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The Role of 3d Laser Scanning in Historical Building Stock Analysis and Its Conceptual development by the Method of Twinning Adaptation 1

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23rd international Multidisciplinary conference on Reliability and Statistics in Transportation and Communication, RelStat 2023

作者： Chachava, Nino Lekveishvili, Malkhaz Mikadze, Giorgi Lekveishvili, Nikoloz Sulashvili, Giorgi Sulashvili, Vazha Georgian Technical University Kostava St. 77 Tbilisi Georgia NINCLP Engineering Idea Kote Abkhazi St. 18/2 Tbilisi Georgia Ltd TIMM Architects Kote Abkhazi St. 18/2 Tbilisi Georgia

ISBN: (数字)9783031535987

ISBN: (纸本)9783031535970

The rapid urbanization of historical cities in the 21st century have clearly revealed trends of high building and population density, transport infrastructure overload, pollution and the relevance of urban waste management issues in the Cities. It is acute in the policy of sustainable development of historical cities importance of multifunctional design and management through a new conceptual approach and digital technologies. The design for live able cities was developed for Tbilisi Superblocks Project through digital Twins concept built on experts’ knowledge, urban data and site archives mostly provided by 3d Laser Scanning technology [1]. The digital Twinning components – models, drawings, and Knowledge data were developed on AutoCAd, ArcGIS, Revit platforms. The research was made by the groups of design, technical support, project management and experts in close cooperation with the 3d Laser Scanning leadership. This article illustrates methods of problem solving;the forms and ways of design where five key pillars of urban development – social, transport, building, governing and historical preservation were accumulated based on 3d Laser Scanning 3d Point Cloud information, one of the main components of digital Twins framework in the Project [6]. Thus 3d Laser Scanning Methodology became crucial for bridging physical layout and virtual reality, urban research and BIM technologies. The Paper shows the importance of 3d Laser Scanning in twinning transformation for urban research in terms of project management – time, human and financial resources;identification of specific problems of 3d Laser Scanning in urban fabrics, streets, cultural heritage, landscape studies. © The Author(s), under exclusive license to Springer Nature Switzerland AG 2024.

关键词： Architectural design

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An Image Registration Technique for Brain MR Images Using Linear Transform by 3dCNN 23

An Image Registration Technique for Brain MR Images Using Li...

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23rd international conference on Control, Automation and Systems, ICCAS 2023

作者： Baba, Seitaro Kamiya, Tohru Kyushu Institute of Technology 1-1 Sensui Tobata Fukuoka Kitakyushu804-8550 Japan

ISBN: (纸本)9788993215274

In this paper, we focus on brain atrophy in Alzheimer's disease and propose a 3d image registration method of brain MR images for the purpose of calculating the atrophy rate by temporal subtraction technique. The nonlinear 3d image registration model of Stergios et al. is recombined into a linear image registration model, and image registration is performed with isotropic affine and rigid body transformations. In addition, the accuracy is improved by the Instance-specific Optimization, which performs the optimization process for each case. For the training of the model, we used pseudo-data obtained by arbitrarily linear transformation of the AdNI brain MR images. Synthetic data and actual AdNI time series data (Ad, MCI) were used for the test. The experimental results show that the addition of the optimization process improves the normalized cross-correlation (NCC) by more than 0.1. The loss function of the model is compared between Grid loss and MSE, and it is confirmed that MSE is effective for NCC. Furthermore, the output images confirm the usefulness of the image registration of the skull in the linear transformation. © 2023 ICROS.

关键词： Image registration

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FdM 3d PRINTING IN HIGH-PRESSURE OXYGEN ANd PURE NITROGEN ATMOSPHERES & EVALUATION OF MECHANICAL PROPERTIES 23

FDM 3D PRINTING IN HIGH-PRESSURE OXYGEN AND PURE NITROGEN AT...

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23rd international conference on Composite Materials, ICCM 2023

作者： Shaik, Yousuf P. Schuster, Jens Department for Applied Logistics and Polymer Sciences University of Applied Sciences Kaiserslautern Germany

3d printing is still advancing rapidly in academic and industrial research. Fused deposition modelling (FdM) is an additive manufacturing technology that uses filaments as input material. The filaments are arranged adjacent to and above each other. The bonding strength of the contact between these filaments determines the mechanical properties of FdM products. These parts have the lowest dimensional accuracy and resolution of any 3d printing technology. despite its many uses, FdM rapid prototyping is ineffective for manufacturing structural parts due to anisotropic mechanical properties. The consolidation of layers in additive manufacturing procedures does not need pressure, in contrast to traditional polymer processing techniques. This study investigates the effect of high ambient pressure on the consolidation of layers during the FdM process and their characterization of mechanical properties. To attain high strength qualities for 3d printed items as similar to injection-moulded specimens, an experimental setup was built up using a 3d printer incorporated into a customized Autoclave. A maximum temperature of 185 °C and 135 bar of pressure may both be maintained in the autoclave. Atmospheres of compressed air at 0 bar, 5 bar, 10 bar, 15 bar, and 20 bar as well as nitrogen at 5 bar were used for PLA 3d printing in the autoclave. The effects of pressure and temperature on 3d-printed samples were examined, and tensile, flexural, and Charpy tests were performed on printed specimens as well as on specimens that had been injection moulded. It could be demonstrated that autoclave preheating before to printing and autoclave pressure during printing greatly enhance layer consolidation. Increased yield strength, Young's modulus, and impact strength are produced as a result of closer contact between the layer surfaces caused by the pressure within the autoclave. Most experiments produced better results when the autoclave pressure was 15 bar. © 2023 international Committee on

关键词： 3d printing

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Semi-automatic process control for efficient refurbishment of turbine blades 23

Semi-automatic process control for efficient refurbishment o...

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23rd international conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2023

作者： Uhlmann, E. Polte, J. Mühlich, C. Mönchinger, S. Ebrahimi, P. Technische Universität Berlin Institute for Machine Tools and Factory Management IWF Germany Fraunhofer Institute for Production Systems and Design Technology IPK Germany Gestalt Robotics GmbH Germany Germany

ISBN: (纸本)9781998999132

The refurbishment of turbine blades requires the precise removal of damaged surface coatings. In manufacturing companies, this usually involves time-consuming activities such as detecting residual coatings and adapting process settings to varying turbine blade geometries. The use of automated systems therefore opens up opportunities to improve the efficiency of turbine blade refurbishment processes by replacing manual tasks. This paper presents an conceptual approach for a semi-automatic decoating process of turbine blades that integrates abrasive blasting technology into a closed loop process control system. The experimental setup consists of a robot for guiding the turbine blade in a blast machine and a nozzle system for local removal of residual coatings using abrasive material. Based on image processing the residual coatings of a turbine blade are labeled by a neural network and mapped to a 3d model of the turbine blade, which is used by a software control system to coordinate the decoating process. Using a prototype setup this paper investigates the applicability of the proposed approach and evaluates its feasibility. © 2023 Euspen Headquarters.

关键词： Turbomachine blades

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Evaluation of surface roughness and periodical layers in material jetting 23

Evaluation of surface roughness and periodical layers in mat...

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23rd international conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2023

作者： Golhin, Ali Payami Sole, Aditya Suneel Strandlie, Are Department of Manufacturing and Civil Engineering Norwegian University of Science and Technology Gjøvik2815 Norway Department of Computer Science Norwegian University of Science and Technology Gjøvik2815 Norway

ISBN: (纸本)9781998999132

Studying surface texture and morphology is essential to developing Additive Manufacturing (AM). Assessing the quality of part layer compounds in the process will assist with adjusting process parameters for optimal part quality in the manufacturing process. For this purpose, Material Jetting (MJT) system has been used to manufacture objects at various platform locations (swathes) to examine the surface morphology, including surface roughness and texture. due to the rotating disc used as the build platform, the studied parts showed a different surface morphology from parts printed using other material jetting machines. To study the surface texture, we generated high-resolution surface mesh grids after scanning the surface using a coordinate measuring machine (CMM) and a 3d scanner. The surface topography was decomposed into scan lines using a fast Fourier transform (FFT). The power spectral density (PSd) of a surface was calculated and compared to roughness to discuss the surface topography. Signal processing demonstrated that different textures can be fabricated by tuning the printing position conditions. As a result of determining the surface texture and roughness characteristics in conjunction with 3d printing parameters in the design process, it was possible to categorize the build platform regions based on their surface textures. © 2023 Euspen Headquarters.

关键词： Surface roughness

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Enhancement Three-dimensional Localization of ArUco Marker Under Photon-Starved Conditions 23

Enhancement Three-Dimensional Localization of ArUco Marker U...

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23rd international conference on Control, Automation and Systems, ICCAS 2023

作者： Ha, Jin-Ung Kim, Hyun-Woo Cho, Myungjin Lee, Min-Chul Kyushu Institute of Technology Department of Computer Science and Networks Fukuoka Iizuka820-8502 Japan School of ICT Robotics and Mechanical Engineering Iitc Hankyong National University Kyonggi-do Anseong17579 Korea Republic of

ISBN: (纸本)9788993215274

In this paper, we propose a method to improve the recognition rate of ArUco markers under photon-starved conditions by using preprocessing such as photon counting algorithm and histogram equalization to estimate the exact three-dimensional(3d) location of improved objects. In the conventional ArUco marker recognition technology, the recognition rate of ArUco markers decreases under photon-starved conditions, and the exact 3d location of the object cannot be estimated. In the conventional ArUco marker recognition technology, the photon counting algorithm can be used to estimate the 3d location of objects by recognizing ArUco markers under photon-starved conditions. However, the photon counting algorithm has the problem that the computation speed is slowed down when there are many photons to estimate, and the recognition rate of the ArUco marker is reduced when there are few photons to estimate. To solve these problems of the photon counting algorithm and improve the recognition rate of ArUco markers, we apply histogram equalization to ArUco markers with the photon counting algorithm. To verify the feasibility of the proposed method, we implement simulations using the Open Manipulator-X platform and show performance metrics such as Peak Signal-to-Noise Ratio (PSNR). © 2023 ICROS.

关键词： Photons

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Thermal expansion coefficient of Cu-Al2O3 nanocomposites by molecular dynamics simulation 23

Thermal expansion coefficient of Cu-Al2O3 nanocomposites by ...

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23rd international conference on Electronic Packaging technology (ICEPT)

作者： Zhang, Tianyu Liu, Wenkai Ju, Shenghong Shanghai Jiao Tong Univ China UK Low Carbon Coll Shanghai Peoples R China

ISBN: (数字)9781665499057

ISBN: (纸本)9781665499057

Through Silicon Via (TSV) technology is one of the mainstream 3d packaging technologies, which can improve the speed and reduce the power consumption of the chip. However, with the increasing of interconnection density, due to the mismatch between the thermal expansion coefficient (CTE) of TSV and the substrate, great thermal mechanical stress will be generated in and around the TSV during the thermal cycle manufacturing process, leading to different kinds of quality and reliability problems. In this work, the CTE of Cu-Al2O3 nanocomposites has been comprehensively investigated by using the molecular dynamics simulation. Increasing the mass fraction of Al2O3 in Cu-Al2O3 nanocomposites decreases the CTE. The uniform distribution doping has larger interfacial area, thus enhancing the binding force on matrix deformation and reducing the CTE of Cu-Al2O3 nanocomposites. Cubic particles doping has a lower CTE than spherical particles. Those results provide new insights for the Cu-filled TSV materials and application.

关键词： Thermal expansion coefficient Molecular dynamics simulation Cu-Al2O3 nanocomposites

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Remote 3d Visual Monitoring System of Kinematically Redundant (6 + 3)-dof Hybrid Parallel Mechanism Based on digital Twin 23rd

Remote 3D Visual Monitoring System of Kinematically Redundan...

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23rd IFToMM China international conference on Mechanism and Machine Science and Engineering, IFToMM CCMMS 2022

作者： Zhang, Jianqin Zhang, Xianmin Zhang, Fenhua Zheng, Ruida Xie, Tianyu Li, Hai Guangdong Province Key Laboratory of Precision Equipment and Manufacturing Technology South China University of Technology Guangdong Guangzhou510641 China

ISBN: (纸本)9789811993978

In recent years, digital twin, as an enabling technology to realize intelligent manufacturing, has attracted more and more attention, but there is relatively few landing research on it. In order to realize transparent and real-time monitoring without dead angle, this paper proposes a remote 3d visualization monitoring framework based on digital twin. According to the framework, this paper constructs a virtual model of a kinematically redundant (6 + 3)-dof hybrid parallel mechanism, and uses real-time data, which is transmitted through OPC UA protocol and Socket, to drive the virtual model to move the same as reality. This paper realizes the mapping from physical layer to virtual layer. It is hoped to provide some references for the landing application research of digital twin. © 2023, The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd.

关键词： digital storage

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Stress analysis and optimization of microscale CSP solder joint under high temperature bending compound Loading 23

Stress analysis and optimization of microscale CSP solder jo...

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23rd international conference on Electronic Packaging technology (ICEPT)

作者： Wang, Lilin Huang, Chunyue Liu, Xianjia Wu, Liye Liu, Xiaobin Zhang, Huaiquan Guilin Univ Elect Technol Sch Elect Mech Engn Guilin Peoples R China

ISBN: (数字)9781665499057

ISBN: (纸本)9781665499057

In this paper, CSP solder joints as the research target, using ANSYS software to establish 3d chip size package finite element model, the model under high temperature composite bending load finite element analysis, get the stress and strain distribution of CSP solder joints;Taking the diameter of welding ball, the height of welding ball and the height of PCB board as design variables, and the maximum stress of CSP solder joint as the target value, the experiment of three factors and three levels was established by design-Expert software. Seventeen groups of solder joint models with different levels were designed and the maximum stress of the corresponding solder joint was obtained under the condition of high temperature bending combined load. The stress distribution of CSP solder joint under the condition of high temperature bending combined load was analyzed. The response surface method was used for parameter optimization and simulation analysis. The results show that the minimum stress value of CSP solder joint combination parameters under high temperature bending combined load is the diameter of the solder ball 0.50mm, the height of the solder ball 0.40mm, the height of the PCB 1.00mm, and the optimal combination parameters are verified by simulation, and the optimal combination simulation results are better than the 17 groups of experimental simulation results. The structure optimization of microscale CSP solder joints under high temperature bending composite load was realized.

关键词： 3d packaging CSP solder joints Finite element analysis High temperature bending composite load Response surface method

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Modeling of a Sheet Beam Electron Gun with High Compression Ratio 23

Modeling of a Sheet Beam Electron Gun with High Compression ...

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23rd international Vacuum Electronics conference, IVEC 2022

作者： Li, Hongru Xu, Jin He, Hongbin Su, Zixuan Yin, Hairong Yue, Lingna Zhao, Guoqing Wang, W.X. Wei, Y.Y. University of Electronic Science and Technology of China National Key Laboratory of Science and Technology on Vacuum Electronics Chengdu610054 China

ISBN: (纸本)9781665443258

As a synthesis method, Ovcharov theory is used to rapidly design a sheet beam electron gun with potential applications in high power vacuum devices. In this paper, the 2d outlines of focusing electrode and anode using this method, were imported into CST Particle Tracking for 3d simulation. Although the optimized shape is not exactly the same as the theory result, the near-electron-beam spatial potential of the 3d model is comparable to that of the synthesis approach. Following discussing and optimizing of the structure, a sheet beam electron gun with a current density of 140 A/cm2 was presented. The voltage of the gun is 42.7kV, its current is 2A and its area compression ratio is 20.5. © 2022 IEEE.

关键词： Electron guns

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