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检索条件"任意字段=16th European Conference on Mask Technology for Integrated Circuits and Microcomponents"

共 97 条记录，以下是1-10 订阅

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Proceedings of SPIE: 18th european conference on mask technology for integrated circuits and microcomponents

Proceedings of SPIE: 18th European Conference on Mask Techno...

引用

18th european conference on mask technology for integrated circuits and microcomponents 1998

this Volume 4764 of the conference proceedings contains 32 papers. Topics discussed include next generation masks, mask applications, pattern generation, materials and processes, enhanced techniques and data processin... 详细信息

关键词： integrated circuit manufacture

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Proceedings: 19th european conference on mask technology for integrated circuits and microcomponents

Proceedings: 19th European Conference on Mask Technology for...

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19th european conference on mask technology for integrated circuits and microcomponents

this Volume 5148 of the conference proceedings contains 33 papers. Topics discussed include optical proximity correction, mask industry, metrology, defect printability and repair, inspection, data flow and process aut... 详细信息

关键词： masks

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20th european conference on mask technology for integrated circuits and microcomponents

20th European conference on mask technology for integrated c...

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20th european conference on mask technology for integrated Cirquits and microcomponents

the proceedings contains 26 papers from the 20th european conference on mask technology for integrated circuits and microcompounds. Topics discussed include: determining the transfer function of a mask fabrication process;towards systematic CD process control for e-beam lithography;optimized processes and absorber-stack materials for EUV masks;investigation of Cr etch chamber seasoning;metrological characterization of new CD photomask standards;dynamic mask defects in hot embossing lithography and predicting microfluidic response during immersion lithography scanning.

关键词： masks

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Ion projection lithography - progress in mask and tool technology

Ion projection lithography - progress in mask and tool techn...

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16th european conference on mask technology for integrated circuits and microcomponents

作者： Ehrmann, A Kaesmaier, R Struck, T Infineon Technol D-81541 Munich Germany

ISBN: (纸本)0819436143

Ion Projection Lithography is one of the major competitors for sub 100nm-lithography. Within the MEDEA ion projection lithography project and other activities related to it, new results in mask and tool technology have been obtained. the exposure tool is in process of being assembled, so that information of the components as the multi-cusp ion source can be given. Results from the field-composable lens electrode manufacturing and of the off-axis alignment system are to be presented. mask process technology has been improved by introduction of a multi-step trench etch technique. A stencil mask based on a 200mm wafer has been produced. In addition, the repeatability values of placement and CD measurements have been decreased. Defect inspection with optical KLA tool results give information on the current limits for stencil mask applications.

关键词： ion beam lithography stencil mask placement

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Defect printability and repair of alternating phase shift masks

Defect printability and repair of alternating phase shift ma...

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16th european conference on mask technology for integrated circuits and microcomponents

作者： Friedrich, C Verbeek, M Mader, L Crell, C Pforr, R Griesinger, UA Infineon Technol D-81609 Munich Germany

ISBN: (纸本)0819436143

this paper will start with an overview of the different defect types which can occur on alternating phase shifting masks. A test mask with programmed defects of these different types was fabricated. the defect printability was investigated using an AIMS system. these results were correlated to first printing results in the wafer-fab. the results give an overview of the requirements for an inspection and repair system for alternating phase shifting masks. In order to get a better understanding of this printability behaviour first simulations of defects using a 3-D mask simulation tool were carried out and compared to the measurements. Several examples of quartz-repairs with different qualities are presented together with the influence on the aerial image.

关键词： alternating phase shift mask defect printability repair

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mask fabrication by nanoimprint lithography using anti-sticking layers

Mask fabrication by nanoimprint lithography using anti-stick...

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16th european conference on mask technology for integrated circuits and microcomponents

作者： Schulz, H Osenberg, F Engemann, J Scheer, HC Univ Gesamthsch Wuppertal Wuppertal Germany

ISBN: (纸本)0819436143

We have studied anti-sticking layers for nanoimprint lithography using different types of polymers, thermoplastic and thermosetting ones. Typically thermosetting polymers have higher mask selectivity in a fluorocarbon dry etch process than the thermoplastic polymers, but replication into these materials is much more complicated. We observe a high tendency for the polymer to adhere to the stamp. To minimize the sticking problem a fluorocarbon coating of the stamp was tested. It was deposited in a radio frequency plasma reactor with C4F8 as a feed gas. the thickness of the coating was several nm. It was characterised by contact angle measurement, XPS and FTIR analysis. Such coatings could successfully reduce sticking effects during an imprint process.

关键词： nanoimprint lithography (NIL) anti-sticking layer plasma deposition

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Optimization of the e-beam sensitive bilayer CARL process for stencil mask making

Optimization of the e-beam sensitive bilayer CARL process fo...

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16th european conference on mask technology for integrated circuits and microcomponents

作者： Ochsenhirt, J Butschke, J Letzkus, F Höfflinger, B Irmscher, M Reuter, C Springer, R Elian, K IMS Chips D-70569 Stuttgart Germany

ISBN: (纸本)0819436143

Hardmask-less stencil mask making requires resist masks with a high aspect ratio. the bilayer CARL (chemical amplification of resist lines) process was evaluated and optimized with respect of generating irregular resist features below 180nn in a film thickness of 750nm. Especially the dry development was detailed investigated using statistical design and analysis of experiment. Processed CARL resist masks are compared with Top Surface Imaging (TSI) results. Finally, results of a deep silicon etching process using the CARL resist masks are presented.

关键词： Silicon Photoresist processing Photomasks Etching mask making Tin Line edge roughness Plasma Critical dimension metrology Statistical analysis

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Development of embedded attenuated phase-shifting mask (EAPSM) blanks for ArF lithography

Development of embedded attenuated phase-shifting mask (EAPS...

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16th european conference on mask technology for integrated circuits and microcomponents

作者： Mitsui, H Nozawa, O Ohtsuka, H Takeuchi, M Kobayashi, H Ushida, M Electroopt Co HOYA Corp Nagasaka Factory Yamanashi 4088550 Japan

ISBN: (纸本)0819436143

the embedded attenuated phase-shift mask (EAPSM) has been in practical use for i-line and deep UV lithography. In 193nm lithography, too, the EAPSM is considered to be a promising resolution enhancement technique for its simple structure and fabrication process required. We at HOYA have attempted to extend the applicability of MoSi-based EAPSM blanks to 193nm lithography, helping extend the life of the existing infrastructure for conventional EAPSM fabrication. We have completed tuning our new MoSi-based film for 193nm lithography and characterized its optical properties, chemical durability, ArF laser exposure durability and mask-making process compatibility.

关键词： reticle embedded attenuated phase-shift mask (EAPSM) 193nm lithography MoSi photomask blanks

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Experience with EFQM assessment at Siemens mask shop

Experience with EFQM assessment at Siemens mask shop

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15th european conference on mask technology for integrated circuits and microcomponents

作者： Reindl, W Steuber, S Siemens AG D-8000 Munich Germany

the EFQM Management Self-Assessment was applied to mask manufacturing and was found to be the driving process for business improvements at the mask shop. It offered an opportunity to learn about the organisation's... 详细信息

ISBN: (纸本)0819431397

关键词： european Foundation of Quality Management (EFQM) continuous improvement process management self-assessment business excellence organisation performance key processes mask shop mask manufacturing

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Modified fused silica for 157 nm mask substrates

Modified fused silica for 157 nm mask substrates

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16th european conference on mask technology for integrated circuits and microcomponents

作者： Uebbing, B Vydra, J thomas, S Takke, R Quartzglass Opt & Lamps D-63450 Hanau Germany

ISBN: (纸本)0819436143

the 1999 SIA roadmap predicts a severe acceleration of the reduction of feature sizes down to 100 nm in 2003 and further down to 70 nn in 2005, respectively. One of the most promising candidates to achieve this demanding goal is the 157 nm optical microlithography. But today there are still many uncertainties whether this technology will be ready in time for the semiconductor industry. the material for the mask substrates, for example, is regarded as one of the potential showstoppers for this generation of optical microlithography. For present generations of optical microlithography (i-line, DUV and 193 nm) fused silica is the material of choice for mask substrates. Its superior mechanical, thermal and optical properties make it an ideal substrate material. At 157 nm synthetic fused silica shows only very low transmittance. For this reason alternative materials were discussed, i.e. CaF2, MgF2 and Al2O3 But all these materials have their own drawbacks, i.e. MgF2 shows birefringence, CaF2 and MgF2 have a large thermal expansion and Al2O3 has only low transmittance due to a high impurity level. On the other hand recent developments of modified fused silica demonstrate that high transmittance values can be achieved (i.e. 80% for 1 cm path length). this, together with its excellent mechanical and thermal properties, makes fused silica the material of choice for 157 nm masks.

关键词： Silica Photomasks Absorption Optical lithography Magnesium fluoride Refractive index Fluorine Transmittance Crystals Optics manufacturing

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