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ViFam: A New dataset for Fall detection Problem and Overall Analysis 23

ViFam: A New Dataset for Fall Detection Problem and Overall ...

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23rd international conference on New Trends in Intelligent Software Methodologies, Tools and Techniques, SoMeT 2024

作者： Ha, Thao V. Nguyen, Quynh T.N. Huynh, dung V. Truong, Huy Q. Tran, Quang C. Nguyen, Hien d. Nguyen, Binh T. Faculty of Mathematics and Computer Science University of Science Ho Chi Minh City Viet Nam Vietnam National University Ho Chi Minh City Viet Nam AISIA Research Lab Ho Chi Minh City Viet Nam University of Information Technology Ho Chi Minh City Viet Nam

ISBN: (纸本)9781643685380

In recent years, falls among the elderly have become a critical healthcare concern worldwide. There is more and more research every day to find ways to detect falls early, hence reducing the associated risks and improving the quality of life. Many published datasets are used to create fall detection models. However, there is still room for improvement when the datasets often face an imbalance and a lack of diversity. To solve this problem, a new dataset has been built for the fall detection problem, namely ViFam in the hope of contributing to creating a better model for fall detection. In this work, the built dataset is used for two problems: fall detection and activity recognition. They are experimented to evaluate the performance of 6 models: CNN, ResNet, ViT, 3d-CNN, and Mixture of Experts with 5 and 6 experts. Ultimately, 3d-CNN achieved the best results, with all metrics reaching higher than 0.99 for both problems. We aim to publish this dataset to contribute to the recent research on the fall detection problem. © 2024 IOS Press. All rights reserved.

关键词： computer vision deep learning fall detection

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MEVIUS: A Quadruped Robot Easily Constructed through E-Commerce with Sheet Metal Welding and Machining 23

MEVIUS: A Quadruped Robot Easily Constructed through E-Comme...

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23rd IEEE-RAS international conference on Humanoid Robots, Humanoids 2024

作者： Kawaharazuka, Kento Inoue, Shintaro Suzuki, Temma Yuzaki, Sota Sawaguchi, Shogo Okada, Kei Inaba, Masayuki The University of Tokyo Graduate School of Information Science and Technology Department of Mechano-Informatics 7-3-1 Hongo Bunkyo-ku Tokyo Japan

ISBN: (纸本)9798350373578

Quadruped robots that individual researchers can build by themselves are crucial for expanding the scope of research due to their high scalability and customizability. These robots must be easily ordered and assembled through ecommerce or dIY methods, have a low number of components for easy maintenance, and possess durability to withstand experiments in diverse environments. Various quadruped robots have been developed so far, but most robots that can be built by research institutions are relatively small and made of plastic using 3d printers. These robots cannot withstand experiments in external environments such as mountain trails or rubble, and they will easily break with intense movements. Although there is the advantage of being able to print parts by yourself, the large number of components makes replacing broken parts and maintenance very cumbersome. Therefore, in this study, we develop a metal quadruped robot MEVIUS, that can be constructed and assembled using only materials ordered through e-commerce. We have considered the minimum set of components required for a quadruped robot, employing metal machining, sheet metal welding, and off-the-shelf components only. Also, we have achieved a simple circuit and software configuration. Considering the communication delay due to its simple configuration, we experimentally demonstrate that MEVIUS, utilizing reinforcement learning and Sim2Real, can traverse diverse rough terrains and withstand outside experiments. All hardware and software components can be obtained from ***/haraduka/mevius. © 2024 IEEE.

关键词： Multipurpose robots

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Industrial Teleassistance with the Help of Augmented Reality 23

Industrial Teleassistance with the Help of Augmented Reality

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23rd RoEduNet conference: Networking in Education and Research, RoEduNet 2024

作者： Bobeica, Valentin Popescu, dan Angelescu, Nicoleta Ichim, Loretta National University of Science and Technology Politehnica Bucharest Faculty of Automatic Control and Computer Science Bucharest Romania Valahia University of Targoviste Faculty of Electrical Engineering Electronics and Information Technology Targoviste Romania

ISBN: (纸本)9798331540388

This paper details the integration of augmented reality (AR) in a new factory, focusing on enhancing maintenance efficiency and optimization. The innovative approach involves combining AR technology, an Android application, and Siemens PLCs (Programmable Logic Controller), for efficient automation. The robustness of the PLC enables seamless integration within manufacturing environments, accommodating diverse programming paradigms. The software aspect features Human Machine Interface (HMI) configuration using Siemens' WinCC software, offering dynamic visualizations, alarm handling, and data logging. WinCC's scalability suits applications of varying sizes. The HMI architecture is designed for easy parameter display. The Android application, developed with Java and Python, leverages their respective strengths in Android app development and image processing. data exchange is facilitated by OPC-UA, supporting multiple programming languages for seamless communication. The AR Teleassistance is highlighted as a revolutionary solution, fostering real-Time communication among global experts, technicians, and operators. Beyond gaming origins, AR teleassistance enhances efficiency in various sectors, minimizing downtime and facilitating global knowledge transfer. The integration of Teleassistance promotes effective collaboration between human expertise and automated systems, crucial for optimal performance in modern industrial settings. Continuous development is suggested through the addition of more 3d mechanical drawings and real-Time stock information for parts in the application, aiming for future optimization and performance enhancement. © 2024 IEEE.

关键词： augmented reality data exchange global knowledge image processing manufacturing environment production processes smart industrial

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FUSEd FILAMENT FABRICATION 3d PRINTING OF CONTINUOUS CARBON FIBER REINFORCEd THERMOPLASTIC: RELATION BETWEEN CROSS-POINTS dISTRIBUTION ANd TENSILE PERFORMANCE 23

FUSED FILAMENT FABRICATION 3D PRINTING OF CONTINUOUS CARBON ...

引用

23rd international conference on Composite Materials, ICCM 2023

作者： Wang, Gongshuo Wang, Fuji Guan, Shouyan Wang, Hongquan Zhou, Jianming Fu, Rao School of Mechanical Engineering Dalian University of Technology Dalian116024 China

Continuous carbon fiber reinforced thermoplastic composites (C-CFRTP) have been widely used in high-end equipment with the development of injection molding and compression molding technologies, owing to their excellent mechanical properties and integrated manufacturing feasibility. Recently, fused filament fabrication (FFF) 3d printing technology of C-CFRTP has become a new fabrication method especially for parts with complex structures, of which load-bearing has been significantly improved due to the application of the constant continuous carbon fiber. Trajectory planning is the key process to ensure that the fiber remains continuous at all time, and has been a hotspot in the academic field. double-curve connection trajectory has been proposed by the authors to keep the fiber continuous during the printing process, and this paper has further investigated the effects of the cross-points distribution, a key processing parameter of this process, on the tensile performance. The cross-points were classified as intra-layer cross-points and inter-layer cross-points, and the fracture modes of C-CFRTP parts with different cross-points distributions were analysed. As the cross-points distribution varied, the fracture mode of parts printed by double-curve connection trajectory gradually changed from mode 1 (all cross-points failure) to mode 3 (only one cross-point failure), and the tensile strength of those parts increased at the same time. The relation between cross-points distribution and tensile performance has been built and experimentally validated. Based on this relation, the cross-points distribution was optimized for obtaining higher tensile strength. Compared with the parts printed by the unoptimized cross-points distribution trajectory, the tensile strength of the parts printed by the optimized cross-points distribution trajectory was improved by about 19.97%. In addition, a further comparison between the proposed trajectory and the Zig-Zag trajectory, not usually u

关键词： Trajectories

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Improvement of depth Mapping and Occlusion Removal Method Using Integral Imaging 23

Improvement of Depth Mapping and Occlusion Removal Method Us...

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23rd international conference on Control, Automation and Systems, ICCAS 2023

作者： Sakanoue, Haruka Kim, Hyun-Woo Cho, Myungjin Lee, Min-Chul Kyushu Institute of Technology Department of Computer Science and Networks Fukuoka Iizuka820-8502 Japan School of ICT Robotics and Mechanical Engineering Iitc Hankyong National University Kyonggi-do Anseong17579 Korea Republic of

ISBN: (纸本)9788993215274

In this paper, we propose the depth mapping and occlusion removal method using integral imaging (InIm). InIm is a method to obtain 3d information by capturing and reconstructing an object from multiple viewpoints. InIm can remove occlusion using parallax obtained by photographing an object from multiple viewpoints. However, occlusion removal uses a unit matrix to calculate the number of overlaps, which results in an overall darkening of the image. To solve this problem, this paper aims to improve occlusion removal by using the matrix of the mask image to calculate the number of overlaps. InIm can provide depth mapping that shows the distance from an object as pixel values. However, when there is an occlusion in front of the object, it is difficult to provide depth mapping object due to the influence of the occlusion. To solve this problem, we propose a method of depth mapping and occlusion removal method using InIm. Our method is expected to make great progress in improving safety in the field of autonomous driving. © 2023 ICROS.

关键词： Mapping

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Comparison of Excitation Voltage-Waveforms for Millimeter-Wave Magnetron 23

Comparison of Excitation Voltage-Waveforms for Millimeter-Wa...

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23rd international Vacuum Electronics conference, IVEC 2022

作者： Song, Minsheng Meng, Lin Qin, Yu Liu, Haixia Yong, Yin Wang, Bin Li, Hailong School of Electronic Science and Engineering University of Electronic Science and Technology of China Chengdu China

ISBN: (纸本)9781665443258

In this paper, we have applied two kind of modulated voltage-waveforms for millimeter-wave magnetron. One of voltage-waveforms is ideal smooth step function, whereas another is a voltage-waveform which is more like a real shoot. 22-vane rising-sun magnetron which operates at Ka-band were used for demonstrated in 3d electromagnetic simulation software. Output RF-power, current-waveforms as well as spectra are compared to reveal the difference of a stable and an unstable voltage-waveform. © 2022 IEEE.

关键词： Millimeter waves

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Interfacial delamination Characterization and Thermo-mechanical Reliability of Stacked die Package by Finite Element Analysis 23

Interfacial Delamination Characterization and Thermo-mechani...

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23rd international conference on Electronic Packaging technology (ICEPT)

作者： Chen, Bin Wang, Hong-Guang Lyu, Guang-Chao Yang, Bing-Xian Hu, Wei-Lin Zhang, Xin-Ping South China Univ Technol Guangdong Prov Engn Technol R&D Ctr Elect Packagi Sch Mat Sci & Engn Guangzhou Peoples R China

ISBN: (数字)9781665499057

ISBN: (纸本)9781665499057

Stacked die packages are widely used in flash memory and solid-state drives (SSds) due to high volume, low cost and flexibility. die attach film (dAF) is popularly employed as the adhesive for chip-to-chip and chip-to-substrate connections owing to its excellent performance and reliability. However, because of the mismatch of coefficient of thermal expansion (CTE) of different materials in the package and so-induced high thermal stresses at interfaces, cracks may occur at the interfaces associated with the dAF, e.g., dAF/chip and dAF/substrate interfaces, which can have a serious impact on the reliability of the package. In the present work, the delamination characteristics of the interface between the dAF and the chip as well as the thermal stability of the package are studied by three-dimensional (3d) finite element analysis via virtual crack closure technique (VCCT). Based on the calculation of fracture mechanics parameters (e.g., energy release rate, G) along the crack front, the degree of danger of the interfacial crack at different directions (angles) and the effect of temperature on energy release rate are studied. In addition, some key geometric parameters affecting the stability of package are also investigated. The simulation results show that the thermal stress concentration occurs in the four corners of the interface between the chip and the dAF. The variation of G with the crack position (i.e., s, the distance from A to B) and the variation of Gmax with. have the same trendency, and energy release rate curves have a good symmetry. Besides, temperature has a significant effect on the crack propagation driving force. The thermal stability of the package is enhanced with the increase of the thickness of the epoxy mould compound (EMC) cap and chip but degraded with the increase of the thickness of dAF.

关键词： Stacked die package Interfacial crack Virtual crack closure technique Finite element analysis

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Facial Symmetry Analysis for Cleft Lip Patients from 4d Point Cloud data 23

Facial Symmetry Analysis for Cleft Lip Patients from 4D Poin...

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23rd international conference on Control, Automation and Systems, ICCAS 2023

作者： Kihara, Narumi Kimura-Nomoto, Namiko Okawachi, Takako Li, Guangxu Nakamura, Norifumi Kamiya, Tohru Kyushu Institute of Technology 1-1 Sensui Tobata Tobata Kitakyushu804-8550 Japan Kagoshima University 8-35-1 Sakuragaoka Kagoshima Japan National Hospital Organization Kagoshima Medical Center 8-1 Shiroyama Kagoshima892-0853 Japan Tiangong University 399 BinShuiXi Road XiQing District Tianjin China

ISBN: (纸本)9788993215274

Cleft lip is one of the most common birth defects. Several operations are performed to form a natural lip. A problem with these operations is that the criteria for the facial symmetry are unclear. Based on this background, we propose a method for evaluating the facial symmetry using 4d point cloud data. We evaluate the facial symmetry in two ways. One is based on the temporal changes in the face landmarks. Corresponding points are searched using two local geometric descriptors. The results are approximated to the 3d lines and these slopes are compared to obtain the left-right difference of the movement. The other is based on the center of gravity. The lip part is extracted from the point cloud and divided into subregions. The centroid coordinates are then calculated for each subregion and compared to obtain the left-right difference of the facial structure. The experiment is performed using artificially generated 4d data. As an experimental result, it is shown that our method can find point correspondences with smaller error than comparative methods. © 2023 ICROS.

关键词： 4d data Cleft Lip Point Cloud Symmetry Analysis

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TOWArdS 3d ELECTRIC FIELd IMAGING USING E-FISHG 23

TOWARDS 3D ELECTRIC FIELD IMAGING USING E-FISHG

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23rd international Symposium on High Voltage Engineering, ISH 2023

作者： Sogame, Masataka Nakamura, Shin Sato, Masahiro Fujii, Takashi Kumada, Akiko Department of Electrical Engineering and Information Systems The University of Tokyo 7-3-1 Hongo Bunkyo-Ku Tokyo113-8656 Japan

ISBN: (纸本)9781839539954

Electric field measurement using electric-field induced second-harmonic generation (E-FISHG) has attracted attention because of its non-invasiveness and high temporal/spatial resolution. For the electric field measurement by E-FISHG, it is necessary to consider that the electric field profile along the laser path affects the SHG signal. We have proposed a method of calibrating and restoring the electric field profile from SHG distributions along the laser pass. The successful restoration of a relatively simple electric field profile from a series of SHG signals has been demonstrated. To measure more complex electric field distributions, we apply our method to two cases of electric field profiles: (1) the profile with different sharpness and (2) the profile with noise superimposed on the SHG signal. It is found that the electric field distribution can be restored within a 10% error by adequately choosing the confocal parameter. © The Institution of Engineering & technology 2023.

关键词： Harmonic generation

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Navigation Performance Verification of 3d LidAR SLAM with Observability-driven Path Planning Strategy 23

Navigation Performance Verification of 3D LiDAR SLAM with Ob...

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23rd international conference on Control, Automation and Systems, ICCAS 2023

作者： Kim, donggyun Sung, Sangkyung Konkuk University Department of Aerospace Information Engineering Seoul05029 Korea Republic of Konkuk University Department of Mechanical and Aerospace Engineering Seoul05029 Korea Republic of

ISBN: (纸本)9788993215274

In this paper, we investigate how path planning, tailored to the sensor characteristics of three-dimensional LidAR, can mitigate the risk of SLAM (Simultaneous Localization and Mapping) failing to accurately estimate position and attitude, thus distorting the map. Typical path planning algorithms are designed with the assumption that the robot's position during travel is known precisely. However, real-world robot navigation relies on algorithms like SLAM to estimate position, which means that issues with the navigation algorithm can have a catastrophic impact on the entire navigation system. In this paper, we introduce a method for analyzing the observability of geometry in three-dimensional point cloud maps to identify regions with a high potential for position and attitude errors, as well as map distortion. Our goal is to guide path planning away from these problematic areas. © 2023 ICROS.

关键词： Observability

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