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检索条件"任意字段=23rd ACM International Conference on 3D Web Technology"
771 条 记 录,以下是101-110 订阅
排序:
Quantitative Elemental Characterization for Electroless Cu Plating Interface of Micro-via by ToF-SIMS  23
Quantitative Elemental Characterization for Electroless Cu P...
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23rd international conference on Electronics Packaging, ICEP 2024
作者: Nishijima, Masahiko Hsieh, Ming-Chun Zheng, Zhang Okumuara, Rieko Suetake, Aiji Yoshida, Hiroyoshi Chen, Chuantong Seto, Hiroaki Kitahara, Yuhei Hashizume, Kei Suganuma, Katsuaki Osaka University Flexible 3D System Integration Lab Sanken Japan Okuno Chemical Industries Co. Ltd. Japan
we investigated the electroless Cu plating layer of micro-vias which was prepared by two methods;a widely used (traditional) electroless Cu plating and a newly developed (OPC-FLET). We carried out the elemental charac... 详细信息
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Study on the liquid-solid interfacial reaction of solder micro bumps prepared by laser assisted bonding  23
Study on the liquid-solid interfacial reaction of solder mic...
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23rd international conference on Electronic Packaging technology (ICEPT)
作者: Chen, L. d. Wu, Y. Zhang, Z. J. Yao, H. Hu, J. W. Wang, B. Zhou, X. Xian Microelectron Res Inst Xian Peoples R China Jiangsu Univ Sci & Technol Sch Mat Sci & Engn Zhenjiang Jiangsu Peoples R China
The laser assisted bonding (LAB) technology has become a replaceable soldering method for 3d packaging technology which minimizes the thermal and mechanical stress effect of the conventional reflow soldering and attra... 详细信息
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development of Thermal Characteristics Evaluation System for Multi-Chip SiC Power Modules  23
Development of Thermal Characteristics Evaluation System for...
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23rd international conference on Electronics Packaging, ICEP 2024
作者: Huo, Fupeng Chen, Chuantong Zhang, Zheng Suetake, Aiji Takeshita, Kazutaka Yamaguchi, Yoshiji Momose, Yashima Suganuma, Katsuaki The Institute Of Science And Industrial Research Osaka University Flexible 3D System Integration Laboratory Osaka565-0871 Japan Yamato Scientific Co. Ltd. Tokyo104-0053 Japan
With the development trend of high power, high integration, and miniaturization of power electronics, the junction temperature has increased up to 250°C. Moreover, an integrated power module is composed of multip... 详细信息
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2.5d SLAM Algorithm with Novel data Fusion Method Between 2d-Lidar and Camera  23
2.5D SLAM Algorithm with Novel Data Fusion Method Between 2D...
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23rd international conference on Control, Automation and Systems, ICCAS 2023
作者: Oh, Sang Hyeon Hwan, Kwak dong Lim, Hyun Tek Hyundai Motor Company Department of Vehicle Control Development Team 5 Gyeonggi-do18280 Korea Republic of
The SLAM algorithm has been extensively researched and has gained significant relevance in our daily lives, particularly with the advancements in robot technology and autonomous driving. Currently, SLAM can be largely... 详细信息
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design of High-Power S-Band Pulsed Magnetron for Linear Accelerator System  23
Design of High-Power S-Band Pulsed Magnetron for Linear Acce...
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23rd international Vacuum Electronics conference, IVEC 2022
作者: Anilkumar, Patibandla Pamu, dobbidi Tiwari, Tapeshwar Center for Nanotechnology Indian Institute of Technology Assam Guwahati India Centre for High Power Microwave Tube and Component Technology Sameer Guwahati Assam Guwahati India
This paper deals with design of a high-power S-band pulse magnetron capable of generating average and peak powers of 4 kW and 4 MW at an operating frequency of 2.998±0.005 GHz. The 16 vanes hole and slot type ano... 详细信息
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EXPERIMENTAL PARAMETER IdENTIFICATION FOR 3d NONLINEAR VISCOELASTIC MATERIAL MOdEL  23
EXPERIMENTAL PARAMETER IDENTIFICATION FOR 3D NONLINEAR VISCO...
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23rd international conference on Composite Materials, ICCM 2023
作者: Pupure, Liva Varna, Janis Al-Maqdasi, Zainab Pakrastins, Leonids Department of structural engineering Riga Technical University Kipsalas 6A RigaLV-1048 Latvia Department of Engineering Sciences and Mathematics Lulea University of Technology University Campus LuleaSE-97751 Sweden
There is a growing demand from the industry for nonlinear 3-dimensional material models and simulation tools. Nonlinearity in material response can be attributed to different phenomena - viscoelasticity, viscoplastici... 详细信息
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Investigation on rheological behavior and jet printing process of the solder pastes  23
Investigation on rheological behavior and jet printing proce...
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23rd international conference on Electronic Packaging technology (ICEPT)
作者: Li, Saipeng Jiang, Qinglei Wang, Xuyan Liu, Jian Nanjing Res Inst Elect Technol Nanjing 210039 Peoples R China
Jet printing technology is more suitable for Surface Mount technology (SMT) to develop in high density and flexible production compared with traditional stencil printing. In recent years, domestic and foreign scholars... 详细信息
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On Managing Test-Time, Power, and Layer Assignment in 3d SoCs with Built-In-Self-Repair Modules
On Managing Test-Time, Power, and Layer Assignment in 3D SoC...
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international conference on VLSI design
作者: Sabyasachee Banerjee Subhashis Majumder Bhargab B. Bhattacharya Dept. of Computer Science and Engineering Heritage Institute of Technology Kolkata India Dept. of Computer Science and Engineering Indian Institute of Technology Kharagpur Kharagpur India
Although built-in self-repair (BISR) techniques have been widely used to improve memory yield, their applications to the testing of 3d systems-on-chip (SoC) remained primarily unexplored. In this manuscript, we presen...
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Effect of Phase Evolution on Inhomogeneous deformation and Fracture Behavior in Sn-Bi Solder Alloys  23
Effect of Phase Evolution on Inhomogeneous Deformation and F...
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23rd international conference on Electronics Packaging, ICEP 2024
作者: Liang, Shuibao Li, Wangyun Jiang, Han Guo, Zhihao Zhong, Zhihong School Of Materials Science And Engineering Hefei University Of Technology Hefei230009 China School Of Mechanical And Electrical Engineering Guilin University Of Electronic Technology Guilin541004 China Osaka University Flexible 3D System Integration Laboratory Ibaraki567-0047 Japan School Of Integrated-Circuits Anhui University Hefei230601 China Wolfson School Of Mechanical Electrical And Manufacturing Engineering Loughborough University LoughboroughLE11 3TU United Kingdom
Sn-Bi based low-temperature solders used for high-density heterogeneous integration has attracted widespread attention in recent years due to its many advantages and low-cost. However, the microstructure characteristi... 详细信息
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A Research on Calibration of Multi-coordinates for Cooperative Robotic Grinding System  23rd
A Research on Calibration of Multi-coordinates for Cooperati...
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23rd IFToMM China international conference on Mechanism and Machine Science and Engineering, IFToMM CCMMS 2022
作者: Li, Cong ding, Wenzheng Zhao, Xingwei Tao, Bo School of Mechanical Science and Engineering State Key Laboratory of Digital Manufacturing Equipment and Technology Huazhong University of Science and Technology Hubei Wuhan430074 China
Robots are widely used in machining tasks for their great flexibility. In this paper, a cooperative robotic grinding system consists of a cooperative robot, a binocular camera and a 3d laser scanner. An unavoidable is... 详细信息
来源: 评论