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检索条件"任意字段=3rd International Symposium on Code Generation and Optimization"
319 条 记 录,以下是151-160 订阅
排序:
Knowledge - augmented Genetic Algorithms for effective Instruction Template Selection in compilers
Knowledge - augmented Genetic Algorithms for effective Instr...
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3rd international Conference on Advances in Computing and Communications (ICACC)
作者: Mahalingam, P. R. Rajagiri Sch Engn & Technol Dept Comp Sci & Engn Kochi Kerala India
Compilers form one of the most basic components in computing today. The high-level programs used to form applications are translated to assembly code by the compiler, and subsequently to machine code by the assembler.... 详细信息
来源: 评论
The Development of Special CNC System for Profiling Lathe Based On Digital Capture Measurement
The Development of Special CNC System for Profiling Lathe Ba...
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3rd international Conference on Applied Mechanics, Materials and Manufacturing (ICAMMM 2013)
作者: Wang, Pingjiang Wu, Yang Qi, Jiangfei Chen, Jihong Xiang, Hua Huazhong Univ Sci & Technol Natl Numer Control Syst Engn Res Ctr Wuhan 430074 Hubei Peoples R China
Aimed at the goal of digital capture function for CNC profiling lathe, it has conducted researches on the key technologies of CNC system development, including automatic profiling measurement, profiling data collectio... 详细信息
来源: 评论
Analysis on the Effect of Transmission Power Applied to Small Cells in LTE-Advanced Downlink
Analysis on the Effect of Transmission Power Applied to Smal...
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international symposium on Intelligent Signal Processing and Communications Systems (ISPACS)
作者: Fushiki, Masashi Akimoto, Yosuke Konishi, Satoshi KDDI R&D Labs Inc Fujimino Saitama Japan
In order to cope with huge mobile data traffic, 3GPP (3rd generation Partnership Project) has started to discuss the architecture and optimization of a network that introduces a large amount of small base stations (sm... 详细信息
来源: 评论
Research of HLA federate automatically generation tool in equipment support simulation
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2013 3rd international symposium on Chemical Engineering and Material Properties, ISCEMP 2013
作者: Qu, Chang-Zheng Gu, Hong-Qiang Gao, Lu Lv, Xue-Zhi Department of Equipment Command and Management Mechanical Engineering College Shijiazhuang Hebei China Teaching and Research Section of Simulation Training Artillery Training Base of General Staff Xuanhua Hebei China
HLA (High Level Architecture) is a standard to promote the interoperation and the reuse of the simulation models. In the simulation federation development based on HLA/RTI, how to simplify the process of creating fede... 详细信息
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Analysis and Research of the BPM model optimization based on dynamic process mining
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2013 3rd international symposium on Chemical Engineering and Material Properties, ISCEMP 2013
作者: Yang, Zhen Yu Geng, Yu Shui Wang, Xin Gang Qilu University of Technology Jinan China
The process mining is the BPM workflow re-analysis and design of a key technology, refers to a structured procedure describes the method execution information extracted from a real process, also known as the mining wo... 详细信息
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Flow field analysis and structure optimization of water hydraulic poppet valve based on the CFD
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2013 3rd international symposium on Chemical Engineering and Material Properties, ISCEMP 2013
作者: Xia, Qiu Guang, Xiang Pan School of Mechanical Engineering Anhui University of Science and Technology Huainan China
This paper builds two water hydraulic poppet valve models which are of different structure, and simulation analysis used by FLUENT software on it's internal flow field. The analysis results show that, after improv... 详细信息
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A comparative study of the influence of codification on discrete optimum design of frame structures
A comparative study of the influence of codification on disc...
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3rd international Conference on Soft Computing Technology in Civil, Structural and Environmental Engineering, CSC 2013
作者: Greiner, D. Diaz, N. Emperador, J.M. Galvan, B. Winter, G. Universidad de Las Palmas Gran Canaria Spain
This paper is concerned with the influence of the codification type on the optimization of frame structures for constrained minimum weight, when using discrete variables: cross-section types corresponding to standard ... 详细信息
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Deposited ALD SiO2 High-k/Metal gate Interface for High Voltage Analog and I/O Devices on Next generation Alternative Channels and FINFET Device Structures
Deposited ALD SiO<sub>2</sub> High-k/Metal gate Interface fo...
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3rd international symposium on Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications
作者: Siddiqui, S. Chowdhury, M. M. Brodsky, M. J. Rahim, N. Dai, M. Krishnan, S. Fugardi, S. Wu, E. Chou, A. Narasimha, S. Li, J. Mcstay, K. Linder, B. Maciejewski, E. Rettmann, R. Mittl, S. Kwon, U. Narayanan, V. Henson, W. Schepis, D. Chudzik, M. IBM Corp Semicond Res & Dev Ctr Hopewell Jct NY 12533 USA
A highly reliable SiO2 deposited by atomic layer deposition (ALD) as a gate dielectric interface layer with high-k/metal gate (HKMG) in high voltage I/O field effect transistor (FETs) for advanced technologies has bee... 详细信息
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Design of SCFDMA System Using MIMO
Design of SCFDMA System Using MIMO
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1st international symposium on Intelligent Informatics (ISI 12)
作者: Kapadia, Kaushik Tyagi, Anshul Indian Inst Technol Commun Syst E&C Dept Roorkee Uttarakhand India
The aim of paper is to design SCFDMA system using SFBC and receiver diversity which provides satisfactory performance over fast fading channel environment. The performance evaluation will be checked through MATLAB R20... 详细信息
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On the optimization of ebeam lithography using Hydrogen SilsesQuioxane (HSQ) for innovative self-aligned CMOS process
On the optimization of ebeam lithography using Hydrogen Sils...
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3rd international symposium on Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications
作者: Coquand, R. Monfray, S. Pradelles, J. Martin, L. Samson, M. -P. Bustos, J. Barraud, S. Boeuf, F. Skotnicki, T. Ghibaudo, G. Poiroux, T. Faynot, O. STMicroelect Crolles 850 Rue Jean Monnet F-38926 Crolles France CEA LETI Grenoble France IMEP LAHC Grenoble F-38054 Grenoble 9 France MINATEC BHT ASELTA Nanograph F-38040 Grenoble France
Next generation CMOS architectures tend to thin-film devices and multi-gate devices, such as FinFET or TriGate [1,2], and ultimately to Gate-All-Around devices thanks to their higher electrostatics immunity at short g... 详细信息
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