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检索条件"任意字段=23rd ACM International Conference on 3D Web Technology"

共 771 条记录，以下是81-90 订阅

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development of 3d cutting simulator using Vatti clipping 23

Development of 3D cutting simulator using Vatti clipping

引用

23rd international conference on Mechatronics technology (ICMT)

作者： Kito, Ryota Takasugi, Keigo Asakawa, Naoki Mizutani, Takahiko Kanazawa Univ Grad Sch Nat Sci & Technol Kanazawa Ishikawa Japan Kanazawa Univ Inst Sci & Engn Kanazawa Ishikawa Japan SOFIX Co Ltd Dev Dept Yokohama Kanagawa Japan

ISBN: (纸本)9781728139982

In recent years, product shapes have become complicated, and a cutting simulator that can confirm the shape before actual machining is strongly required. In most cases, simulators are developed using a concept called a "voxel." Voxel representation shapes 3d models, including tools and workpieces, with a set of minute cubes. However, voxel representation has a disadvantage in that it is difficult to accelerate the simulation. Therefore, this study used polygon representation instead of voxel representation. A cutting simulator was developed using the Vatti clipping algorithm from the computer graphics field.

关键词： Cutting simulator Vatti clipping Polygon Real time

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3d Model of Ergonomic Socket Mechanism for Prostheses of Transtibial Amputees 12th

3D Model of Ergonomic Socket Mechanism for Prostheses of Tra...

引用

12th international conference on digital Human Modeling and Applications in Health, Safety, Ergonomics and Risk Management (dHM) Held as Part of the 23rd international conference on Human-Computer Interaction (HCII)

作者： Carvalho, Isabel Nassar, Victor Prim, Gabriel Nishida, Jonathan Ourives, Eliete Bueno, Taina Vieira, Milton Univ Fed Santa Catarina Florianopolis SC Brazil

ISBN: (纸本)9783030778163;9783030778170

This work presents a model for the development of a socket mechanism for transtibial prosthesis. A survey was carried out with Brazilian amputee users, based on interviews to understand the context of use and to be able to identify problems of balance, ergonomic and friction problems in the prostheses' socket. With this, a list of requirements was defined, and a semantic map was created, which guided the development of a 3d model of a prosthetic socket, aiming to minimize the mechanical friction, allowing the regulation of the pressure exerted on the stump and the adjustment of fit according to the need of user.

关键词： Assistive technology Transtibial prosthesis design Brazilian culture

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Hybrid client-server and P2P network for web-based collaborative 3d design 23

Hybrid client-server and P2P network for web-based collabora...

引用

23rd international conference in Central Europe on Computer Graphics, Visualization and Computer Vision, WSCG 2015

作者： desprat, Caroline Luga, Hervé Jessel, Jean-Pierre University of Toulouse 118 Route de Narbonne Toulouse France

ISBN: (纸本)9788086943657

Our proposed research project is to enable 3d distributed visualization and manipulation involving collaborative effort through the use of web-based technologies. Our project resulted from a wide collaborative application research fields: Computer Aided design (CAd), Building Information Modeling (BIM) or Product Life Cycle Management (PLM) where design tasks are often performed in teams and need a fluent communication system. The system allows distributed remote assembling in 3d scenes with real-time updates for the users. This paper covers this feature using hybrid networking solution: a client-server architecture (REST) for 3d rendering (webGL) and data persistence (NoSQL) associated to an automatically built peer-to-peer (P2P) mesh for real-time communication between the clients (webRTC). The approach is demonstrated through the development of a web-platform prototype focusing on the easy manipulation, fine rendering and light update messages for all participating users. We provide an architecture and a prototype to enable users to design in 3d together in real time with the benefits of web based online collaboration.

关键词： Computer aided design

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Thermal stress analysis of wafer-level multilayer stacking process for 3d-TSV packaging 23

Thermal stress analysis of wafer-level multilayer stacking p...

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23rd international conference on Electronic Packaging technology (ICEPT)

作者： Zhao, Shengjun Chen, Si Qin, Fei dai, Yanwei Gong, Yanpeng Beijing Univ Technol Fac Mat & Mfg Beijing Peoples R China China Elect Prod Reliabil & Environm Testing Res Sci & Technol Reliabil Phys & Applicat Elect Comp Guangzhou Peoples R China

ISBN: (数字)9781665499057

ISBN: (纸本)9781665499057

Through silicon via (TSV) and stacked bonding are the core technologies to perform vertical interconnect for 3d integration. For wafer-level multilayer stacking process, thermal stress is generated and accumulated due to the difference in thermal expansion coefficients of materials in each layer of the structure. due to the large thermal stress, the issue of failures in the stacking process are caused by solder joints almost. Hence, thermal stress analyses for multilayer stacking process are in urgent need. In this paper, a finite element model (FEM) is established to investigate the reliabilities for six layered TSV wafer bonded. Selected the General Plane deformation (GPd) FEM model as the simulation model for conserving computer resources and time because of the large number of TSVs. Birth and death element technology is applied, and descripted the procedure during the six layered wafer staking process. Considered three kinds of solder joint materials for SAC305, Sn63Pb37 and Sn10Pb90, and analyzed the von Mises stress and equivalent plastic strain.

关键词： Multilayer stacking Birth and death element 3d-TSVpackaging

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Semantic Search Engine with an Intuitive User Interface 23

Semantic Search Engine with an Intuitive User Interface

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23rd international conference on World Wide web (WWW)

作者： Styperek, Adam Ciesielczyk, Michal Szwabe, Andrzej Poznan Univ Tech Maria Sklodowska Curie Sq 5 PL-60965 Poznan Poland

ISBN: (纸本)9781450327459

It is crucial to enable regular users to explore rdF-compliant data bases in an effective way, regardless their knowledge about the SPARQL or the underlying ontology. Natural language querying have been proposed to address this issue. However it has unavoidably lower accuracy, as compared to systems with graph-based querying interfaces, which, in turn, are usually still too difficult for regular users. This paper presents a search system of user interface that is more user-friendly than widely known graph-based solutions.

关键词： Semantic web Search rdF SPARQL dBpedia

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PLASTIC: Providing Lightweight & Adaptable Service technology for Pervasive Information & Communication

PLASTIC: Providing Lightweight & Adaptable Service Technolog...

引用

23rd IEEE/acm international conference on Automated Software Engineering

作者： Bertolino, Antonia Emmerich, Wolfgang Inverardi, Paola Issarny, Valerie Liotopoulos, Fotis Plaza, Pierre CNR ISTI Pisa Italy UCL London England Univ Laquila Laquila Italy INRIA Paris Rocquencourt Paris France VTRIP Greek Greece Telephonica I D Madrid Spain

ISBN: (纸本)9781424427765

The PLASTIC project adopts and revisits service-oriented computing for Beyond 3(rd) Generation (B3G) networks, in particular aiming at assisting the development of services targeted at mobile devices. Specifically, PLASTIC introduces the PLASTIC platform to enable robust distributed lightweight services in B3G networking environments through: A development environment for the thorough development of SLA- and resource-aware services, which may be deployed on the various networked nodes, including handheld devices;A service-oriented middleware leveraging multi-radio devices and multi-network environments for applications and services deployed on mobile devices, further enabling context-aware and secure discovery and access to such services;A validation framework enabling off-line and on-line validation of networked services regarding functional and non-functional properties.

关键词： Middleware

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P2-29: Electron tunneling from a 3d nano-sphere

P2-29: Electron tunneling from a 3D nano-sphere

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23rd international Vacuum Nanoelectronics conference, IVNC 2010

作者： Filip, Lucian d. Carey, david J. Silva, S.R.P. Advanced Technology Institute University of Surrey Guildford Surrey GU2 7XH United Kingdom

A study of the 3d electron transfer from a spherical nano-particle in vacuum is presented as a continuation of a similar 1d analysis. The 3d confinement of the electronic states is analyzed and the emission current in... 详细信息

ISBN: (纸本)9781424478873

关键词： Nanoparticles

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Posphor-glass by the pressureless sintering for 3d printing technology 23

Posphor-glass by the pressureless sintering for 3D printing ...

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23rd international conference on Electronic Packaging technology (ICEPT)

作者： Wang, Yan Yang, Liang Han, Taiping Hu, deming Chen, Kun Xie, An Cao, Chunyan Shu, Xiayun Xiamen Univ Technol Sch Mat Sci & Engn Xiamen Peoples R China Xiamen Univ Technol Sch Mech Engn Xiamen Peoples R China

ISBN: (数字)9781665499057

ISBN: (纸本)9781665499057

At present, the vast majority of LEd products are packaged using a mixture of silicone/epoxy resin and phosphor, and there are problems such as silicone/epoxy resin aging, brightness drop, color drift, and shortened life in practical applications. Fluorescent glass/ceramic has high temperature corrosion resistance, rare earth ions are evenly distributed in glass ceramics, with better color stability and color uniformity;Rare earth-doped glass block material is easy to fix, which is conducive to deviceization. In this paper, amorphous silica nanoparticles are used to reduce the interface reaction between phosphors and silicon glass, silicate glass with high silicon content is the best matrix material for its high chemical and thermal stability, and the use of amorphous silicon nanoparticles to promote the densification process and the development of luminescent light curing composite slurry to promote its densification process. The pressureless sintering method mixes phosphors and amorphous silica nanoparticles, so that the mixture containing phosphor can be directly used for 3d printing technology, and special-shaped luminescents can be obtained through three-dimensional printing technology programming and its performance is guaranteed. The fluorescent paste 3d printing technology can be manufactured directly with complex shapes of color converters for rapid manufacturing.

关键词： Amorphous silicon nanoparticles 3d printing technology Pressureless sintering

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News from the Crowd: Grassroots and Collaborative Journalism in the digital Age 23

News from the Crowd: Grassroots and Collaborative Journalism...

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23rd international conference on World Wide web (WWW)

作者： Spangenberg, Jochen Heise, Nicolaus Deutsch Welle Voltastr 6 D-13355 Berlin Germany

ISBN: (纸本)9781450327459

Information content provided by members of the general public (mostly online) is playing an ever-increasing role in the detection, production and distribution of news. This paper investigates the concepts of (1) grassroots journalism and (2) collaborative journalism. It looks into similarities and differences and shows how both phenomena have been influenced by the emergence of the Internet and digital technologies. Then, the consequences for journalism in general will be analysed. Ultimately, strategies to meet the new challenges are suggested in order to maintain the quality and reliability of news coverage in the future.

关键词： Social Media Social Networks Citizen Journalism Collaborative Journalism Grassroots Journalism Social Media Analysis disruptions in the Media Sector Newsgathering Verification

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Real-Time Simplified Edge detector Architecture for 3d-HEVC depth Maps Coding

Real-Time Simplified Edge Detector Architecture for 3D-HEVC ...

引用

23rd IEEE international conference on Electronics, Circuits and Systems (ICECS)

作者： Sanchez, Gustavo Saldanha, Mario Porto, Marcelo Zatt, Bruno Agostini, Luciano Marcon, Cesar Pontif Catholic Univ Rio Grande do Sul Porto Alegre RS Brazil Inst Fed Farroupilha Alegrete Brazil Univ Fed Pelotas Pelotas Brazil

ISBN: (纸本)9781509061136

This paper introduces the Simplified Edge detector (SEd) architecture for 3d-HEVC depth maps coding. The SEd algorithm classifies the encoding block as homogeneous or edge. When SEd classifies the encoding block as homogeneous, the encoding is simplified skipping the bipartition modes evaluation. This approach is capable of reducing 96.7% the bipartition modes evaluation with a drawback of only 0.94% in Bd-rate. The SEd hardware is capable of providing the decision for all available blocks inside a 32x32 block in only 34 cycles, with a power dissipation of only 25 mu W per frame, when synthesized for 65 nm ST standard cells technology.

关键词： 3d-HEVC Intra-prediction mode Edge detector Hardware design

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