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检索条件"任意字段=16th European Conference on Mask Technology for Integrated Circuits and Microcomponents"
97 条 记 录,以下是71-80 订阅
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Effect of electrostatic chucking on EUVL mask flatness
Effect of electrostatic chucking on EUVL mask flatness
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20th european conference on mask technology for integrated circuits and microcomponents
作者: Mikkelson, A Engelstad, R Lovell, E Aschke, L Rüggeberg, F Sobel, F Computat Mech Ctr Madison WI 53706 USA
the International technology Roadmap for Semiconductors for Extreme Ultraviolet Lithography (EUVL) places strict requirements on the quality and flatness of the substrate and patterned mask. the SEMI EUVL mask Substra... 详细信息
来源: 评论
the compact excimer laser - light source for optical (mask) inspection systems
The compact excimer laser - light source for optical (mask) ...
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17th european conference on mask technology for integrated circuits and microcomponents
作者: Pflanz, T Huber, H TuiLaser AG D-82166 Munich Germany
the discharge pumped excimer laser is a gas laser providing ultra violet (UV) radiation with well defined spectral temporal and spatial properties. the fast development of excimer lasers in recent years has succeeded ... 详细信息
来源: 评论
First results from a new 248 nm CD measurement system for future mask and reticle generation
First results from a new 248 nm CD measurement system for fu...
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17th european conference on mask technology for integrated circuits and microcomponents
作者: Schlüter, G Scheuring, G Helbing, J Lehnigk, S Brück, HJ Leica Microsyst Wetzlar GmbH D-35530 Wetzlar Germany
To keep pace with continuously shrinking design rules for masks and reticles a new 248 nm CD measurement system has been developed. the step to a shorter illumination wavelength leads to a better optical resolution po... 详细信息
来源: 评论
Measurement results on after etch resist coated features on the new Leica Microsystems' LWM270 DUV critical dimension metrology system
Measurement results on after etch resist coated features on ...
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20th european conference on mask technology for integrated circuits and microcomponents
作者: Whittey, J Steinberg, W Leica Microsyst Inc Oakdale CA 95361 USA
Process control in photomask manufacturing is crucial for improving and maintaining optimal yields. the LWM270DUV critical dimension (CD) measurement system is the first tool ever designed for photomask manufacturers ... 详细信息
来源: 评论
Improvement of temperature uniformity during prebake process in mask blank production
Improvement of temperature uniformity during prebake process...
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17th european conference on mask technology for integrated circuits and microcomponents
作者: Beier, B Schubert, F Buttgereit, U Bensberg, A Schott ML GmBH D-98617 Meiningen Germany
the development in microlithography is focused on realization of feature sizes below 0.18 micrometers . this requires the reduction of defect size and density as well as the enhancement of CD performance. In blank pro... 详细信息
来源: 评论
Development of an algorithm for monitoring of pattern fidelity on photomasks for 0.2μm technology and beyond based on light optical CD metrology tools
Development of an algorithm for monitoring of pattern fideli...
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15th european conference on mask technology for integrated circuits and microcomponents
作者: Schätz, T Hay, B Walden, L Ziegler, W Siemens AG Semicond Grp Mask Shop Munich D-8000 Munich Germany
With the ongoing shrinking of design rules, the complexity of photomasks does increase continuously. Features are getting smaller and denser, their characterization requires sophisticated procedures. Looking for the d... 详细信息
来源: 评论
OPC aware mask and wafer metrology
OPC aware mask and wafer metrology
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18th european conference on mask technology for integrated circuits and microcomponents
作者: Maurer, W Wiaux, V Jonckheere, R Philipsen, V Hoffmann, T Verhaegen, S Ronse, K England, J Howard, W KLA Tencor Corp Milpitas CA 95035 USA
Lithography at its limit of resolution is a highly non-linear pattern transfer process. Typically the shapes of printed features deviate considerably from their corresponding features in the layout. this deviation is ... 详细信息
来源: 评论
Feature proximity errors on mask: Assessment results of commercially obtained reticles
Feature proximity errors on mask: Assessment results of comm...
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19th european conference on mask technology for integrated circuits and microcomponents
作者: Jonckheere, R Potoms, G Philipsen, V IMEC vzw (Belgium)
the main concern for production-oriented reticles has so far been the control of the critical dimension (CD), i.e. the CD uniformity and the CD mean-to-target. Feature linearity and overall feature size control is as ... 详细信息
来源: 评论
A system to improve the understanding of collected logistic data, to optimise cycle-time and delivery performance
A system to improve the understanding of collected logistic ...
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19th european conference on mask technology for integrated circuits and microcomponents
作者: van Rooijen, WJ Rodriguez, B Infineon Technol AG D-81609 Munich Germany
A complex production mask house faces the issue of handling and understanding the logistics information from the production process of the masks. We managed to control key performance indicators like cycle time, flow-... 详细信息
来源: 评论
Major improvements in mask CD metrology: Enhanced performance on attenuated Phase Shift masks, corner rounding measurements, and improved measurement automation
Major improvements in mask CD metrology: Enhanced performanc...
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16th european conference on mask technology for integrated circuits and microcomponents
作者: Schlueter, Gerhard Scheuring, Gerd Falk, Guenther Brueck, Hans-Juergen Schaetz, thomas Lehnigk, Sigrid Leica Microsystems Wetzlar GmbH Wetzlar Germany
With continuously shrinking design rules enhanced techniques are required in mask manufacture which require more sophisticated procedures for their characterization. As Phase Shift masks (PSM) are of growing importanc... 详细信息
来源: 评论