we investigated the electroless Cu plating layer of micro-vias which was prepared by two methods;a widely used (traditional) electroless Cu plating and a newly developed (OPC-FLET). We carried out the elemental charac...
详细信息
The laser assisted bonding (LAB) technology has become a replaceable soldering method for 3d packaging technology which minimizes the thermal and mechanical stress effect of the conventional reflow soldering and attra...
详细信息
ISBN:
(数字)9781665499057
ISBN:
(纸本)9781665499057
The laser assisted bonding (LAB) technology has become a replaceable soldering method for 3d packaging technology which minimizes the thermal and mechanical stress effect of the conventional reflow soldering and attracts a lot of attention. In the present work, the Sn-37Pb (wt.%) solder was soldered on the Ni-P substrate through LAB with two laser energies (6.5 mJ, 8.5 mJ) and reflow soldering, respectively. The average thickness of interfacial IMC in Sn-37Pb micro bumps after LAB at 8.5mJ is 0.85 mu m, which is higher than that (0.71 mu m) in Sn-37Pb micro bumps after LAB at 6.5mJ. An uneven and thick IMCs layer (2.29 mu m) gradually formed in reflow soldering at the Sn-37Pb/Ni-P interface compared to LAB. Subsequently, three types of micro bumps experienced liquid-solid interfacial reaction. With the liquid-solid interfacial reaction time increasing, the thickness of interfacial IMCs became thicker in three types micro bumps. The interfacial IMCs in Ni-P/Sn-37Pb (100 mu m) micro bumps soldered by reflowing (2.93 mu m) was significantly thicker than those in the in Ni-P/Sn-37Pb (100 mu m) micro bumps soldered by LAB with 6.5 mJ (1.6 mu m), and 8.5 mJ (1.90 mu m). Therefore, the laser assisted bonding (LAB) technology can effectively reduce the initial thickness of interfacial IMCs and effectively improve the reliability of mechanical properties of solder micro bumps after multiple soldering.
With the development trend of high power, high integration, and miniaturization of power electronics, the junction temperature has increased up to 250°C. Moreover, an integrated power module is composed of multip...
详细信息
The SLAM algorithm has been extensively researched and has gained significant relevance in our daily lives, particularly with the advancements in robot technology and autonomous driving. Currently, SLAM can be largely...
详细信息
This paper deals with design of a high-power S-band pulse magnetron capable of generating average and peak powers of 4 kW and 4 MW at an operating frequency of 2.998±0.005 GHz. The 16 vanes hole and slot type ano...
详细信息
There is a growing demand from the industry for nonlinear 3-dimensional material models and simulation tools. Nonlinearity in material response can be attributed to different phenomena - viscoelasticity, viscoplastici...
详细信息
Jet printing technology is more suitable for Surface Mount technology (SMT) to develop in high density and flexible production compared with traditional stencil printing. In recent years, domestic and foreign scholars...
详细信息
ISBN:
(数字)9781665499057
ISBN:
(纸本)9781665499057
Jet printing technology is more suitable for Surface Mount technology (SMT) to develop in high density and flexible production compared with traditional stencil printing. In recent years, domestic and foreign scholars have carried out a lot of research work in the design of lead-free solder paste components, jet printing equipment and process, and made some progress. However, due to the control theory of jet printing performance has not yet been established, which has affected the popularization and application of jet printing technology in the electronic assembly field. Investigation of solder paste used for jet printing technology and establishing the relationship between materials composition and jet printing performance will provide a reference for the design of a wider range of solder pastes suitable for jet printing technology. In this work, materials containing Sn-58Bi solder pastes were chosen, and the effects of temperature and solid phase contents on the rheological properties of viscosity, thixotropy, viscoelasticity of solder pastes were studied systematically. high speed photography method was used to track the printing process, and the morphology of the printing points was observed by VHX-5000 Superhigh magnification lens zoom 3d microscope. A certain relationship between rheology and jet printing performance of solder paste was established. The quality of the solder paste droplets was evaluated by the ratio of height to diameter of solder paste droplets.
Although built-in self-repair (BISR) techniques have been widely used to improve memory yield, their applications to the testing of 3d systems-on-chip (SoC) remained primarily unexplored. In this manuscript, we presen...
Although built-in self-repair (BISR) techniques have been widely used to improve memory yield, their applications to the testing of 3d systems-on-chip (SoC) remained primarily unexplored. In this manuscript, we present a multi-stage approach to implement BISR in 3d SoCs with an aim to (i) reduce test time by proposing a test scheduling technique satisfying given power constraints, (ii) reduce the number of BISR modules, and (iii) to place BISR circuitry in suitable layers for facilitating thermal dissipation. Experimental results on several SoC benchmarks show that our approach reduces both test time as well as the cost of BISR architecture in most cases.
Sn-Bi based low-temperature solders used for high-density heterogeneous integration has attracted widespread attention in recent years due to its many advantages and low-cost. However, the microstructure characteristi...
详细信息
Robots are widely used in machining tasks for their great flexibility. In this paper, a cooperative robotic grinding system consists of a cooperative robot, a binocular camera and a 3d laser scanner. An unavoidable is...
详细信息
暂无评论