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17th european conference on mask technology for integrated circuits and microcomponents

作者： Pflanz, T Huber, H TuiLaser AG D-82166 Munich Germany

ISBN: (纸本)0819440396

the discharge pumped excimer laser is a gas laser providing ultra violet (UV) radiation with well defined spectral temporal and spatial properties. the fast development of excimer lasers in recent years has succeeded in designing very compact turn-key systems delivering up to 10 W of radiation at 248 nm (5 W at 193 nm and 1 W at 157 nm) with repetition rates up to 1000 Hz [1]. Experimental data on important beam properties of excimer lasers in the field of mask inspection are being presented and discussed. Relevant parameters are spectral bandwidth, energetic pulse-to-pulse stability pulse duration, beam pointing stability, beam direction stability, beam dimension, beam profile and coherence. We will compare the excimer laser with lamp sources and continuous wave (CW) lasers in the framework of these parameters. the discussion will show future opportunities of compact excimer lasers in optical inspection as well as in mask writing systems, improving resolution and throughput.

关键词： masks

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Study of removal process for buffer layer on multilayer of EUVL mask

Study of removal process for buffer layer on multilayer of E...

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17th european conference on mask technology for integrated circuits and microcomponents

作者： Hoshino, E Ogawa, T Takahashi, M Hoko, H Yamanashi, H Hirano, N Chiba, A Lee, BT Ito, M Okazaki, S NTT Telecommun Energy Labs Atsugi Res Ctr Assoc Super Adv Elect Technol Atsugi Kanagawa 2430198 Japan

ISBN: (纸本)0819440396

To obtain a stable pattern profile for the SiO2 buffer layer of an EUVL (Extreme Ultraviolet Lithography) mask, the process latitude available under actual manufacturing conditions was examined by using a conventional spin wet etcher and trying to make the etching depth as uniform as possible. Generally, wet etching uniformity depends on the sequence of the paddling and swing of the etchant nozzle. A uniformity of 1.5%, which meets manufacturing requirements, was found to be obtainable with a special nozzle. this report details a process scheme for removing the buffer layer on the multilayer of an EUVL mask, and presents a method of inspecting the buffer layer along with some simulation results on the printability of residues near the pattern edge.

关键词： masks

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Establishment of production process and assurance method for alternating phase shift masks

Establishment of production process and assurance method for...

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17th european conference on mask technology for integrated circuits and microcomponents

作者： Murai, S Koizumi, Y Kamibayashi, T Saitou, H Hoga, M Morikawa, Y Miyashita, H Dai Nippon Printing Co Ltd Semiconductor Components Operat Saitama 3568507 Japan

ISBN: (纸本)0819440396

Alternating phase shift masks (AltPSMs) are effective in seducing MEF. However, AltPSMs have been used in device development, not in production, because phase-defect assurance has not been sufficient. An assurance method for 180- and 150-nm rule AltPSMs was established by the use of both MD-2000 and KLA/STARlight. We have started production of defect-free AltPSMs with quartz etched shifters and single trench structure s by a two-step quartz etching process, which has an advantage of low phase-defect density.

关键词： alternating phase shift mask phase-defect detection quartz etching process AIMS simulation

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First results from a new 248 nm CD measurement system for future mask and reticle generation

First results from a new 248 nm CD measurement system for fu...

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17th european conference on mask technology for integrated circuits and microcomponents

作者： Schlüter, G Scheuring, G Helbing, J Lehnigk, S Brück, HJ Leica Microsyst Wetzlar GmbH D-35530 Wetzlar Germany

ISBN: (纸本)0819440396

To keep pace with continuously shrinking design rules for masks and reticles a new 248 nm CD measurement system has been developed. the step to a shorter illumination wavelength leads to a better optical resolution power resulting in an improved CD linearity compared to systems using white light or I-line illumination for imaging. An overview of the system configuration is presented and first results of the improved optical performance as well as CD linearity and CD repeatability data are shown.

关键词： Deep ultraviolet Imaging systems Critical dimension metrology Reticles Inspection Optical resolution Cameras Ultraviolet radiation Image resolution Microscopes

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Improvement of temperature uniformity during prebake process in mask blank production

Improvement of temperature uniformity during prebake process...

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17th european conference on mask technology for integrated circuits and microcomponents

作者： Beier, B Schubert, F Buttgereit, U Bensberg, A Schott ML GmBH D-98617 Meiningen Germany

ISBN: (纸本)0819440396

the development in microlithography is focused on realization of feature sizes below 0.18 micrometers . this requires the reduction of defect size and density as well as the enhancement of CD performance. In blank production the CD uniformity is mainly influenced by resist thickness uniformity and temperature uniformity during prebake. this poster evaluates the impact of prebake process on CD performance. Best CD values are 10 nm range presently. Looking on the bake process of ZEP7000 at 200 degree(s)C a temperature difference of 1 K leads to a CD variation of 3.5 nm up to 7.9 nm. the work investigates the influence of an open and a semi open hotplate configuration on the blank surface temperature distribution during prebake process.

关键词： Critical dimension metrology Convection Infrared cameras Photomasks Semiconducting wafers Silicon Aluminum Cameras Optical lithography Reflection

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Experience with EFQM assessment at Siemens mask shop

Experience with EFQM assessment at Siemens mask shop

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15th european conference on mask technology for integrated circuits and microcomponents

作者： Reindl, W Steuber, S Siemens AG D-8000 Munich Germany

the EFQM Management Self-Assessment was applied to mask manufacturing and was found to be the driving process for business improvements at the mask shop. It offered an opportunity to learn about the organisation's... 详细信息

ISBN: (纸本)0819431397

关键词： european Foundation of Quality Management (EFQM) continuous improvement process management self-assessment business excellence organisation performance key processes mask shop mask manufacturing

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Experience with EFQM assessment at Siemens mask shop

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Proceedings of SPIE - the International Society for Optical Engineering 1999年 3665卷 150-165页

作者： Reindl, Werner Steuber, Siegfried Siemens AG Munich Germany

the european Foundation of Quality Management (EFQM) self-assessment is a comprehensive, systematic and regular review of an organization's activities and results referenced against a model of business excellence. the self-assessment process allows the organization to discern clearly its strength and areas in which improvements can be made and culminates in planned improvement actions which are then monitored for progress. the EFQM self-assessment was applied to mask manufacturing and was found to be the driving process for business improvements at the mask shop. It offered an opportunity to learn about the organization's strength and especially the areas where improvement was necessary.

关键词： Total quality management

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through the looking glass: What is on the horizon for the mask Maker?

Through the looking glass: What is on the horizon for the Ma...

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19th european conference on mask technology for integrated circuits and microcomponents

作者： Mackay, RS Eynon, BG Mathur, DP Photron Inc Austin TX 78728 USA

ISBN: (纸本)0819450189

the future of mask industry technology is in flux. While the requirements for current and near-term lithographic capability is well understood, advanced lithography options pose a completely new set of challenges to the mask maker. Challenges are not only process and materials related, but also include more fundamental concerns dealing with how to afford the necessary capability development. this paper identifies the issues and attempts to propose solutions to the industry's growing concerns.

关键词： Photomasks Manufacturing Lithography Extreme ultraviolet lithography Glasses mask making Pellicles Inspection Optical lithography Semiconducting wafers

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mask CD uniformity impact during incoming quality control

Mask CD uniformity impact during incoming quality control

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18th european conference on mask technology for integrated circuits and microcomponents

作者： Villa, E Baracchi, E Rosenbusch, A Har-zvi, M Gottlib, G STMicroelect I-20041 Agrate Brianza MI Italy

ISBN: (纸本)0819445312

the paper presents the use of the Linewidth Bias Monitor (LBM), the critical dimension (CD) uniformity mapping option of the ARIS(TM)21i die-to-database mask inspection system, for incoming quality control (IQC) in the wafer fab. LBM is qualified for this purposes by comparing it's quantitative results with CD measurements. masks, provided by different commercial vendors, are evaluated based on the LBM maps obtained during mask inspection. Mean-to-target and 3-sigma values are evaluated and compared.

关键词： Photomasks Critical dimension metrology Semiconducting wafers Inspection Reticles Control systems Metrology Quality systems Wafer inspection Cadmium

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Hierarchical mask data preparation and special fracturing techniques in MGS

Hierarchical mask data preparation and special fracturing te...

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15th european conference on mask technology for integrated circuits and microcomponents

作者： Bürger, B Bätz, U Kunze, K Wolf, H Fraunhofer IMS Dresden Germany

ISBN: (纸本)0819431397

MGS is a layout postprocessor software including a fracturing engine for Leica's ZBA e-beam writers. With the ZBA series including the new ZBA300 and its ability to write submicrometer masks for advanced technologies two main tasks have to be mastered in data preparation: 1. Processing of large and dense layouts. 2. Contribution to increased mask quality by optimized fracturing. these challenges are not restricted to the ZBA tools only;on the contrary they are of general interest for data preparation.

关键词： Magnesium Photomasks Algorithm development Edge roughness integrated circuit design integrated circuits Liquid crystals Lithography Sensors Structural design

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