A scanning system was constructed for detecting 3d profile of a whole body using an RF antenna array and a parallel processing unit. The antenna array generated signals whose information indicated reflection from a ta...
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ISBN:
(纸本)9781479912636
A scanning system was constructed for detecting 3d profile of a whole body using an RF antenna array and a parallel processing unit. The antenna array generated signals whose information indicated reflection from a target object. The signals in the array were producedduring rotation and sampled with triggers by a high speed AdC. The sampleddata was transferred to a parallel processing unit. Large number of the triggers and the amount of mathematical computation of frequency analysis forms gigabytes of data size. We showed that the parallel processing unit is useful and time-efficient to detect the 3d profile of whole body by millimeter wave imaging.
The defense Advanced Research Projects Agency (dARPA) is sponsoring the MENTOR program as the outreach part of its Adaptive Vehicle Make suite of programs. Georgia Tech has been awarded a contract to involve up to 100...
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The defense Advanced Research Projects Agency (dARPA) is sponsoring the MENTOR program as the outreach part of its Adaptive Vehicle Make suite of programs. Georgia Tech has been awarded a contract to involve up to 1000 high schools after 4 years in a series of prize challenges. A web-based collaborative design-manufacturing infrastructure will be developed that integrates CAd, CAE, design-for-manufacturing, and CAM software tools with a network of 3d printers and other manufacturing resources. In distributed teams, students will design, fabricate, and construct electro-mechanical systems (e.g., ground vehicle robots) to perform complex tasks. Many parts they design will be fabricated on 3d printers that are located in high schools or nearby sites. A project objective is to have students learn about collaborative design, advanced manufacturing, and new product development practices and to become excited about pursuing technology-based careers.
In this paper, we present test structures and measurement techniques that enable the extraction of the significance of the thermal-mechanical stress in 3d-stacked integrated circuit technology. Heaters and integrated ...
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In this paper, we present test structures and measurement techniques that enable the extraction of the significance of the thermal-mechanical stress in 3d-stacked integrated circuit technology. Heaters and integrateddiodes have been used to determine the impact of hotspots in 3-d systems. The results obtained showed that in 3-d case, the peak temperature of a hotspot is three times higher compared to a traditional 2-d system. For the characterization of through silicon vias (TSVs)-induced stress and its impact on analog metal-oxide semiconductor (MOS) devices, a 10-bit current steering digital-to-analog converter (dAC) test structure is utilized. The dAC has been optimized to detect ion changes down to 0.5% due to TSV proximity, TSV orientation, thermal hotspots, and wafer thinning or stacking process. The results obtained from stand-alone short-channel MOS devices and the dAC structure clearly indicate the impact of TSV proximity and TSV orientation on the carrier mobility of nearby transistors.
Additive Manufacturing (AM) has shown considerable promise for the future but also proposes some challenges. Many AM barriers tend to be non-technical and instead are human-centric issues such as lack of education of ...
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Additive Manufacturing (AM) has shown considerable promise for the future but also proposes some challenges. Many AM barriers tend to be non-technical and instead are human-centric issues such as lack of education of practitioners in AM capabilities, cultural differences, vested interests, and potentially lack of imagination. It is highly desirable for all research and educational institutions to help address these issues. This paper summarizes the additive manufacturing research and education program at the Missouri University of Science andtechnology (Missouri S&T) and its interactions with various constituents, including K-12 students, undergraduate and graduate students, distance students, and industry.
Historically, standardized test parts are used to quantitatively evaluate the performance of a machine or process. While several different additive manufacturing (AM) test parts have been developed in the past, there ...
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Historically, standardized test parts are used to quantitatively evaluate the performance of a machine or process. While several different additive manufacturing (AM) test parts have been developed in the past, there are no current standard test parts. This paper reviews existing AM test parts, discusses the purposes of the studies, anddescribes important features and characteristics found in these test parts. A new test part intended for standardization is proposed. This part incorporates the most useful features seen in previous test parts. These features are designed to highlight process capabilities and test machine accuracy. The design has been validated through builds by several AM processes.
The costs of additive manufactured parts often seem too high in comparison to those of traditionally manufactured parts, as the information about major cost drivers, especially for additive manufactured metal parts, i...
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The costs of additive manufactured parts often seem too high in comparison to those of traditionally manufactured parts, as the information about major cost drivers, especially for additive manufactured metal parts, is weak. Therefore, a lifecycle analysis of additive manufactured parts is needed to understand and rate the cost drivers that act as the largest contributors to unit costs, and to provide a focus for future cost reduction activities for the Additive Manufacturing (AM) technology. A better understanding of the cost structure will help to compare the AM costs with the opportunity costs of the classical manufacturing technologies and will make it easier to justify the use of AM manufactured parts. This paper will present work in progress and methodology based on a sample investigated with business process analysis / simulation and activity based costing. In addition, cost drivers associated with metal AM process will be rated.
The present article introduces the Glob3 Mobile, an efficient virtual globe framework, testable and freely accessible from the web and providing a real 3d navigation experience with smooth flying. We discuss the softw...
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One application of additive manufacturing is for fabrication of customized, light-weight material called Conformal Lattice Structures (CLS), a type of cellular structure with dimensions of 0.1 to 10 mm. In this paper,...
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One application of additive manufacturing is for fabrication of customized, light-weight material called Conformal Lattice Structures (CLS), a type of cellular structure with dimensions of 0.1 to 10 mm. In this paper, two advances are reported for designing CLS. First, computer-aideddesign technologies were developed for efficiently generating and representing CLS, given selected part model surfaces. Second, a method is presented for efficiently optimizing CLS by utilizing a heuristic that reduces the multivariate optimization problem to a problem of only two variables. The heuristic is: stress distributions are similar in CLS and in a solid body of the same shape. Software will be presented that embodies this process and is integrated into a commercial CAd system. In this paper, the method is applied to design strong, stiff, and light-weight Micro Air Vehicle (MAV) components.
despite the broad coverage concerning the technological challenges, little research has been performed on the methods that enable designers to deal with Additive Manufacturing. At present, the challenge is to generate...
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despite the broad coverage concerning the technological challenges, little research has been performed on the methods that enable designers to deal with Additive Manufacturing. At present, the challenge is to generate design for Additive Manufacturing knowledge which goes beyond traditional solutions and to ensure that this knowledge is complete, correct and up to date. This paper reports on the employment of a wiki environment to support open-ended knowledge management. We applied this solution in an undergraduate prototyping course focused on exploring visual properties using AM structures. The results of the 32 students encompass unexpecteddesigns while the knowledge on the wiki encompassed i) AM processes, ii) procedures, iii) artifacts. This forces us to rethink what should constitute dfAM.
Integration of material composition, microstructure, and mechanical properties with geometry information enables many product development activities, including design, analysis, and manufacturing. In this paper, we in...
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Integration of material composition, microstructure, and mechanical properties with geometry information enables many product development activities, including design, analysis, and manufacturing. In this paper, we investigate the application of image processing methods for constructing models of material microstructure. These microstructure models can be integrated into CAd models to enable the utilization of material process-structure-property relationships during CAd modeling. Engineering design is enabled by integration of computational materials design methods with these relationships. Using 2d images and3d voxel datasets, the image processing methods can be used to find microstructure features, such as grain boundaries or particle or fiber reinforcements, by finding edges and extracting features from those edges. This paper will focus on three different image processing methods, which will be applied to microstructure images of materials fabricated by additive manufacturing.
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