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检索条件"任意字段=23rd ACM International Conference on 3D Web Technology"
771 条 记 录,以下是91-100 订阅
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The Role of 3d Laser Scanning in Historical Building Stock Analysis and Its Conceptual development by the Method of Twinning Adaptation  1
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23rd international Multidisciplinary conference on Reliability and Statistics in Transportation and Communication, RelStat 2023
作者: Chachava, Nino Lekveishvili, Malkhaz Mikadze, Giorgi Lekveishvili, Nikoloz Sulashvili, Giorgi Sulashvili, Vazha Georgian Technical University Kostava St. 77 Tbilisi Georgia NINCLP Engineering Idea Kote Abkhazi St. 18/2 Tbilisi Georgia Ltd TIMM Architects Kote Abkhazi St. 18/2 Tbilisi Georgia
The rapid urbanization of historical cities in the 21st century have clearly revealed trends of high building and population density, transport infrastructure overload, pollution and the relevance of urban waste manag... 详细信息
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An Image Registration Technique for Brain MR Images Using Linear Transform by 3dCNN  23
An Image Registration Technique for Brain MR Images Using Li...
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23rd international conference on Control, Automation and Systems, ICCAS 2023
作者: Baba, Seitaro Kamiya, Tohru Kyushu Institute of Technology 1-1 Sensui Tobata Fukuoka Kitakyushu804-8550 Japan
In this paper, we focus on brain atrophy in Alzheimer's disease and propose a 3d image registration method of brain MR images for the purpose of calculating the atrophy rate by temporal subtraction technique. The ... 详细信息
来源: 评论
FdM 3d PRINTING IN HIGH-PRESSURE OXYGEN ANd PURE NITROGEN ATMOSPHERES & EVALUATION OF MECHANICAL PROPERTIES  23
FDM 3D PRINTING IN HIGH-PRESSURE OXYGEN AND PURE NITROGEN AT...
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23rd international conference on Composite Materials, ICCM 2023
作者: Shaik, Yousuf P. Schuster, Jens Department for Applied Logistics and Polymer Sciences University of Applied Sciences Kaiserslautern Germany
3d printing is still advancing rapidly in academic and industrial research. Fused deposition modelling (FdM) is an additive manufacturing technology that uses filaments as input material. The filaments are arranged ad... 详细信息
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Semi-automatic process control for efficient refurbishment of turbine blades  23
Semi-automatic process control for efficient refurbishment o...
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23rd international conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2023
作者: Uhlmann, E. Polte, J. Mühlich, C. Mönchinger, S. Ebrahimi, P. Technische Universität Berlin Institute for Machine Tools and Factory Management IWF Germany Fraunhofer Institute for Production Systems and Design Technology IPK Germany Gestalt Robotics GmbH Germany Germany
The refurbishment of turbine blades requires the precise removal of damaged surface coatings. In manufacturing companies, this usually involves time-consuming activities such as detecting residual coatings and adaptin... 详细信息
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Evaluation of surface roughness and periodical layers in material jetting  23
Evaluation of surface roughness and periodical layers in mat...
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23rd international conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2023
作者: Golhin, Ali Payami Sole, Aditya Suneel Strandlie, Are Department of Manufacturing and Civil Engineering Norwegian University of Science and Technology Gjøvik2815 Norway Department of Computer Science Norwegian University of Science and Technology Gjøvik2815 Norway
Studying surface texture and morphology is essential to developing Additive Manufacturing (AM). Assessing the quality of part layer compounds in the process will assist with adjusting process parameters for optimal pa... 详细信息
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Enhancement Three-dimensional Localization of ArUco Marker Under Photon-Starved Conditions  23
Enhancement Three-Dimensional Localization of ArUco Marker U...
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23rd international conference on Control, Automation and Systems, ICCAS 2023
作者: Ha, Jin-Ung Kim, Hyun-Woo Cho, Myungjin Lee, Min-Chul Kyushu Institute of Technology Department of Computer Science and Networks Fukuoka Iizuka820-8502 Japan School of ICT Robotics and Mechanical Engineering Iitc Hankyong National University Kyonggi-do Anseong17579 Korea Republic of
In this paper, we propose a method to improve the recognition rate of ArUco markers under photon-starved conditions by using preprocessing such as photon counting algorithm and histogram equalization to estimate the e... 详细信息
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Thermal expansion coefficient of Cu-Al2O3 nanocomposites by molecular dynamics simulation  23
Thermal expansion coefficient of Cu-Al2O3 nanocomposites by ...
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23rd international conference on Electronic Packaging technology (ICEPT)
作者: Zhang, Tianyu Liu, Wenkai Ju, Shenghong Shanghai Jiao Tong Univ China UK Low Carbon Coll Shanghai Peoples R China
Through Silicon Via (TSV) technology is one of the mainstream 3d packaging technologies, which can improve the speed and reduce the power consumption of the chip. However, with the increasing of interconnection densit... 详细信息
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Remote 3d Visual Monitoring System of Kinematically Redundant (6 + 3)-dof Hybrid Parallel Mechanism Based on digital Twin  23rd
Remote 3D Visual Monitoring System of Kinematically Redundan...
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23rd IFToMM China international conference on Mechanism and Machine Science and Engineering, IFToMM CCMMS 2022
作者: Zhang, Jianqin Zhang, Xianmin Zhang, Fenhua Zheng, Ruida Xie, Tianyu Li, Hai Guangdong Province Key Laboratory of Precision Equipment and Manufacturing Technology South China University of Technology Guangdong Guangzhou510641 China
In recent years, digital twin, as an enabling technology to realize intelligent manufacturing, has attracted more and more attention, but there is relatively few landing research on it. In order to realize transparent... 详细信息
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Stress analysis and optimization of microscale CSP solder joint under high temperature bending compound Loading  23
Stress analysis and optimization of microscale CSP solder jo...
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23rd international conference on Electronic Packaging technology (ICEPT)
作者: Wang, Lilin Huang, Chunyue Liu, Xianjia Wu, Liye Liu, Xiaobin Zhang, Huaiquan Guilin Univ Elect Technol Sch Elect Mech Engn Guilin Peoples R China
In this paper, CSP solder joints as the research target, using ANSYS software to establish 3d chip size package finite element model, the model under high temperature composite bending load finite element analysis, ge... 详细信息
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Modeling of a Sheet Beam Electron Gun with High Compression Ratio  23
Modeling of a Sheet Beam Electron Gun with High Compression ...
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23rd international Vacuum Electronics conference, IVEC 2022
作者: Li, Hongru Xu, Jin He, Hongbin Su, Zixuan Yin, Hairong Yue, Lingna Zhao, Guoqing Wang, W.X. Wei, Y.Y. University of Electronic Science and Technology of China National Key Laboratory of Science and Technology on Vacuum Electronics Chengdu610054 China
As a synthesis method, Ovcharov theory is used to rapidly design a sheet beam electron gun with potential applications in high power vacuum devices. In this paper, the 2d outlines of focusing electrode and anode using... 详细信息
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