering, HJ Ehrlich, C Photron UK Ltd Manchester Lancs England
Since Production started at the Photronics site in Manchester, England, mask writing capability had been centred on laser based technology (Etec CORE/ALTA toolsets). the Manchester site has now taken delivery of it... 详细信息
来源: 评论
Development of an algorithm for monitoring of pattern fidelity on photomasks for 0.2μm technology and beyond based on light optical CD metrology tools
Development of an algorithm for monitoring of pattern fideli...
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15th european conference on mask technology for integrated circuits and microcomponents
作者: Schätz, T Hay, B Walden, L Ziegler, W Siemens AG Semicond Grp Mask Shop Munich D-8000 Munich Germany
With the ongoing shrinking of design rules, the complexity of photomasks does increase continuously. Features are getting smaller and denser, their characterization requires sophisticated procedures. Looking for the d... 详细信息
来源: 评论
PN and SOI wafer flow process for stencil mask fabrication
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Proceedings of SPIE - the International Society for Optical Engineering 1999年 3665卷 20-29页
作者: Butschke, J. Ehrmann, A. Haugeneder, E. Irmscher, M. Kaesmaier, R. Kragler, K. Letzkus, F. Loeschner, H. Mathuni, J. Rangelow, I.W. Reuter, C. Shi, F. Springer, R. Inst fuer Mikroelektronik Stuttgart Stuttgart Germany
Two process flows for the fabrication of stencil masks have been developed. the PN Wafer Flow- and the SOI Wafer Flow Process. Membranes and stencil masks out of different 6 inches Si base wafers with 3 μm membrane t... 详细信息
来源: 评论
mask definition by nanoimprint lithography
Mask definition by nanoimprint lithography
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17th european conference on mask technology for integrated circuits and microcomponents
作者: Lyebyedyev, D Scheer, HC Univ Gesamthsch Wuppertal Dept Elect & Informat Engn D-42119 Wuppertal Germany
mask definition was performed by use of nanoimprint lithography and subsequent reactive ion etching in an oxygen plasma. Polystyrene was chosen as a polymer mask material. Different features ranging from 400 nm up to ... 详细信息
来源: 评论
through the looking glass: What is on the horizon for the mask Maker?
Through the looking glass: What is on the horizon for the Ma...
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19th european conference on mask technology for integrated circuits and microcomponents
作者: Mackay, RS Eynon, BG Mathur, DP Photron Inc Austin TX 78728 USA
the future of mask industry technology is in flux. While the requirements for current and near-term lithographic capability is well understood, advanced lithography options pose a completely new set of challenges to t... 详细信息
来源: 评论
Charged particle beam induced processes and its applicability to mask repair for next generation lithographies
Charged particle beam induced processes and its applicabilit...
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17th european conference on mask technology for integrated circuits and microcomponents
作者: Koops, HWP T Nova Deutsch Telekom Technologiezentrum Darmsta D-64295 Darmstadt Germany
A comparison of the achievements of charged particle beam induced processes as published is evaluated to judge on the applicability of this technology for Next Generation Lithography mask repair. Methods for repair of... 详细信息
来源: 评论
mask CD uniformity impact during incoming quality control
Mask CD uniformity impact during incoming quality control
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18th european conference on mask technology for integrated circuits and microcomponents
作者: Villa, E Baracchi, E Rosenbusch, A Har-zvi, M Gottlib, G STMicroelect I-20041 Agrate Brianza MI Italy
the paper presents the use of the Linewidth Bias Monitor (LBM), the critical dimension (CD) uniformity mapping option of the ARIS(TM)21i die-to-database mask inspection system, for incoming quality control (IQC) in th... 详细信息
来源: 评论
Inspection of alternating PSM reticles using UV-based 365 nm reticle inspection tool
Inspection of alternating PSM reticles using UV-based 365 nm...
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18th european conference on mask technology for integrated circuits and microcomponents
作者: Rosenbusch, A Har-zvi, M Gottlib, G Etec Syst Inc Appl Mat Co Hayward CA 94545 USA
the paer presents results of a thorough study using the UV-based die-to-database mask inspection system ARIS(TM) 100i for the inspection of alternating phase shifting masks (AAPSM) designed for KrF (249nm) technology.... 详细信息
来源: 评论