咨询与建议

限定检索结果

文献类型

  • 92 篇 会议
  • 5 篇 期刊文献

馆藏范围

  • 97 篇 电子文献
  • 0 种 纸本馆藏

日期分布

学科分类号

  • 93 篇 工学
    • 78 篇 电气工程
    • 36 篇 机械工程
    • 24 篇 电子科学与技术(可...
    • 17 篇 计算机科学与技术...
    • 9 篇 软件工程
    • 7 篇 测绘科学与技术
    • 6 篇 光学工程
    • 5 篇 化学工程与技术
    • 4 篇 材料科学与工程(可...
    • 4 篇 轻工技术与工程
    • 1 篇 仪器科学与技术
    • 1 篇 信息与通信工程
    • 1 篇 航空宇航科学与技...
  • 65 篇 理学
    • 64 篇 物理学
    • 5 篇 数学
    • 4 篇 化学
    • 1 篇 地质学
  • 25 篇 医学
    • 25 篇 临床医学
  • 6 篇 管理学
    • 6 篇 管理科学与工程(可...
    • 2 篇 工商管理
  • 2 篇 法学
    • 2 篇 社会学
  • 1 篇 经济学
    • 1 篇 应用经济学

主题

  • 31 篇 photomasks
  • 15 篇 masks
  • 12 篇 lithography
  • 11 篇 etching
  • 11 篇 semiconducting w...
  • 11 篇 critical dimensi...
  • 10 篇 manufacturing
  • 10 篇 mask making
  • 10 篇 inspection
  • 8 篇 reticles
  • 6 篇 optical proximit...
  • 6 篇 silicon
  • 6 篇 photolithography
  • 6 篇 quartz
  • 5 篇 glasses
  • 5 篇 extreme ultravio...
  • 5 篇 scanning electro...
  • 5 篇 metrology
  • 5 篇 optical lithogra...
  • 4 篇 mask

机构

  • 3 篇 infineon technol...
  • 2 篇 infineon technol...
  • 2 篇 tuilaser ag d-82...
  • 2 篇 fraunhofer ims d...
  • 2 篇 imec vzw b-3001 ...
  • 2 篇 infineon technol...
  • 2 篇 inst mikrotech m...
  • 1 篇 dai nippon print...
  • 1 篇 infineon technol...
  • 1 篇 dupont photomask...
  • 1 篇 rave llc
  • 1 篇 t nova deutsch t...
  • 1 篇 ltd manchester u...
  • 1 篇 univ gesamthsch ...
  • 1 篇 siemens ag munic...
  • 1 篇 etec systems inc...
  • 1 篇 imec vzw
  • 1 篇 electroopt co ho...
  • 1 篇 dupont photomask...
  • 1 篇 computat mech ct...

作者

  • 5 篇 ehrmann a
  • 5 篇 butschke j
  • 4 篇 mathuni j
  • 4 篇 letzkus f
  • 4 篇 irmscher m
  • 4 篇 jonckheere r
  • 4 篇 kamm fm
  • 4 篇 philipsen v
  • 3 篇 scheer hc
  • 3 篇 rosenbusch a
  • 3 篇 springer r
  • 3 篇 schätz t
  • 3 篇 rau j
  • 3 篇 brück hj
  • 3 篇 struck t
  • 3 篇 aschke l
  • 2 篇 haugeneder e.
  • 2 篇 rüggeberg f
  • 2 篇 ehrmann a.
  • 2 篇 springer r.

语言

  • 97 篇 英文
检索条件"任意字段=16th European Conference on Mask Technology for Integrated Circuits and Microcomponents"
97 条 记 录,以下是11-20 订阅
排序:
Production challenges of making an EUV mask blank
Production challenges of making an EUV mask blank
收藏 引用
20th european conference on mask technology for integrated circuits and microcomponents
作者: Aschke, L Becker, H Friemel, F Leutbecher, T Olschewski, N Renno, M Rüggeberg, F Schiffler, M Schmidt, F Sobel, F Walter, K Hess, G Lenzen, F Knapp, K Schott Lithotec AG D-98617 Meiningen Germany
mask Blanks for EUV Lithography require a lot of new properties and features compared to standard COG blanks. Starting from completely new low thermal expansion substrate materials with significantly improved surface ... 详细信息
来源: 评论
Looking back: Artwork and mask making in Dresden for the East German megabit chip project
Looking back: Artwork and mask making in Dresden for the Eas...
收藏 引用
20th european conference on mask technology for integrated circuits and microcomponents
作者: Becker, HW Fraunihofer Inst Photon Mikrosyst IPMS D-01109 Dresden Germany
After the early mask making during the 1960's in Dresden has been discussed at the 19(th) EMC now the view is focused to the further mask making efforts in Dresden, where the leading East German labs for research ... 详细信息
来源: 评论
Avoidance reduction of charging effects in case of partially insufficient substrate conductivity when using ESPACER 300Z
Avoidance reduction of charging effects in case of partially...
收藏 引用
20th european conference on mask technology for integrated circuits and microcomponents
作者: Plontke, R Bettin, L Beyer, D Butschke, J Irmscher, M Koepernik, C Leibold, B Vix, A Voehringer, P Leica Microsyst Lithog Jena Germany
the aim is to apply e-beam lithography for second level imaging of Alternating Phase Shift masks (altPSM) in the 65nm node and below. Difficulties due to charging effects arise when exposing areas where the chromium a... 详细信息
来源: 评论
Effect of electrostatic chucking on EUVL mask flatness
Effect of electrostatic chucking on EUVL mask flatness
收藏 引用
20th european conference on mask technology for integrated circuits and microcomponents
作者: Mikkelson, A Engelstad, R Lovell, E Aschke, L Rüggeberg, F Sobel, F Computat Mech Ctr Madison WI 53706 USA
the International technology Roadmap for Semiconductors for Extreme Ultraviolet Lithography (EUVL) places strict requirements on the quality and flatness of the substrate and patterned mask. the SEMI EUVL mask Substra... 详细信息
来源: 评论
Measurement results on after etch resist coated features on the new Leica Microsystems' LWM270 DUV critical dimension metrology system
Measurement results on after etch resist coated features on ...
收藏 引用
20th european conference on mask technology for integrated circuits and microcomponents
作者: Whittey, J Steinberg, W Leica Microsyst Inc Oakdale CA 95361 USA
Process control in photomask manufacturing is crucial for improving and maintaining optimal yields. the LWM270DUV critical dimension (CD) measurement system is the first tool ever designed for photomask manufacturers ... 详细信息
来源: 评论
Aerial image measurement technique for today's and future 193nm lithography mask requirements
Aerial image measurement technique for today's and future 19...
收藏 引用
20th european conference on mask technology for integrated circuits and microcomponents
作者: Zibold, AM Scherübl, T Menck, A Brunner, R Greif, J Carl Zeiss SMS GmbH D-07745 Jena Germany
the Aerial Image Measurement System (AIMS(TM) [1]) for 193 nm lithography emulation has been brought into operation worldwide successfully. Adjusting optical equivalent settings to steppers/scanners the AIMS(TM) syste... 详细信息
来源: 评论
Semi-transparent isolated defects detection by die to database mask inspection using virtual scanning algorithms for subpixel resolution
Semi-transparent isolated defects detection by die to databa...
收藏 引用
20th european conference on mask technology for integrated circuits and microcomponents
作者: Avakaw, SM PLANAR KBTEM OMO Design Off Precis Elect Machine Bldg Minsk 220763 BELARUS
the paper presents the description of the new Virtual Scanning Algorithms (VSA), providing sub-pixel resolution. VSA are the algorithms developed specially for EM-6029B (Fig. 1) and EM-6329 (Fig. 2) die-to-database re... 详细信息
来源: 评论
Monitoring strategy to match the advanced fabs
Monitoring strategy to match the advanced fabs
收藏 引用
20th european conference on mask technology for integrated circuits and microcomponents
作者: Ackmann, PW Adv Mask Technol Ctr D-013330 Dresden Germany
the reduction in feature size below the exposure wavelength, the requirement for high yields, the expectation for consistent cycletime and shipment to mix, all mean that the reticle industry must be like advanced wafe... 详细信息
来源: 评论
Determining the transfer function of a mask fabrication process
Determining the transfer function of a mask fabrication proc...
收藏 引用
20th european conference on mask technology for integrated circuits and microcomponents
作者: Leunissen, LHA Philipsen, V Jonckheere, R IMEC VZW B-3001 Louvain Belgium
A mask making process is the result of data preparation (e.g., bias), patterning and etch. the effect of these steps can be simulated starting from a circuit design. the purpose of this paper is to determine the trans... 详细信息
来源: 评论
Proceedings of SPIE: 18th european conference on mask technology for integrated circuits and microcomponents
Proceedings of SPIE: 18th European Conference on Mask Techno...
收藏 引用
18th european conference on mask technology for integrated circuits and microcomponents 1998
this Volume 4764 of the conference proceedings contains 32 papers. Topics discussed include next generation masks, mask applications, pattern generation, materials and processes, enhanced techniques and data processin... 详细信息
来源: 评论