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检索条件"任意字段=23rd ACM International Conference on 3D Web Technology"

共 771 条记录，以下是71-80 订阅

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Investigation of interfacial reaction and shear behavior of Cu-Sn TLP bonding joints bearing Nd particles for 3d packaging 23

Investigation of interfacial reaction and shear behavior of ...

引用

23rd international conference on Electronic Packaging technology (ICEPT)

作者： Xu, Qiman Chen, Baishan Zhou, Jian Xue, Feng Chen, Qin Southeast Univ Sch Mat Sci & Engn Nanjing Peoples R China Cent South Univ Inst Adv Study Changsha Peoples R China Suzhou Younuo Elect Mat Technol Co Ltd Suzhou Peoples R China

ISBN: (数字)9781665499057

ISBN: (纸本)9781665499057

With the rapid development of microelectronics industry, 3d integrated circuit (3d-IC) packaging technology is gradually applied in power electronic devices due to its high frequency, high integration and high intelligence. Transient Liquid Phase (TLP) connection technology based on Cu/Sn/Cu system has the most practical background and research value. To improve the mechanical reliability of Sn solder joint, Nd particles were doped into solder. In this study, Sn interconnect solder doping Nd particles were fabricated by TLP technology, and then the impact of Nd particles on the interfacial reaction and shear behavior of the composite solder joints was investigated. By means of Nd element was added into solder to refine its microstructure, so as to improve the joint mechanical properties.

关键词： Solder Transient liquid phase bonding Intermetallic compounds (IMCs) Microstructure Shear strength

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Collective Attention to Social Media Evolves According to diffusion Models 23

Collective Attention to Social Media Evolves According to Di...

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23rd international conference on World Wide web (WWW)

作者： Bauckhage, Christian Kersting, Kristian Rastegarpanah, Bashir Univ Bonn D-53113 Bonn Germany TU Dortmund Univ D-44221 Dortmund Germany Fraunhofer IAIS D-53754 St Augustin Germany

ISBN: (纸本)9781450327459

We investigate patterns of adoption of 175 social media services and web businesses using data from Google Trends. For each service, we collect aggregated search frequencies from 45 countries as well as global averages. This results in more than 8.000 time series which we analyze using economic diffusion models. The models are found to provide accurate and statistically significant fits to the data and show that collective attention to social media grows and subsides in a highly regular manner. Regularities persist across regions, cultures, and topics and thus hint at general mechanisms that govern the adoption of web-based services.

关键词： social media services collective attention trend prediction

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A novel 3d plastic packaging technology with high overload ability and its application in microsystem 23

A novel 3D plastic packaging technology with high overload a...

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23rd international conference on Electronic Packaging technology (ICEPT)

作者： Liu, Mifeng Bao, Zhonghua Fu, Rong Zhang, Cheng Chen, Xiaohong Chen, Kai Shanghai Aerosp Elect & Commun Equipment Res Inst Shanghai Peoples R China

ISBN: (数字)9781665499057

ISBN: (纸本)9781665499057

In this paper, a 3d plastic packaging technology based on 2d-MCM stacking was proposed. Through PGA and embedded nut structure, the reliability of electrical interconnection between the module and PCB in high overload environment could be improved. The finite element simulation result of the maximum stress of the 3d plastic packaging module under 20000g impact was 132.62 MPa, which was mainly distributed in embedded nuts area, while the stress of the PGA position was lower than 20 MPa. An anti-impact inertial navigation microsystem module was developed, which integrated a computing unit, an IMU (3-axis accelerometer and 3-axis gyroscope) and a power management unit. The size of the microsystem module was 30mm x 30mm x 8.4 mm. After the temperature cycle of-55 degrees C similar to 125C and the impact test of 5000g, there were no delamination and cracking in the microsystem module. The firing test was carried out, and the measured result of X-axis acceleration was from -32g to -2g during 30s, and the angular velocity of the wy-axis were -30 degrees/s to 30 degrees/s.

关键词： 3d plastic packaging microsystem high overload stacking

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Realization of gap-waveguide leaky wave antenna using low-cost metallization procedure 23

Realization of gap-waveguide leaky wave antenna using low-co...

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23rd international conference on Applied Electromagnetics and Communications (ICECOM)

作者： Eres, Zoran Bosiljevac, Marko Sipus, Zvonimir Rudjer Boskovic Inst Zagreb Croatia Univ Zagreb Fac Elect Engn & Comp Zagreb Croatia

ISBN: (纸本)9781728155142

Realization of components in gap-waveguide technology can he expensive and time-consuming due to demanding manufacturing procedure. To reduce the costs of production we hale investigated the characteristics of a 3d printed leaky wave antenna metallized using loss-cost electroless process. As a proof of concept, leaky wave antenna is designed in grouse gap-ssaseguide technology for operation at 30 GHz. The antenna was simulated, manufactured and measured to verify the design and the quality of the used copper plating process.

关键词： periodic structures gap-waveguide leaky-wave antenna 3d printing technology

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Haters Gonna Hate: Job-Related Offenses in Twitter 23

Haters Gonna Hate: Job-Related Offenses in Twitter

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23rd international conference on World Wide web (WWW)

作者： Kawase, Ricardo Siehndel, Patrick Herder, Eelco Leibniz Univ Hannover L3S Res Ctr L3S Appelstr 9a D-30167 Hannover Germany

ISBN: (纸本)9781450327459

In this paper, we aim at finding out which users are likely to publicly demonstrate frustration towards their jobs on the microblogging platform Twitter - we will call these users haters'. We show that the profiles of haters have specific characteristics in terms of vocabulary and connections. The implications of these findings may be used for the development of an early alert system that can help users to think twice before they post potentially self-harming content.

关键词： FireMe webScience Social Networks Twitter User issues Privacy awareness

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High density 3d heterogeneous integration used in microwave modules 23

High density 3D heterogeneous integration used in microwave ...

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23rd international conference on Electronic Packaging technology (ICEPT)

作者： Hu Yongfang Huang Qingan Han Zongjie Han Lei Sun Yipeng Southeast Univ Sch Elect Sci & Engn Nanjing Peoples R China Nanjing Res Inst Elect Technol Nanjing Peoples R China

ISBN: (数字)9781665499057

ISBN: (纸本)9781665499057

High density 3d heterogeneous integration technology used in electronic equipment microwave modules was studied in the paper,high aspect ratio through silicon via (TSV) function interposer preparation, high precision wafer level flip chip, high reliable fan-out package, Si interposer hermetic bonding were researched in detail. High density 3d heterogeneous integration samples were manufactured. The results indicate that through silicon via (TSV) function interposer was made by deep via etching, copper plating hole filing and surface re-distribution layer (rdL), high reliable chip to wafer (C2W) flip chip was made by bump preparation and flip chip technology, fan-out packaging was made by high precision die thinning, bump preparing and high reliable plastic packaging technology, high precision interposer hermetic bonding was made by high precision pre-alignment of wafer lever bonding, and wafer level hermetic bonding technology. The paper supplies technology reference to high density 3d heterogeneous integration used in electronic equipment microwave module.

关键词： heterogeneous integration TSV interposer C2W flip chip fan-out packaging hermetic bonding

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Technical challenges in mobile real-time 3d city maps WTH dynamic content

Technical challenges in mobile real-time 3D city maps WTH dy...

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IASTEd international conference on Software Engineering: part of the 23rd IASTEd international Multi-conference on Applied Informatics, SE 2005

作者： Nurminen, Antti Helin, Ville Industrial Information Technology Laboratory Helsinki University of Technology P.O.Box 9204 02015 HUT Finland

ISBN: (纸本)0889864640

While mobile 3d maps are not a new idea, implementations have been sparse. One reason is the serious lack of computing resources in the mobile environment, while another has been the lack of feasible programming interfaces. As the mobile 3d programming interfaces OpenGL ES1 and JSR-1842 have lately emerged, the remaining main obstacles are the limited resources. In this paper, we discuss the technical challenges in creating a mobile real-time 3d city map application with support for dynamic content, and present a set of feasible solutions.

关键词： Location based services

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Research of 3d Printing technology for Silver Paste based on direct Ink Writing 23

Research of 3D Printing Technology for Silver Paste based on...

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23rd international conference on Electronic Packaging technology (ICEPT)

作者： Zhao, Lei Jiao, Kun Li, Chao Yin, Enhuai Zhao, Wenzhong Xian Res Inst Nav Technol Xian Peoples R China Xian Ruite 3D Technol Co Ltd Xian Peoples R China

ISBN: (数字)9781665499057

ISBN: (纸本)9781665499057

Flexible electronics devices have many advantages, such as portability, transparency, good stretching and bending ability. In recent years, with the growing demand of the flexible electronics, it promoting the innovation of manufacturing method. direct ink writing (dIW) is a low-cost, flexible and efficiency method to patterning conductive circuits on the flexible substrate. In this paper, direct ink writing of commercial silver paste on PI substrates is introduced and the parameters that can be modified to tune the process include feed pressure, dispensing gap, moving speed and nozzle size are discussed. The results show that the commercial silver paste based on dIW method can obtain minimal trace width of 151 mu m on PI substrates under 0.11mm inner diameter nozzle, 100mm/min moving speed, 0.15Mpa feed pressure and 0.07mm dispensing gap. Then using the five-axis micro pen direct writing device developed by Ruite 3d, the silver paste pattern was successfully printed on the curved surface, which provided a useful reference for the subsequent application of the silver paste dIW technology in conformal antennas, flexible wearable devices and other 3d circuit fabrication directions.

关键词： silver paste direct ink writing curved surface printing

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Tensor-based Nonlocal MRI Reconstruction with Compressed Sensing 23

Tensor-based Nonlocal MRI Reconstruction with Compressed Sen...

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23rd IEEE international conference on digital Signal Processing (dSP)

作者： Wu, Qidi Li, Yibing Lin, Yun Harbin Engn Univ Coll Informat & Commun Engn Harbin Heilongjiang Peoples R China

ISBN: (纸本)9781538668122;9781538668115

Compressed sensing(CS) is a significant technology in MRI reconstruction, which can reconstruct the image with few undersampled data and speed up the imaging. The conventional CS-based MRI is implemented on the global image, which not only loss many local structures but also fails in preserving the detail information. To improve the reconstruction quality, we proposed a novel CS-based reconstruction model, which is incorporated with nonlocal technology to gain extra details preservation. The proposed model grouped the similar patches within the nonlocal area, and stacked them to form a 3d array. Then, to process the array in a realistic 3d way, a tensor-based sparsity constraint is developed as the regularization on the reconstructed image. Experimental results show that the proposed method is more effectiveness and efficiency than the conventional ones.

关键词： image reconstruction compressed sensing sparse representation tensor nonlocal technology

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A 3d video scanner for face performance capture

A 3D video scanner for face performance capture

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2008 23rd international conference Image and Vision Computing New Zealand, IVCNZ

作者： Woodward, A. delmas, P. Gimel'farb, G. Department of Computer Science University of Auckland Auckland New Zealand

ISBN: (纸本)9781424425822

This paper presents a 3d video scanner design for human face performance capture by active illumination stereo vision, combining a computational stereo algorithm with pattern projection to add texture to the scene. The scanner uses monochromatic video cameras to capture stereo images - a solution to obtain colour information was found by using a third web-camera and knowledge of the camera geometry to synthesise colour texture maps. Experimental results successfully demonstrate a proof of concept for an entirely computer vision based approach. The generated 3d video data being rendered and displayed using a standard graphics API yields highly realistic 3d face animation. © 2008 IEEE.

关键词： Stereo vision

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