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检索条件"任意字段=23rd ACM International Conference on 3D Web Technology"

共 771 条记录，以下是141-150 订阅

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Foot-Operated Telelocomotion Interface for Avatar Robots Utilizing Mecanum Wheel-Based Mobile Platforms 23

Foot-Operated Telelocomotion Interface for Avatar Robots Uti...

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23rd international conference on Control, Automation and Systems, ICCAS 2023

作者： Lee, Hokyun Park, Gyeongjae Shin, Jaeyong Park, Beomyeong Park, Jaeheung Seoul National University Department of Intelligence and Information Seoul08826 Korea Republic of Graduate School of Convergence Science and Technology Asri Rics Seoul National University Seoul08826 Korea Republic of Suwon16229 Korea Republic of

ISBN: (纸本)9788993215274

This paper presents a foot-operated telelocomotion interface designed for use with avatar robots, with the humanoid robot TOCABI. The system features the mobile platforms equipped with Mecanum wheel and a telelocomotion interface utilizing the Rudder pedals. The design takes into consideration the limitations imposed by the haptic device worn by the operator, which restricts the use of traditional input methods such as keyboards and joysticks. The telelo-comotion interface was evaluated in comparison to other systems from teams participating in the ANA Avatar XPRIZE finals, providing a comprehensive overview of the current state-of-the-art telelocomotion interface for avatar robots and highlighting the unique features of the system presented in this paper. The results of this study have implications for the design of future telelocomotion interface for avatar robots. © 2023 ICROS.

关键词： Machine design

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Advanced Architecture design of High-Radix Router Based on Chiplet Integration and IP Reusability 23

Advanced Architecture Design of High-Radix Router Based on C...

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23rd IEEE international conference on High Performance Computing and Communications, 7th IEEE international conference on data Science and Systems, 19th IEEE international conference on Smart City and 7th IEEE international conference on dependability in Sensor, Cloud and Big data Systems and Applications, HPCC-dSS-SmartCity-dependSys 2021

作者： Liang, Chongshan dai, Yi Xu, Weixia Li, Qiong College of Computer National University of Defense Technology Changsha China

ISBN: (纸本)9781665494571

The performance and cost of large-scale interconnection networks are increasingly determined by the high-radix routers which can effectively reduce the hop count and provide path diversity. But with Moore's law approaching its physical limitations, the exponential growth of I/O pins density on an integrated circuit has stopped, so as the clock frequency. When the number of I/O pins integrated on a router chip remains stable, increasing the radix of the router will, in turn, reduce the single-port bandwidth. Therefore, it will become infeasible to increase the radix of the routers meanwhile improving per port bandwidth, which motivates us to propose a truly scalable router architecture to enable more flexible and spacious design alternatives, rather than constraining the design space to a single monolithic chip. Consequently, we leverage the 'chiplet' technology to integrate multiple switch dies to construct higher-radix routers. In this paper, by exploring different successful chip architectures based on chiplet in various fields, we show that chiplet, a heterogeneous integration technology based on IP reusability, is the promising way to overcome the slowdown of Moore's law and enable the routers continue scaling to higher radix. Then we illustrate that how to construct a chiplet-based higher-radix router architecture by efficiently integrating multiple switch dies with specific high-radix topologies. What's more, combining with the extremely high integration density and performance of 3d chiplet stacking advanced packaging technologies, we propose a chiplet architecture of high-radix router based on 3d stacking for future design. In addition, due to the transmission distance between switch die is significantly shorter than that between monolithic router chip interconnected on traditional PCB boards, we appropriately reduce the buffer resource of the switch dies without the degradation of performance according to the evaluation of buffer depth usage. Based on this

关键词： Semiconductor device modeling Three-dimensional displays Costs Moore's Law Stacking Switches Packaging

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Model of Perspective distortions for a Vision Measuring System of Large-diameter Bent Pipes 23rd

Model of Perspective Distortions for a Vision Measuring Syst...

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23rd international conference on Computational Science, ICCS 2023

作者： Borkowski, Krzysztof Janecki, dariusz Zwierzchowski, Jaroslaw Kielce University of Technology al. Tysiaclecia P. P. 7 Kielce25-314 Poland Institute of Electronics Lodz University of Technology Al. Politechniki 10 Lodz90-590 Poland

ISBN: (纸本)9783031360237

The measuring system described in the article was designed for measuring large and heavy bent pipes with diameters up to 1.2m. Currently, measurements of large-diameter bent pipes are taken using either simple and inaccurate protractors or measuring systems requiring a 3d model of the pipe created in graphics software, an optical scanner and markers. This paper presents methods of modeling distortions for measuring system based on one camera that is easy to install in an industrial plant. Those models allow to perform measurement quickly at any position of the pipe on a large industrial measurement table. The paper describes the mathematical models of perspective projections of single- and double- bent pipes, as well as the method of bending angle determination and detection of straight sections of the bent pipe. As part of the research, measurement accuracy of the designed system model were described and confirmed. ©The Author(s), under exclusive license to Springer Nature Switzerland AG 2023.

关键词： Optical recording

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Survey on Applying 3d Printing in Manufacturing the Cooling Systems of Electrical Machines 23

Survey on Applying 3D Printing in Manufacturing the Cooling ...

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23rd IEEE international conference on Automation, Quality and Testing, Robotics (AQTR)

作者： Szabo, Lorand Tech Univ Cluj Napoca Dept Elect Machines & Drives Cluj Napoca Romania

ISBN: (纸本)9781665479332

Additive manufacturing, also known as 3d printing, comprises the layer-by-layer depositing of a great variety of materials for processing parts of even very great complexity. This new industrial approach opens diverse innovative design perspectives in almost all industries, including the fabrication of electrical machines. There is constant stress on designers working in this field to improve efficiency and quality, even if the current manufacturing technology is at its maximum. Therefore, only a breakthrough in design concepts and fabrication can lead to so many needed improvements. Additive manufacturing can be the key to further developments in electrical machines fabrication since almost all its parts (iron cores, windings, housing, etc.) can be produced using this revolutionary method. In this paper, the possibilities of applying these new fabrication technologies to diverse cooling systems of electrical machines are surveyed. Also, the major advantages brought about by this new industrial approach are emphasized.

关键词： conducting materials electric machines environmentally friendly manufacturing techniques machinery production industries three-dimensional printing

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2022 23rd international conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022

2022 23rd International Conference on Thermal, Mechanical an...

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23rd international conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022

ISBN: (纸本)9781665458368

The proceedings contain 83 papers. The topics discussed include: characterization and modeling of a typical curing material for photoresist films;digital twin for controlled generation of water-in-oil microdroplets with required size;increased breakdown voltage and robustness of embedded power module;performance assessment of different machine learning algorithm for life-time prediction of solder joints based on synthetic data;interaction of advanced copper metallization with the assembly and interconnection technology;thermal aging on molding compounds: material characterization and modeling;novel method for modelling the local electro-thermal behavior of discrete power diode using Verilog-A in a standard cad environment;determination of rate- and temperature dependent inelastic material data for sintered silver die attach and simulative implementation;high speed thermal mapping on six-pack sic-based module for hybrid and electric vehicles;a simulation-based assessment of print accuracy for microelectronic parts manufactured with dLP 3d printing process;a capacitive mems energy harvester for shock-induced periodic excitations;and multi-mode Weibull probability density function for clustered die strength data.

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Geometrically Constrained Phase Unwrapping Method Based On Variable-frequency Fringe Pattern And Neighborhood Feature Matching 23

Geometrically Constrained Phase Unwrapping Method Based On V...

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23rd international conference on Electronic Packaging technology (ICEPT)

作者： Zhuang, Yizhong Gao, Jian Zheng, Zhuojun Zhang, Lanyu Guangdong Univ Technol State Key Lab Precis Elect Mfg Equipment & Techno Guangzhou Peoples R China Guangdong Univ Technol Sch Electromech Engn Guangzhou Peoples R China

ISBN: (数字)9781665499057

ISBN: (纸本)9781665499057

Structured light measurement technology has the advantages of non-contact, full field, high robustness, high speed, and high precision, and has been widely used in industrial inspection, machine vision, cultural relics digitization, medicine, and other fields. Multi-view structured light method introduces an auxiliary camera on the basis of single-view structured light. According to the principle of geometric constraints phase unwrapping, the wrapped phase can be unwrapped without projecting additional fringe patterns. Multi-view structured light has become the focus of structured light measurement technology research in recent years because of its advantages of small number of projected fringe patterns, fast phase unwrapping, and high efficiency of point cloud reconstruction. However, the current multi-view structured light geometric constraints phase unwrapping algorithm still has the problems of high matching difficulty and low phase unwrapping accuracy under the high-frequency fringes. Addressing these problems, this paper proposes a geometric constraints phase unwrapping method based on variable-frequency fringe patterns and neighborhood features matching. The method calculates neighborhood features of the pixel points in left camera wrapped phase image and the candidate points in right camera wrapped phase image. Then, the best matching point among the candidate points is obtained by using the difference of neighborhood features of the pixel points with the same phase in the different frequency fringe. Therefore, the pixel points matching between the left camera view and right camera view can be implemented, and the geometric constraints phase unwrapping can be realized. The proposed method does not need to project additional fringe patterns. It can thus reduce the time cost of projecting patterns, capturing images, and unwrapping phases. In addition, the proposed method can increase the difference of neighborhood features of the candidate points with the same

关键词： Fast 3d measurements multi-view geometric constraints neighborhood features variable-frequency fringe

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Study on the solid-solid interfacial reaction behavior of solder micro bump prepared by laser assisted bonding 23

Study on the solid-solid interfacial reaction behavior of so...

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23rd international conference on Electronic Packaging technology (ICEPT)

作者： Wu, Y. Chen, L. d. Hu, J. W. Zhang, Z. J. Huang, M. L. Yao, H. Li, B. X. Zhou, X. Xian Microelect Res Inst Xian Peoples R China Jiangsu Univ Sci & Technol Sch Mat Sci & Engn Zhenjiang Jiangsu Peoples R China Dalian Univ Technol Sch Mat Sci & Engn Dalian Peoples R China

ISBN: (数字)9781665499057

ISBN: (纸本)9781665499057

The laser assisted bonding (LAB) technology has become a replaceable soldering method for 3d packaging technology through which the side effects of traditional reflow soldering are minimized. In this study, Sn-3.0Ag-0.5Cu (wt.%) solder, a widely used lead-free solder, was soldered on the Ni-P substrate through LAB with two laser energies (6.5 mJ, 7.5 mJ) and reflow soldering, respectively. The average thickness of interfacial IMC in Ni-P/SAC305 micro bumps after LAB at 7.5mJ is 0.33 mu m, which is higher than that (0.26 mu m) in NiP/SAC305 micro bumps after LAB at 6.5mJ. Reflow soldering formed an uneven and a thick IMCs layer (1.53 mu m) at the NiP/SAC305 interface compared to LAB. Subsequently, three types of micro bumps experienced solid-solid interfacial reaction. With the solid-solid interfacial reaction time increasing, the thickness of interfacial IMCs became thicker in three types micro bumps. After aging at 150 degrees C for 400 h, the interfacial IMCs in Ni-P/SAC305 (100 mu m) micro bumps soldered by reflowing (2.22 mu m) was significantly thicker than those in the in Ni-P/SAC305 (100 mu m) micro bumps soldered by LAB with 6.5 mJ (0.75 mu m), and 7.5 mJ (1.15 mu m). Therefore, the laser assisted bonding (LAB) technology can effectively reduce the initial thickness of interfacial IMCs and improve the mechanical reliability of solder micro bumps after aging.

关键词： Lead-free solder Micro bump Laser assisted bonding interfacial reaction Interfacial IMC growth

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ELECTRICAL dESIGN ANd TESTING OF AddITIVE 3d-PRINTEd MEdIUM VOLTAGE BUSHINGS FOR 24 kV 23

ELECTRICAL DESIGN AND TESTING OF ADDITIVE 3D-PRINTED MEDIUM ...

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23rd international Symposium on High Voltage Engineering, ISH 2023

作者： Humpert, Christof Schmid, André Wurm, Philipp TH Köln University of Applied Sciences Cologne Germany

ISBN: (纸本)9781839539954

Additive 3d printing processes have already been successfully introduced in many sectors. To investigate previously studied materials on a real electric component, the identically designed geometrically controlled electrical bushing was produced using three different 3d printing processes: Fused Filament Fabrication (FFF), Stereolithography (SLA) and drop-on-demand (dod). The manufactured bushings for a maximum voltage of Um = 24 kV were electrically tested according to normative specifications for their partial discharges (Pd), their AC breakdown and flashover strength as well as lightning impulse (LI) withstand voltage. In the Pd test, the SLA bushing reaches the highest extinction voltage of 28 kV, followed by the dod bushing with 21 kV. The FFF bushing reaches only 4 kV. during the AC tests, the SLA bushing again reaches the highest voltage of 70 kV, at which flashover occurs. At the dod bushing, breakdown occurs at 33 kV and at the FFF bushing at 12 kV. Based on the results of the AC tests, only the SLA bushing was subjected to an LI test. Here, flashover under LI stress occurred above 110 kV. To summarise, only the geometrically controlled SLA bushing was able to meet all normative electrical requirements. © The Institution of Engineering & technology 2023.

关键词： Partial discharges

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A deep Learning Approach With Sparse Autoencoder for Alzheimers disease Classification 23th

A Deep Learning Approach With Sparse Autoencoder for Alzheim...

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23rd international conference on Intelligent Systems design and Applications, ISdA 2023

作者： Oommen, deepthi K. Arunnehru, J. Department of Computer Science and Engineering SRM Institute of Science and Technology Vadapalani Tamilnadu Chennai India

ISBN: (纸本)9783031648120

Alzheimer's disease is a progressive neurodegenerative condition distinguished by a steady deterioration in cognitive abilities. Given the empirical inquiries conducted, it is imperative to take age into account as a fundamental criterion when selecting participants. Younger individuals are more vulnerable to the transient aspect compared to those who are older. The current work focused on selecting young-onset subjects, as early diagnosis can significantly impact patients' lives. The identification of this disease at an early stage using traditional means poses significant difficulties. deep Learning (dL) has emerged as a highly effective approach for enhancing the performance of diagnostic processes and boosting forecast accuracy. The research utilized deep learning techniques and neuroimaging approaches to autonomously identify and categorize the condition based on its phases of mild cognitive impairment. The suggested study is conducted through a series of three sequential phases. Prior to further analysis, the 3d input visuals need to undergo image preprocessing with Weiner filtering in order to remove noise and smooth the image. Following, Transfer learning models are utilized to extract features, which are then compressed through the use of cascaded Auto Encoders. The ultimate stage involves the utilization of a fine tuned deep Neural Network (dNN) for categorizing of the phases of Ad into five classes. The combination of the ResNet-18 and sparse autoencoder with the deep neural network model yielded a remarkable accuracy rate of 95.62%. © The Author(s), under exclusive license to Springer Nature Switzerland AG 2024.

关键词： deep neural networks

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A Transpose-free Three-dimensional FFT Algorithm on ARM CPUs 23

A Transpose-free Three-dimensional FFT Algorithm on ARM CPUs

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作者： Chen, Tun Jia, Haipeng Li, Zhihao Li, Chendi Zhang, Yunquan Skl of Computer Architecture Institute of Computing Technology Chinese Academy of Sciences Beijing China University of Chinese Academy of Sciences Beijing China Huawei Technologies Co. Ltd Shenzhen China

ISBN: (纸本)9781665494571

According to the traditional multi-dimensional FFT, memory layouts of high-dimensional data are discontinuous. Transposition is introduced to keep high-dimensional data continuous in memory. However, transposition increases memory access and is a hot spot for multi-dimensional FFT. This paper proposes an optimization framework to eliminate explicit transpositions and optimize the three-dimensional (3d) FFT. This framework includes three research points. 1) combines the width-first and breadth-first search to optimize the butterfly network of one-dimensional (1d) FFT;2) adopts a column-order algorithm to eliminate data transposition;3) adopts a blocking algorithm of cache-aware to better use the hardware resources of ARM architecture. Based on this optimized framework, a multi-dimensional FFT library named MdFFT is implemented. The experiments demonstrate that MdFFT generally performs better than FFTW and ARMPL on ARM CPUs. © 2021 IEEE.

关键词： Three-dimensional displays Smart cities Layout Parallel processing Libraries Hardware Optimization

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