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检索条件"任意字段=23rd ACM International Conference on 3D Web Technology"

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Thermal modelling of 3d multicore systems in a flip-chip package

Thermal modelling of 3D multicore systems in a flip-chip pac...

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IEEE international SOC conference

作者： Kameswar Rao Vaddina Tamoghna Mitra Pasi Liljeberg Juha Plosila Turku Center for Computer Science Turku Finland Department of Information Technology University of Turku Turku Finland Chemical Engineering Department Åbo Akademi University Turku Finland

Three-dimensional (3d) technology offers greater device integration, reduced signal delay and reduced interconnect power. It also provides greater design flexibility by allowing heterogeneous integration. In this work, a 3d thermal model of a multicore system is developed to investigate the effects of hotspot, and placement of silicon die layers, on the thermal performance of a modern flip-chip package. In this regard, both the steady-state and transient heat transfer analysis has been performed on the 3d flip-chip package. Two different thermal models were evaluated under different operating conditions. Through experimental simulations, we have found a model which has better thermal performance. The optimal placement solution is also provided based on the maximum temperature attained by the individual silicon dies. We have also provided the improvement that is required in the heat sink thermal resistance of a 3d system when compared to the single-die system.

关键词： Thermal resistance Heat sinks Three dimensional displays Heat transfer Silicon Resistance heating

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Power noise suppression technique using active decoupling capacitor for TSV 3d integration

Power noise suppression technique using active decoupling ca...

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IEEE international SOC conference

作者： Tien-Hung Lin Po-Tsang Huang Wei Hwang Department of Electronics Engineering & Institute of Electronics and Microelectronics and Information Systems Research Center National Chiao Tung University Hsinchu Taiwan

In three-dimensional (3d) integration, the increasing supply current through both package and through-silicon-via (TSV) would lead to a large simultaneous switching noise potentially. In this paper, a noise suppression technique using low power active decoupling capacitors (dECAPs) is proposed for TSV 3d integration. Through the latch-based noise detection circuitry, the power supply noise can be detected and regulated via active dECAPs. Based on UMC 65 nm CMOS technology and TSV model at 1 V supply voltage, the proposed noise suppression circuit can realize maximum 7.4 dB supply noise reduction and 12 X boost fact at the resonant frequency.

关键词： Switches Three dimensional displays Through-silicon vias Logic gates CMOS integrated circuits Solid modeling Integrated circuit modeling

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Mechanosynthesis of three-dimensional replicated nanostructures by nanolithography-based molecular manipulation

Mechanosynthesis of three-dimensional replicated nanostructu...

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IEEE international conference on Micro Electro Mechanical Systems

作者： Zhan Liu Nisarga Naik david G. Bucknall Mark G. Allen School of Polymer Textile and Fiber Engineering Georgia Institute of Technology USA School of Electrical and Computer Engineering Georgia Institute of Technology USA

ISBN: (纸本)9781424457618;9781424457649

This paper reports a nanoscopic mechanosynthesis of three-dimensional (3d) nanostructures by nanolithography-based molecular manipulation (NMM) of target molecules for the applications requiring both physical and chemical anisotropies. The reported molecular manipulators with nanometer-sized patterns and anisotropic surface functionalities are fabricated by exploiting the hybrid nanometer-scale NMM process. They are then utilized for positional nanoassembly of molecules followed by mechanosynthesis producing 3d nanoreplicas. This approach offers "top-down" design and fabrication of morphological features of nanoparticles (NPs). Three types of replicated sub-10 nm polystyrene (PS) nanostructures have been successfully demonstrated in this work, namely, "nanomushrooms", "nanospikes", and high-aspect-ratio "nanofibers".

关键词： Nanostructures Nanobioscience Fabrication Anisotropic magnetoresistance Chemical technology Assembly Biomedical imaging Chemical processes Nanoelectromechanical systems Polymers

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Micro spinning nozzle having 3d profile for fiber generation with spiral air flow

Micro spinning nozzle having 3D profile for fiber generation...

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IEEE international conference on Micro Electro Mechanical Systems

作者： Kenichi Morimoto Yohei Tada Hiroki Takashima Katsushi Minamino Ryosuke Tahara Satoshi Konishi Department of Micro System Technology Ritsumeikan University Japan Murata Machinery Limited Kyoto Japan

ISBN: (纸本)9781424457618;9781424457649

This paper presents a novel application of MEMS technology to the miniaturization of air-flow type fiber-generation technology. In Murata vortex spinning (MVS) machine, a nozzle for continuous air-jet blowing, which is the key component in producing fibers with distinctive nature, is equipped in the spinning chamber. With the intention of extending the MVS principle to smaller-scale fiber generation, we propose MEMS-based nozzles having 3d profile, transformed from conventional oblique jet holes with straight cylindrical shape. We design the nozzle geometry using computational fluid dynamics (CFd) simulations, and examine the applicability of presently fabricated nozzles to fiber generation through simplified experiments.

关键词： Spinning Spirals Computational fluid dynamics Computational geometry Computational modeling Solid modeling Micromechanical devices

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Three-dimensional microbatteries for MEMS/NEMS technology

Three-dimensional microbatteries for MEMS/NEMS technology

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IEEE international conference on Micro Electro Mechanical Systems

作者： Bruce dunn Chang-Jin Kim Sarah Tolbert Department of Materials Science and Engineering University of California Los Angeles Los Angeles USA Mechanical and Aerospace Engineering University of California Los Angeles Los Angeles USA Department of Chemistry and Biochemistry University of California Los Angeles Los Angeles USA

ISBN: (纸本)9781424457618;9781424457649

We recently developed a new approach for battery design based on three-dimensional architectures which offer potential solutions for powering autonomous devices and maintaining small footprint areas. This paper provides a brief review of our work which applies micromachining methods to fabricate electrode arrays which serve as the central design element for these architectures. The results with the zinc-air primary batteries demonstrate that 3d configurations can achieve both high power and energy densities within a small footprint area. The development of lithium-ion batteries has not been as rapid although reversible electrochemical behavior has been demonstrated with 3d electrode array structures.

关键词： Micromechanical devices Nanoelectromechanical systems Batteries Electrodes Anodes Wireless sensor networks Geometry Conductivity Cathodes Phased arrays

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Low-cost through silicon vias (TSVs) with wire-bonded metal cores and low capacitive substrate-coupling

Low-cost through silicon vias (TSVs) with wire-bonded metal ...

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IEEE international conference on Micro Electro Mechanical Systems

作者： A. C. Fischer N. Roxhed G. Stemme F. Niklaus KTH Royal Institute of Technology Stockholm Sweden

ISBN: (纸本)9781424457618;9781424457649

The three-dimensional (3d) integration of electronics and/or MEMS-based transducers is an emerging technology that vertically interconnects stacked dies using through silicon vias (TSVs). They enable the realization of devices with shorter signal lengths, smaller packages and lower parasitic capacitances, which can result in higher performance and lower costs. This paper presents a novel low-cost fabrication technique for metal-filled TSVs using bonded gold-wires as conductive path. In this concept the wires are surrounded by polymer, which acts both as an electrical insulator causing low capacitive coupling towards the substrate and as a buffer for thermo-mechanical stress.

关键词： Silicon Transducers Electronics packaging Parasitic capacitance Costs Fabrication Bonding Wires Polymers Cable insulation

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Heterogeneous integration of vaporliquidsolid grown silicon microprobe arrays/(111) and MOSFETs/(100) using a silicon on insulator substrate

Heterogeneous integration of vaporliquidsolid grown silicon ...

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IEEE international conference on Micro Electro Mechanical Systems

作者： Akihiro Okugawa Kotaro Mayumi Takeshi Kawano Makoto Ishida Toyohashi University of Technology Japan

ISBN: (纸本)9781424457618;9781424457649

Herein we report heterogeneous integration of vertically-aligned silicon (Si) microprobe arrays/(111) with MOSFET circuits/(100) by IC processes and subsequent selective vapor-liquid-solid (VLS) growth of silicon. A hybrid silicon-on-insulator (SOI) substrate with a (100) topSi/buried oxide (BOX)/(111) handle-Si system was utilized for the integration technique. MOSFETs were fabricated on (100) topSi, and VLS-Si probe arrays were assembled at the exposed (111) handle-Si wafer where the (100) top-Si region was removed by anisotropic etching. The different Si layers of the MOSFETs and probes were electrically connected by a 3d metallization technique. Additionally, we investigated the electrical properties of 3d metallization and the MOSFETs. The results indicate potential for heterogeneous integration of VLS probes/(111) and MOSFETs/(100). The proposed technique also promises further integrations of numerous microdevices/different species of substrates and microelectronics/(100) on the same chip.

关键词： MOSFETs Silicon on insulator technology Substrates Probes Metallization Chemical sensors Etching Microelectronics Electron traps Nanoelectromechanical systems

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3d integration of micro optical components on flexible transparent substrate with through-hole- vias

3D integration of micro optical components on flexible trans...

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IEEE international conference on Micro Electro Mechanical Systems

作者： Hsiu-Ting Hsu Wang-Shen Su Chih-Chun Lee Hsin-Yu Huang Hung-Yi Lin Weileun Fang National Tsing Hua University Taiwan National Nano Device Laboratories Taiwan Touch MicroSystems Technology Inc. Taiwan

ISBN: (纸本)9781424457618;9781424457649

This study establishes the polymer-stacking and metal-electroplating processes on Si-substrate to implement a flexible and transparent substrate with alignment mesa, distributed though-hole-vias, and multi-layer electrical routings. This process is especially useful for 3d integration of micro optical components on flexible substrate. The integrated chips can be further protected and sealed by an additional parylene coating. More micro-optical components can also be vertically integrated by additional polymer molding. To demonstrate the feasibility of this approach, LEd chips are bonded and sealed in flexible substrate, and the polymer microlens is further integrated with the lighting chips using molding process. The lighting of packaged LEd chips is demonstrated in both air and water.

关键词： Optical devices Polymers Microoptics Light emitting diodes LEd lamps Routing Protection Coatings Bonding Organic light emitting diodes

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Integration and 3d fabrication techniques to nanoscale-tip silicon high-aspect-ratio microprobe arrays

Integration and 3D fabrication techniques to nanoscale-tip s...

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IEEE international conference on Micro Electro Mechanical Systems

作者： A. Goryu A. Ikedo T. Kawano M. Ishida Department of Electrical and Electronic Engineering Toyohashi University of Technology Toyohashi Aichi Japan

ISBN: (纸本)9781424457618;9781424457649

We developed integration and three-dimensional (3d)-fabrication techniques to nanoscale-tip silicon-microprobe arrays for multiple electrical nano-measurement systems with a high aspect ratio. Vapor-liquid-solid (VLS) grown vertically-aligned 120¿m-length silicon microprobe arrays (2¿m-diameter), each with nanoscale-tip by controlling the silicon-etching (less than 100-nm-diameter, radius of curvature 50nm), have been integrated with IC-processed interconnections. Subsequently, the nanotip silicon probe is entirely covered with Pt/Ti and encapsulated with an insulator, SiO 2 . In addition, herein we proposed the use of a spray-coating of photoresist and cycled etchings of the photoresist/SiO 2 at the probe-tips. Consequently, the nanotips can precisely be patterned and etched, resulting in the exposed Pt/Ti/silicon-nanotip with a controlled height of 2¿m.

关键词： Fabrication Silicon Nanobioscience Probes Resists Etching Nanoscale devices Nanowires Plasma applications Scanning electron microscopy

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Large scale integrated 3d microfluidic networks through high yield fabrication of vertical vias in PdMS

Large scale integrated 3D microfluidic networks through high...

引用

IEEE international conference on Micro Electro Mechanical Systems

作者： C.F. Carlborg K.T. Haraldsson M. Cornaglia G. Stemme W. van der Wijngaart KTH Royal Institute of Technology Stockholm Sweden

ISBN: (纸本)9781424457618;9781424457649

This paper introduces a robust, high yield, single-step fabrication method for creating densely spaced, miniaturized out-of-plane fluidic interconnecting channels (=vias) in standard poly(dimethylsiloxane) PdMS. Unblocked vias are essential for creating 3d microfluidic networks. Previously reported methods either had low yield, because of residual membranes covering the vias after polymerization, or required complicated extra steps to remove the blocking membranes. In contrast, our method prevents the formation of residual membranes by inhibition of the polymerization on top of the protuding mold features defining the vias locations. In addition to providing unblocked vias, the inhibition also leaves a flat partially cured, sticky top surface that adheres well to other surfaces and allows self-sealing stacking of several PdMS layers. We demonstrate the new method by manufacturing a densely perforated PdMS membrane and a large scale integrated (LSI) 3d PdMS microfluidic channel network. Our method enables batch manufacturing of complex fluidic devices by speeding up and simplifying the fabrication of complex microfluidic components in standard PdMS.

关键词： Large scale integration Microfluidics Fabrication Biomembranes Platinum Polymers Glass Bonding Clamps Mechanical factors

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