检索结果-内蒙古大学图书馆

您好，读者！请登录

内蒙古大学图书馆

首页
概况
党建
资源
服务
科研支持
- 论文收录引用证明
- 科技查新
知识产权
档案馆
帮助

咨询与建议

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

您的常用邮箱：*

您的手机号码：*

问题描述：

当前已输入0个字，您还可以输入200个字

全部搜索
期刊论文
图书
学位论文
标准
纸本馆藏
外文资源发现
数据库导航
超星发现

高级检索

时间限定

出版年份：

文献类型

图书期刊文献学位论文多媒体

馆藏选择

电子馆藏纸本馆藏

核心期刊

全部期刊 SCI 收录期刊 SSCI 收录期刊 EI 收录期刊 CSCD 收录期刊 CSSCI 收录期刊

语言

中文英文

文献类型

期刊文献图书学位论文标准纸本馆藏

帮助

文字说明：

T=题名（书名、题名），A=作者（责任者），K=主题词，P=出版物名称，PU=出版社名称，O=机构（作者单位、学位授予单位、专利申请人），L=中图分类号，C=学科分类号，U=全部字段，Y=年（出版发行年、学位年度、标准发布年）

检索规则说明：

AND代表“并且”；OR代表“或者”；NOT代表“不包含”；(注意必须大写,运算符两边需空一格)

检索范例：

范例一：(K=图书馆学 OR K=情报学) AND A=范并思 AND Y=1982-2016
范例二：P=计算机应用与软件 AND (U=C++ OR U=Basic) NOT K=Visual AND Y=2011-2016

分类表

所选分类

>> <<

限定检索结果

文献类型

766 篇 会议
5 篇 期刊文献

馆藏范围

771 篇 电子文献
0 种 纸本馆藏

日期分布

学科分类号

596 篇 工学
- 354 篇 计算机科学与技术...
- 177 篇 软件工程
- 157 篇 电气工程
- 99 篇 机械工程
- 93 篇 生物医学工程（可授...
- 89 篇 光学工程
- 78 篇 材料科学与工程（可...
- 78 篇 化学工程与技术
- 73 篇 控制科学与工程
- 71 篇 信息与通信工程
- 70 篇 生物工程
- 68 篇 轻工技术与工程
- 67 篇 电子科学与技术（可...
- 36 篇 力学（可授工学、理...
- 33 篇 仪器科学与技术
- 27 篇 土木工程
- 25 篇 动力工程及工程热...
- 25 篇 建筑学
- 23 篇 交通运输工程
268 篇 理学
- 106 篇 物理学
- 80 篇 化学
- 79 篇 数学
- 74 篇 生物学
- 18 篇 系统科学
87 篇 管理学
- 74 篇 管理科学与工程(可...
- 21 篇 图书情报与档案管...
- 18 篇 工商管理
45 篇 医学
- 45 篇 临床医学
- 36 篇 基础医学(可授医学...
- 34 篇 药学(可授医学、理...
12 篇 教育学
7 篇 法学
6 篇 经济学
2 篇 文学
2 篇 历史学
2 篇 农学
2 篇 艺术学

主题

76 篇 three-dimensiona...
28 篇 3d printers
24 篇 3d printing
20 篇 cameras
18 篇 solid modeling
17 篇 augmented realit...
17 篇 virtual reality
13 篇 visualization
12 篇 semantic web
10 篇 feature extracti...
9 篇 computational mo...
9 篇 shape
8 篇 object detection
8 篇 fabrication
8 篇 silicon
8 篇 finite element a...
8 篇 two dimensional ...
7 篇 microfluidics
7 篇 image segmentati...
7 篇 education

机构

6 篇 kyushu institute...
6 篇 department of co...
5 篇 kth royal instit...
5 篇 korea adv inst s...
5 篇 school of ict ro...
4 篇 paii inc. bethes...
4 篇 chang gung memor...
4 篇 faculty of elect...
4 篇 department of mi...
4 篇 seoul national u...
4 篇 ping an technolo...
4 篇 poznan univ econ...
4 篇 school of ict ro...
3 篇 university of sc...
3 篇 singapore univer...
3 篇 graduate school ...
3 篇 fraunhofer igd d...
3 篇 shenzhen institu...
3 篇 seoul national u...
3 篇 department of el...

作者

6 篇 min-chul lee
6 篇 hyun-woo kim
6 篇 kim hyun-woo
6 篇 lee min-chul
5 篇 myungjin cho
5 篇 xiao jing
5 篇 cho myungjin
5 篇 lu le
4 篇 flotynski jakub
4 篇 kim sarah eunkyu...
4 篇 jandura d.
4 篇 lee sangmin
4 篇 park sangwoo
3 篇 walczak krzyszto...
3 篇 andrzej napieral...
3 篇 cai jinzheng
3 篇 rosen david w.
3 篇 jastrzebska elzb...
3 篇 ma jun
3 篇 takeuchi shoji

语言

759 篇 英文
7 篇 其他
3 篇 中文
1 篇 西班牙文
1 篇 法文

检索条件"任意字段=23rd ACM International Conference on 3D Web Technology"

共 771 条记录，以下是101-110 订阅

全选清除本页清除全部题录导出标记到"检索档案"

详细简洁

排序：

Quantitative Elemental Characterization for Electroless Cu Plating Interface of Micro-via by ToF-SIMS 23

Quantitative Elemental Characterization for Electroless Cu P...

引用

23rd international conference on Electronics Packaging, ICEP 2024

作者： Nishijima, Masahiko Hsieh, Ming-Chun Zheng, Zhang Okumuara, Rieko Suetake, Aiji Yoshida, Hiroyoshi Chen, Chuantong Seto, Hiroaki Kitahara, Yuhei Hashizume, Kei Suganuma, Katsuaki Osaka University Flexible 3D System Integration Lab Sanken Japan Okuno Chemical Industries Co. Ltd. Japan

ISBN: (纸本)9784991191176

we investigated the electroless Cu plating layer of micro-vias which was prepared by two methods;a widely used (traditional) electroless Cu plating and a newly developed (OPC-FLET). We carried out the elemental characterization for these two electroless Cu plating by the time of flight secondary ions mass spectrometry (ToF-SIMS) and some elements (H, O, C and S)were quantitatively estimated by combustion method. © 2024 Japan Institute of Electronics Packaging.

关键词： Secondary ion mass spectrometry

来源：评论

学校读者我要写书评

暂无评论

Study on the liquid-solid interfacial reaction of solder micro bumps prepared by laser assisted bonding 23

Study on the liquid-solid interfacial reaction of solder mic...

引用

23rd international conference on Electronic Packaging technology (ICEPT)

作者： Chen, L. d. Wu, Y. Zhang, Z. J. Yao, H. Hu, J. W. Wang, B. Zhou, X. Xian Microelectron Res Inst Xian Peoples R China Jiangsu Univ Sci & Technol Sch Mat Sci & Engn Zhenjiang Jiangsu Peoples R China

ISBN: (数字)9781665499057

ISBN: (纸本)9781665499057

The laser assisted bonding (LAB) technology has become a replaceable soldering method for 3d packaging technology which minimizes the thermal and mechanical stress effect of the conventional reflow soldering and attracts a lot of attention. In the present work, the Sn-37Pb (wt.%) solder was soldered on the Ni-P substrate through LAB with two laser energies (6.5 mJ, 8.5 mJ) and reflow soldering, respectively. The average thickness of interfacial IMC in Sn-37Pb micro bumps after LAB at 8.5mJ is 0.85 mu m, which is higher than that (0.71 mu m) in Sn-37Pb micro bumps after LAB at 6.5mJ. An uneven and thick IMCs layer (2.29 mu m) gradually formed in reflow soldering at the Sn-37Pb/Ni-P interface compared to LAB. Subsequently, three types of micro bumps experienced liquid-solid interfacial reaction. With the liquid-solid interfacial reaction time increasing, the thickness of interfacial IMCs became thicker in three types micro bumps. The interfacial IMCs in Ni-P/Sn-37Pb (100 mu m) micro bumps soldered by reflowing (2.93 mu m) was significantly thicker than those in the in Ni-P/Sn-37Pb (100 mu m) micro bumps soldered by LAB with 6.5 mJ (1.6 mu m), and 8.5 mJ (1.90 mu m). Therefore, the laser assisted bonding (LAB) technology can effectively reduce the initial thickness of interfacial IMCs and effectively improve the reliability of mechanical properties of solder micro bumps after multiple soldering.

关键词： 3d packaging technology Micro bumps Laser assisted bonding interfacial reaction Interfacial IMC growth

来源：评论

学校读者我要写书评

暂无评论

development of Thermal Characteristics Evaluation System for Multi-Chip SiC Power Modules 23

Development of Thermal Characteristics Evaluation System for...

引用

23rd international conference on Electronics Packaging, ICEP 2024

作者： Huo, Fupeng Chen, Chuantong Zhang, Zheng Suetake, Aiji Takeshita, Kazutaka Yamaguchi, Yoshiji Momose, Yashima Suganuma, Katsuaki The Institute Of Science And Industrial Research Osaka University Flexible 3D System Integration Laboratory Osaka565-0871 Japan Yamato Scientific Co. Ltd. Tokyo104-0053 Japan

ISBN: (纸本)9784991191176

With the development trend of high power, high integration, and miniaturization of power electronics, the junction temperature has increased up to 250°C. Moreover, an integrated power module is composed of multiple chips, and its thermal field distribution is more complex than that of a single chip. Therefore, effective thermal analysis and reliability assessment of multi-chip power modules is very important. To solve this problem, our laboratory originally developed a thermal characteristics evaluation system for multi-chip SiC power modules. In this study, the new test platform was proposed. Based on finite element simulation, the thermal interference characteristics between chips were explored. © 2024 Japan Institute of Electronics Packaging.

关键词： Silicon carbide

来源：评论

学校读者我要写书评

暂无评论

2.5d SLAM Algorithm with Novel data Fusion Method Between 2d-Lidar and Camera 23

2.5D SLAM Algorithm with Novel Data Fusion Method Between 2D...

引用

23rd international conference on Control, Automation and Systems, ICCAS 2023

作者： Oh, Sang Hyeon Hwan, Kwak dong Lim, Hyun Tek Hyundai Motor Company Department of Vehicle Control Development Team 5 Gyeonggi-do18280 Korea Republic of

ISBN: (纸本)9788993215274

The SLAM algorithm has been extensively researched and has gained significant relevance in our daily lives, particularly with the advancements in robot technology and autonomous driving. Currently, SLAM can be largely divided into 2d SLAM and 3d SLAM. In the case of 2d SLAM, accurate mapping and localization of the plane can be achieved with low computational requirements. However, it has the limitation of not considering 3d information. In contrast, 3d SLAM can generate maps and perform localization in complex indoor spaces with obstacles by incorporating 3d data on objects. However, it may face challenges in real-time implementation in embedded systems due to high computational demands. In this paper, we propose a 2.5d SLAM using the Life Long Feature(LLF) algorithm. First, 2.5d SLAM is a projection of 3d camera feature points that are not perceived by the 2d-Lidar onto the 2d-Lidar plane. The transformation matrix to project camera feature to 2d-Lidar plane is calculated by optimizing least-square problem of the same points recognized by the camera and 2d-Lidar. Additionally, the LLF algorithm enables the updating and maintenance of camera feature points based on the robot's current position, even when the camera is not perceiving objects. The difference in Field Of View(FOV) between the camera and the LidAR causes the problem of being recognized as a dynamic object and removing feature points. The LLF algorithm can solve this problem even when the object is within the range of the 2d-LidAR but not visible in the camera's FOV. In experiment, we confirmed our proposed 2.5d SLAM with LLF algorithm show better performance in detecting 3d objects and Mapping than pervious 2d SLAM. © 2023 ICROS.

关键词： Cameras

来源：评论

学校读者我要写书评

暂无评论

design of High-Power S-Band Pulsed Magnetron for Linear Accelerator System 23

Design of High-Power S-Band Pulsed Magnetron for Linear Acce...

引用

23rd international Vacuum Electronics conference, IVEC 2022

作者： Anilkumar, Patibandla Pamu, dobbidi Tiwari, Tapeshwar Center for Nanotechnology Indian Institute of Technology Assam Guwahati India Centre for High Power Microwave Tube and Component Technology Sameer Guwahati Assam Guwahati India

ISBN: (纸本)9781665443258

This paper deals with design of a high-power S-band pulse magnetron capable of generating average and peak powers of 4 kW and 4 MW at an operating frequency of 2.998±0.005 GHz. The 16 vanes hole and slot type anode structure is considered for design, in which 3d PIC simulation is used for computation of output parameters, whereas ANSYS workbench is used for thermal analysis. The study shows that the resonating frequency depends on the strap dimensions, strap depth, and height. The temperature distribution on the helix-shaped heater, cathode surface, and anode are analyzed from the thermal analysis. © 2022 IEEE.

关键词： Thermoanalysis

来源：评论

学校读者我要写书评

暂无评论

EXPERIMENTAL PARAMETER IdENTIFICATION FOR 3d NONLINEAR VISCOELASTIC MATERIAL MOdEL 23

EXPERIMENTAL PARAMETER IDENTIFICATION FOR 3D NONLINEAR VISCO...

引用

23rd international conference on Composite Materials, ICCM 2023

作者： Pupure, Liva Varna, Janis Al-Maqdasi, Zainab Pakrastins, Leonids Department of structural engineering Riga Technical University Kipsalas 6A RigaLV-1048 Latvia Department of Engineering Sciences and Mathematics Lulea University of Technology University Campus LuleaSE-97751 Sweden

There is a growing demand from the industry for nonlinear 3-dimensional material models and simulation tools. Nonlinearity in material response can be attributed to different phenomena - viscoelasticity, viscoplasticity and/or damage. In previous studies, authors have looked at viscoplastic behavior in 3d and developed material models with different complexity for the 3d cases. The first model assumes that all the nonlinearity functions are direction independent, and the second model assumes direction dependency. In this study, the viscoelasticity is analyzed in the axial and lateral directions in order to investigate the applicability of those developed material models. The results show high direction independence for viscoelastic nonlinearity functions for studied high-density polyethylene with and without different amounts of graphene nanoplatelets. The obtained information will be used in ongoing work to further adjust the nonlinear material model and implement the obtained expressions in a finite element code. © 2023 international Committee on Composite Materials. All rights reserved.

关键词： Viscoelasticity

来源：评论

学校读者我要写书评

暂无评论

Investigation on rheological behavior and jet printing process of the solder pastes 23

Investigation on rheological behavior and jet printing proce...

引用

23rd international conference on Electronic Packaging technology (ICEPT)

作者： Li, Saipeng Jiang, Qinglei Wang, Xuyan Liu, Jian Nanjing Res Inst Elect Technol Nanjing 210039 Peoples R China

ISBN: (数字)9781665499057

ISBN: (纸本)9781665499057

Jet printing technology is more suitable for Surface Mount technology (SMT) to develop in high density and flexible production compared with traditional stencil printing. In recent years, domestic and foreign scholars have carried out a lot of research work in the design of lead-free solder paste components, jet printing equipment and process, and made some progress. However, due to the control theory of jet printing performance has not yet been established, which has affected the popularization and application of jet printing technology in the electronic assembly field. Investigation of solder paste used for jet printing technology and establishing the relationship between materials composition and jet printing performance will provide a reference for the design of a wider range of solder pastes suitable for jet printing technology. In this work, materials containing Sn-58Bi solder pastes were chosen, and the effects of temperature and solid phase contents on the rheological properties of viscosity, thixotropy, viscoelasticity of solder pastes were studied systematically. high speed photography method was used to track the printing process, and the morphology of the printing points was observed by VHX-5000 Superhigh magnification lens zoom 3d microscope. A certain relationship between rheology and jet printing performance of solder paste was established. The quality of the solder paste droplets was evaluated by the ratio of height to diameter of solder paste droplets.

关键词： Jet printing technology Solder paste Rheological behavior

来源：评论

学校读者我要写书评

暂无评论

On Managing Test-Time, Power, and Layer Assignment in 3d SoCs with Built-In-Self-Repair Modules

On Managing Test-Time, Power, and Layer Assignment in 3D SoC...

引用

international conference on VLSI design

作者： Sabyasachee Banerjee Subhashis Majumder Bhargab B. Bhattacharya Dept. of Computer Science and Engineering Heritage Institute of Technology Kolkata India Dept. of Computer Science and Engineering Indian Institute of Technology Kharagpur Kharagpur India

Although built-in self-repair (BISR) techniques have been widely used to improve memory yield, their applications to the testing of 3d systems-on-chip (SoC) remained primarily unexplored. In this manuscript, we present a multi-stage approach to implement BISR in 3d SoCs with an aim to (i) reduce test time by proposing a test scheduling technique satisfying given power constraints, (ii) reduce the number of BISR modules, and (iii) to place BISR circuitry in suitable layers for facilitating thermal dissipation. Experimental results on several SoC benchmarks show that our approach reduces both test time as well as the cost of BISR architecture in most cases.

关键词：

来源：评论

学校读者我要写书评

暂无评论

Effect of Phase Evolution on Inhomogeneous deformation and Fracture Behavior in Sn-Bi Solder Alloys 23

Effect of Phase Evolution on Inhomogeneous Deformation and F...

引用

23rd international conference on Electronics Packaging, ICEP 2024

作者： Liang, Shuibao Li, Wangyun Jiang, Han Guo, Zhihao Zhong, Zhihong School Of Materials Science And Engineering Hefei University Of Technology Hefei230009 China School Of Mechanical And Electrical Engineering Guilin University Of Electronic Technology Guilin541004 China Osaka University Flexible 3D System Integration Laboratory Ibaraki567-0047 Japan School Of Integrated-Circuits Anhui University Hefei230601 China Wolfson School Of Mechanical Electrical And Manufacturing Engineering Loughborough University LoughboroughLE11 3TU United Kingdom

ISBN: (纸本)9784991191176

Sn-Bi based low-temperature solders used for high-density heterogeneous integration has attracted widespread attention in recent years due to its many advantages and low-cost. However, the microstructure characteristic of the Sn-Bi solder matrix has an increasingly significant impact on the interconnect performance and reliability as the packaging density increases. In this study, a developed phase field model is employed to study the deformation and fracture behavior of Sn-Bi eutectic solder alloy. It is found that the phase distribution characteristics greatly affect the fracture path and crack growth rate, and the cracks mainly propagate along the Bi-rich phase. The phase segregation and separation of Sn-Bi solder have an important impact on the mechanical properties and failure characteristics. © 2024 Japan Institute of Electronics Packaging.

关键词： Cracks

来源：评论

学校读者我要写书评

暂无评论

A Research on Calibration of Multi-coordinates for Cooperative Robotic Grinding System 23rd

A Research on Calibration of Multi-coordinates for Cooperati...

引用

23rd IFToMM China international conference on Mechanism and Machine Science and Engineering, IFToMM CCMMS 2022

作者： Li, Cong ding, Wenzheng Zhao, Xingwei Tao, Bo School of Mechanical Science and Engineering State Key Laboratory of Digital Manufacturing Equipment and Technology Huazhong University of Science and Technology Hubei Wuhan430074 China

ISBN: (纸本)9789811993978

Robots are widely used in machining tasks for their great flexibility. In this paper, a cooperative robotic grinding system consists of a cooperative robot, a binocular camera and a 3d laser scanner. An unavoidable issue is the unknown transformation relationships between the frames of the robot and measurement equipment (robotic frame, camera frame and scanner frame). In this paper, an approach for unifying multi-equipment frames is proposed, which composes two steps calibration that calibrating the pose transformation matrices from the camera frame to robot base frame and 3d laser scanner frame to the camera frame individually. The multi-equipment frames’ unifying is achieved by converting all measured point coordinates from the camera and the scanner to the robot base frame. In the experiment, a workpiece was ground to shows the performance of the cooperative robot machining system. © 2023, The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd.

关键词： Robots

来源：评论

学校读者我要写书评

暂无评论

没有更多数据了...

全选清除本页清除全部题录导出标记到“检索档案”

共78页 << < 7 8 9 10 11 12 13 14 15 16 > >>

检索报告对象比较合并检索0

隐藏清空

合并搜索

回到顶部

执行限定条件

内容：

评分：

请选择保存的检索档案：

请选择收藏分类：

订阅名称：

通借通还

温馨提示：

图书名称：

借书校区：

取书校区：

手机号码：

邮箱地址：

一卡通帐号：

电话和邮箱必须正确填写，我们会与您联系确认。

联系人：

所在院系：

联系邮箱：

联系电话：

内蒙古自治区呼和浩特市赛罕区大学西街235号邮编: 010021

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：