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检索条件"任意字段=3rd International Conference on Circuits, System and Simulation, ICCSS 2019"

共 736 条记录，以下是151-160 订阅

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Safety Analysis Method Considering Cascading Trips Based on Particle Swarm Optimization 3rd

Safety Analysis Method Considering Cascading Trips Based on ...

引用

3rd international conference on Wireless Communications and Applications,ICWCA 2019

作者： Deng, Hui Qiong Lin, Xing-Ying Wu, Peng-Peng Li, Qin-Bin Li, Chao-Gang School of Information Science and Engineering Fujian University of Technology Fujian350118 China Fujian Provincial University Engineering Research Center of Smart Grid Simulation Analysis and Integrated Control Fujian350118 China

ISBN: (纸本)9789811556968

View of preventing cascading trips, this paper mainly studies the security level model of how to effectively prevent cascading failures in the system is studied. First of all, from the point of view of relay protection, we consider the case of backup protection for current protection, by judging the electrical distance between the operating parameters of the branch and the relay protection fixed value after the initial fault of the system, it can be judged whether the branch will undergo cascading trips or not. Then, considering the critical state of cascading trips in branch grids, a safety index is proposed to measure the shortest distance between the critical state of power grids and the current operation state, and the specific calculation method is given. Finally, an optimization model is given, which aims to find the nearest state on the boundary from the current operation state. Aiming at this model, this paper presents a solution method based on PSO algorithm, which is verified by simulation through an example analysis. © 2021, Springer Nature Singapore Pte Ltd.

关键词： Particle swarm optimization (PSO)

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system Thermal Analysis of RF SiP Module in Smartphone 15

System Thermal Analysis of RF SiP Module in Smartphone

引用

15th international Microsystems, Packaging, Assembly and circuits Technology conference (IMPACT)

作者： Tsai, Cheng-Yu Chen, He Hu, Ian Chen, Dao-Long Tarng, David Hung, C. P. Adv Semicond Engn ASE Inc 26Chin 3rd Rd Kaohsiung 811 Taiwan

ISBN: (纸本)9781728198514

The structure of system-in-Package (SiP) in package series has been widely used for many years. A substrate-based platform combines more and more synchronous applied components such as antenna device, RF filter, PA, LNA, RF switch, CMOS, application processor and passives. Its application includes camera module, 5G RF FEM, WiFi module. The main strategies and advantages of SiP are small form factor, flexible design, low cost and time to market. However, the small form factor and high density components will bring more thermal issues. In this work, numerical simulation and experiments in real conditions are applied to compare and evaluate the thermal performance of the system device with SiP module. Compact and detailed models of SiP module will be put into a systemic smartphone and compare their difference. Also, all the passive components, main components, metal frame, gap pad, air and so on will be set into both the simulated model and thermal test. As for heat dissipation, which is directly relative to the thermal performance will also be calculated and considered. The test and simulation results show the main components which SoC and RF modules included, deviation will be lower than 2%. For thermal design, temperature of main components should be first considered. Heat pipe, high thermal pad and some external units, which can dissipate heat, can all be suggested to put into the system as systemic thermal solutions. However, the system thermal solution will induce thermal interaction between SoC and RF module. Thermal co-design for both system and package will be executed for optimizing the thermal performance of all the critical components in a smartphone.

关键词： system-in-package

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simulation Analysis of Mechanical Response of Wire Bonding in SiP under Thermal-mechanical-electrical Coupling Load 3

Simulation Analysis of Mechanical Response of Wire Bonding i...

引用

3rd IEEE international conference on Integrated circuits, Technologies and Applications, ICTA 2020

作者： Chen, Fangzhou Chen, Si Zhou, Bin Huang, Yun Qin, Fei Science and Technology on Reliability Physics and Application of Electronic Component Laboratory Guangzhou China Beijing University of Technology Beijing China

ISBN: (纸本)9781728180328

The heat dissipation of chips rise the risk for reliability of the system in package (SiP). Sequential coupling FEM simulation method was adopted to evaluate the reliability of SiP. The sub-model technology was used to analyze the thermo-mechanical response of gold wire leads in the whole SiP device. Based on the simulation, the stress and temperature distribution of the lead wires are obtained. The maximum value is compared with the ultimate strength to evaluate the reliability of the product under working conditions. © 2020 IEEE.

关键词： system-in-package

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Multi-Agent simulation modeling of Corona Virus Disease 2019 transmission based on various age groups

Multi-Agent simulation modeling of Corona Virus Disease 2019...

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international conference on Machine Learning, Big Data and Business Intelligence (MLBDBI)

作者： Li-Hu Pan Ya Su Hui-Min Yan Bin-Hone Xie Fen-vu Yang School of Computer Science and Technology Taiyuan University of Science and Technology Taiyuan China Institute of Geographic Sciences and Natural Resources Research Chinese Academy of Sciences Beijing China

ISBN: (纸本)9781665417914

Multi-Agent system (MAS) is an important branch of artificial intelligence research. This study uses the bottom-up characteristics of multi-agents to construct multi-agent simulation models for Corona Virus Disease 2019 (COVID-19) virus prevention and control based on different age groups. The development of the epidemic and the infection of residents of all ages under different prevention and control measures issued by the government were studied. The simulation results proved that the multi-agent modeling method could effectively capture the emergence of complex systems. Its experimental conclusions provided a basis for predicting the development of the epidemic and provide scientific support for government decision-making.

关键词： COVID-19 Epidemics Adaptation models Hospitals simulation Government Predictive models

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Study on Ventilation Performance in Operating Room with Variation Ventilation Design 3

Study on Ventilation Performance in Operating Room with Vari...

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3rd international conference on Forum in Research, Science, and Technology (FIRST)

作者： Wu, Yan-Lin Wu, Yu-Lieh Hanifan, Azka Hasya 57 Sec 2Zhongshan Rd Taichung 411 Taiwan

Proper air conditioning and ventilation system design for control of airborne bacteria is very important to reduce surgical site infection (SSI) risks in hospital operating rooms ( OR). This study used computational fluid dynamics (CFD) simulations to address the effect of ventilation and air-conditioning systems with different air-flow patterns, specifically, vertical laminar flow, horizontal laminar flow, and vertical using slot fan by measuring both ventilation and contaminant-removal efficiency. Contaminant concentrations in regions nearest to the operating table were compared and analyzed. The study found that cases 1 and 2 that are laminar airflow are very powerful in removing contaminant CO2 in the room than other case using slot fan (case 3, 4, and 5). The simulation result table obtained case 2 the best case in ventilation and removal efficiency. From the table results obtained that case 2 better 6.57 % in ventilation & 1.14 % in removal efficiency than case 1 as the second position result in simulation. The experiment results table obtained that case 2 better 9.3 % in ventilation & 1.68 % in removal efficiency than case 1 in the experiment. And also 20.75 % in ventilation & 12 % removal efficiency than case 3. However, a case using slot fan is better in terms of avoiding turbulence around the patient because of buoyancy effect. And it more affected for reducing surgical site infection (SSI) risks in hospital operating room. This happens because in that case, the areas such operations seem to create an air wall to protect contamination in the around surgical area and decreasing the buoyancy effect in the surgical area..

关键词： Ventilation

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3rd international conference on Materials Sciences and Nanomaterials, ICMSN 2019 and the 3rd international conference on Advanced Manufacturing and Materials, ICAMM 2019

3rd International Conference on Materials Sciences and Nanom...

引用

3rd international conference on Materials Sciences and Nanomaterials, ICMSN 2019 and the 3rd international conference on Advanced Manufacturing and Materials, ICAMM 2019

ISBN: (纸本)9783035715552

The proceedings contain 29 papers. The special focus in this conference is on Materials Sciences and Nanomaterials. The topics include: Formation of Co3O4 nanoparticles using moringa oleifera leaves extract through two phases system of hexane-water and their photocatalytic activity;synthesis and characterization of plasmon-enhanced sers substrate based on au-ag alloy-coated, large-area photonic (methyl methacrylate+styrene) co-polymer;in situ combustion synthesis in air of calcium titanate powders using minerals as a calcium source;13C/7Li Solid-state nuclear magnetic resonance study on poly(ethylene glycol)-poly(propylene glycol)-poly(ethylene glycol)/LiCF3SO3 copolymer electrolytes;Effect of silicon nitride (Si3N4) addition on the mechanical and tribological performance of al-fe-si alloy (AA8011);a design method for sound absorbing structure at low frequency;gelMa microbubbles prepared in microfluidics as suitable cell carriers;photo-crosslinkable double-network hyaluronic acid based hydrogel dressing;preparation and characterization of protein bioplastics from fish waste using different plasticizers;GLARE hydro-mechanical deep drawing analysis based on the forming depth;formability analysis of fiber metal laminates with different core and skin layers by stamping process;application of 3D printing in future manned space exploration;a closed-form solution for temperature profiles in selective laser melting of metal additive manufacturing;finite element simulation of the yoke spline under hot forging process;effects of bismuth content on the microstructure, shear strength and thermal properties of Sn-0.7Cu-0.05Ni solder joints;interfacial bonding behavior of stainless steel / carbon steel in cold rolling process;flat metal rolling simulation by finite volume method;Process development: Burr and film formation during high speed punching of extruded PC based polymers.

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Using Hardware-in-the-Loop simulation Platform for Empirical Testing of Photovoltaic system 3

Using Hardware-in-the-Loop Simulation Platform for Empirical...

引用

3rd IEEE international conference on Electronics Technology, ICET 2020

作者： Liu, Zhixing Li, Tianyu Shu, Mengyao Sun, Yaojie Ma, Lei Fudan University Department of Light Sources and Illuminating Engineering Shanghai China

ISBN: (纸本)9781728162836

The reliable operation of photovoltaic power generation systems is related to the security and stability of the power grid and is the focus of research today. During the operation of photovoltaic inverters, due to the constraints of the on-site environmental conditions, the empirical test of the reliability of photovoltaic inverters is mainly based on long-term operating data for analysis, which has problems such as long test cycle, high cost, and weak controllability. This paper proposes a new photovoltaic system simulation empirical test method, it uses a hardware-in-the-loop simulation platform to simulate the photovoltaic system, completes the analysis and calculation of the thermal characteristics and failure probability of key components of the inverter, compared with the case without considering the thermal characteristics of the bus capacitor, its reliability is reduced by 18.4%, which shows that the empirical test of photovoltaic systems can be completed through the hardware-in-the-loop simulation method. © 2020 IEEE.

关键词： Hardware-in-the-loop simulation

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The Software Design of the simulation Flight Thermal Environment system of the Hypersonic Aircraft

The Software Design of the Simulation Flight Thermal Environ...

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Science and Technology Innovation (IAECST), international Academic Exchange conference on

作者： Lei Chen Lei Mei College of Electrical Engineering and Control Science Nanjing Tech University Nanjing China

ISBN: (纸本)9781665402682

Aiming at the problem of transient comprehensive environment simulation of hypersonic aircraft flight environment, effectively improving the efficiency of hypersonic aircraft development and the reliability of thermal protection structure, and realizing ground simulation of the flight temperature environment of hypersonic aircraft, this paper adopts QT application framework and C++ the programming language has completed the development of the system software on Qt Creator 4.11.0, customized a communication protocol, and used the USB to serial communication method to build the communication line. And use Simulink software in Matlab2019a to simulate the temperature control algorithm. The PID algorithm, sliding mode control algorithm, and IPID control algorithm are used to conduct comparative experiments on temperature control. Practical application tests show that the ground pneumatic heating simulation control system can quickly heat the temperature to 800 degrees Celsius within 5 seconds, and the static control accuracy is 5%. The hardware part of the lower computer of the temperature control system is composed of heating module, voltage regulating module, temperature sensor module and stm32 main control module.

关键词： Heating systems Temperature sensors Target tracking Atmospheric modeling Computational modeling Software algorithms Prediction algorithms

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Design and simulation of Remote Monitoring system of 3D Printer Based on Cloud Platform 3

Design and Simulation of Remote Monitoring System of 3D Prin...

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3rd IEEE international conference on Automation, Electronics and Electrical Engineering, AUTEEE 2020

作者： Zhang, Xiuxia Chu, Jinquan Wei, Shuyi North Minzu University School of Information Engineering Yinchuan China

ISBN: (纸本)9781728198279

In order to realize remote monitoring of 3D printer and man-machine separation, thus saving manufacturing cost and personalized manufacturing. The cloud platform was configured by the rented cloud server, and then the communication protocol and firewall were added to enable the cloud platform to remotely access and control the upper computer. The 3D printing process was transmitted to the cloud platform by WiFi, and users can monitor the printing process in real time on the client. In addition, the SSIM algorithm was used to compare the pictures in the printing process with the pictures of real articles, and the cloud platform remote control and monitoring system was designed and implemented to realize man-machine separation. © 2020 IEEE.

关键词： Remote control

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Theoretical Study and simulation Analysis of Calculus Measurement system for VFTO 3

Theoretical Study and Simulation Analysis of Calculus Measur...

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3rd IEEE international conference on circuits, systems and Devices, ICCSD 2019

作者： Wang, Jiapei Lou, Jie Liu, Hongshun Lian, Haoran School of Electrical Engineering Shandong University Ji Nan China

ISBN: (纸本)9781728130637

In this paper, the calculus measurement system measuring fast transient overvoltage (VFTO) is analyzed and the parameters of each part of the system are calculated by theoretical calculation. The circuit is simulated by ATP-EMTP and the waveform of the result is compared with the ideal case, which shows that the response is affected by the stray parameters. To reduce the system error, two optimization schemes are proposed in this paper. First, the shielded electrode is replaced by the arch shield electrode in order to reduce the ground capacitance, and the possibility of creeping discharge and partial discharge. Second, resistors in series and capacitors in parallel are used to reduce the effect of residual inductance and residual inductance. The simulation results show that the effect of stray parameters can be effectively reduced. © 2019 IEEE.

关键词： Partial discharges

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