Introduction The UV curing technology is a technique of forming a polymer structure by chain reaction of the ring structure or a doublebond by activating radical/cation the initiator after exposure UV *** general,UVcu...
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Introduction The UV curing technology is a technique of forming a polymer structure by chain reaction of the ring structure or a doublebond by activating radical/cation the initiator after exposure UV *** general,UVcuring technology can be divided into UV polymerization technique and UVcuring *** polymerization technique is similarto polymer technology to preparegeneral linear polymers,it process has the advantage that can be easy applied for of the *** curing technology is forming a three-dimensional polymer structure techniquethat is multifunctional monomers一HDDA(1，6 hexandiol diacrylate),DPHA (dipentaerithritolhexacrylate) etc一cross-linked by UV initiation.
*** The purposes of the present paper are to analyze the stress wave propagation and stress state in band scarf adhesive joints of similar and dissimilar adherends under impact tensile loadings using the 3-D finite el...
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*** The purposes of the present paper are to analyze the stress wave propagation and stress state in band scarf adhesive joints of similar and dissimilar adherends under impact tensile loadings using the 3-D finite element method(FEM)*** effects of the scarf angle,Young's modulus ratio between the dissimilar adherends,adhesive Young's modulus,adhesive thickness and the number of boned interface parts on the interface stress distributions and stress wave propagations are examined using the 3-D FEM calculations and compared with those under static tensile loadings and with the whole bonded scarf *** verification of the 3-D FEM calculations,the strains in the joints are ***,the joint strengths are predicted using elasto-plastic 3-D FEM calculations and the predicted results are then compared with the measured joint strengths.
The purposes of the present paper are to analyze the stress wave propagation and stress state in band scarf adhesive joints of similar and dissimilar adherends under impact tensile loadings using the 3-D finite elemen...
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The purposes of the present paper are to analyze the stress wave propagation and stress state in band scarf adhesive joints of similar and dissimilar adherends under impact tensile loadings using the 3-D finite element method (FEM) *** effects of thescarf angle,Young's modulus ratio between thedissimilar adherends, adhesive Young's modulus,adhesive thickness and the number of boned interface parts on the interface stressdistributions and stress wave propagations are examined using the 3-D FEM calculations and compared with those understatic tensile loadings and with the whole bonded scarf *** verification of the 3-D FEM calculations,the strains in the joints are ***,the joint strengths are predicted using elasto-plastic 3-D FEM calculationsand the predicted resultsare then compared with the measured joint strengths.
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