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检索条件"任意字段=4th Conference on Design and Process Integration for Microelectronic Manufacturing"
829 条 记 录,以下是1-10 订阅
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Research on integrated Development of Footwear design and manufacturing based on Digital Twin  4
Research on integrated Development of Footwear Design and Ma...
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4th International conference on Intelligent design, ICID 2023
作者: Qiang, Wei Pashkevych, K. Luo, Xiangdong Shaanxi University of Science and Technology College of Design and Art Xi'an China Kyiv National University of Technologies and Design Kyiv Ukraine
design is the first part of realizing smart manufacturing, and the study of digital twin-based footwear product design and manufacturing integration has an important impact on the subsequent parts processing, assembly... 详细信息
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Electrical Demand Analysis and System design for Medium-Density Fibreboard (MDF) manufacturing  4
Electrical Demand Analysis and System Design for Medium-Dens...
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4th International conference on Emerging Smart Technologies and Applications (eSmarTA)
作者: Osman, Said Saif, Eiad Eminoglu, Ilyas Ondokuz Mayis Univ Dept Elect & Elect Engn Samsun Turkiye Sanaa Community Coll Dept Comp & Elect Engn Sanaa Yemen
Medium-density fiberboard (MDF), a widely used wood composite, suffers from limited electrical conductivity, restricting its integration into electronic applications. this study addresses this limitation by analyzing ... 详细信息
来源: 评论
Modeling and Digital Twins: Insights and Strategies for Software Engineers
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IEEE SOFTWARE 2025年 第2期42卷 92-96页
作者: Abrahao, Silvia Staron, Miroslaw Michael, Judith Combemale, Benoit Chechik, Marsha Univ Politecn Valencia Dept Comp Syst & Computat Software Engn Valencia 46022 Spain Chalmers Univ Technol Comp Sci & Engn Dept Interact Design & Software Engn Div SE-41296 Gothenburg Sweden Univ Gothenburg SE-41296 Gothenburg Sweden Rhein Westfal TH Aachen Chair Software Engn D-52062 Aachen Germany Univ Rennes Dept Comp Sci F-35065 Rennes France Univ Toronto Dept Comp Sci Toronto ON M5S 2E4 Canada
Software modeling and digital twins are transforming the way software engineers design, operate, and maintain complex systems. In this column, we highlight cutting-edge research presented at the ACM/IEEE 27th Internat... 详细信息
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Research on Reliability Risk-Based Microstructure Evaluation Method for Integrated Circuits  25
Research on Reliability Risk-Based Microstructure Evaluation...
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25th International conference on Electronic Packaging Technology (ICEPT)
作者: Chen, Mian-Zhi Cai, Jin-Bao He, Sheng-Zong Liang, He Yong, Wang Kong, Ling-Ming Jun, Chen Wu, Jing-Xi Guangzhou Power Supply Bur Guangzhou Peoples R China CEPREI Lab Guangzhou Peoples R China
the reliability of design, process, inner microstructure and material used in integrated circuit is the key to determining the inherent reliability level of the device itself. With the continuous updating and iteratio... 详细信息
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design and Implementation of a Web-based Collaborative manufacturing System Based on Knowledge Graph  4
Design and Implementation of a Web-based Collaborative Manuf...
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4th IEEE International conference on Digital Twins and Parallel Intelligence, DTPI 2024
作者: Yuan, Meng Wu, Huaiyu Shen, Zhen Han, Yunjun Zhou, Jiehan Yue, Zhijian Xiong, Gang Chinese Academy of Sciences State Key Laboratory of Multimodal Artificial Intelligence Systems Institute of Automation Beijing100190 China University of Chinese Academy of Sciences School of Artificial Intelligence Beijing100049 China Chinese Academy of Sciences Guangdong Engineering Research Center of 3D Printing and Intelligent Manufacturing Cloud Computing Center Dongguan523808 China Qingdao Academy of Intelligent Industries Intelligent Manufacturing Center Qingdao266109 China University of Oulu Faculty of Information Technology and Electrical Engineering OuluTS352 Finland
Collaborative manufacturing is central to agile, intelligent, and cloud-based manufacturing paradigms. this paper presents the design and implementation of a web-based collaborative manufacturing system based on a kno... 详细信息
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A Continuous Ramp Generator design for Column-Parallel CMOS Image Sensors Utilizing Novel Row-wise Noise Suppression Techniques  4
A Continuous Ramp Generator Design for Column-Parallel CMOS ...
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4th International conference on Electronic Information Engineering and Computer Communication, EIECC 2024
作者: Liu, Xiaoxuan Cao, Tianjiao Li, Haisong Li, Ting Xi'an Microelectronic Technology Institute Xi'an China
this paper presents a novel continuous ramp generator designed for single-slope ADC (SS-ADC) architecture CMOS image sensors (CIS), with the aim of reducing row-wise noise. Based on traditional continuous ramp generat... 详细信息
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A Coherent integration process Performed at Sub-Pulse Level for Interpulse-Intrapulse Joint Frequency Agility Waveform  4
A Coherent Integration Process Performed at Sub-Pulse Level ...
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4th International conference on Electronic Information Engineering and Computer Technology, EIECT 2024
作者: Xia, Le Wang, Fulai Pang, Chen The College of Electronic Science and Technology National University of Defense Technology Changsha China
With the advancement of waveform generator technology, waveform design has become an active anti-jamming method where frequency agility is a primary approach. While frequency agility serves to enhance the performance ... 详细信息
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4th International conference on design Tools and Methods in Industrial Engineering, ADM 2024
4th International Conference on Design Tools and Methods in ...
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4th International conference on design Tools and Methods in Industrial Engineering, ADM 2024
the proceedings contain 157 papers. the special focus in this conference is on design Tools and Methods in Industrial Engineering. the topics include: the Simultaneous Effect of FFF Build Orientation on Tensile Streng...
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4th International conference on design Tools and Methods in Industrial Engineering, ADM 2024
4th International Conference on Design Tools and Methods in ...
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4th International conference on design Tools and Methods in Industrial Engineering, ADM 2024
the proceedings contain 157 papers. the special focus in this conference is on design Tools and Methods in Industrial Engineering. the topics include: the Simultaneous Effect of FFF Build Orientation on Tensile Streng...
来源: 评论
integration Between AI and TRIZ for Technical Innovation  4th
Integration Between AI and TRIZ for Technical Innovation
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4th International conference of the Italian Association of design Methods and Tools for Industrial Engineering
作者: Freddi, Marco Galie, Giulio Donnici, Giampiero Giusti, Irene Francia, Daniela Univ Bologna Alma Mater Studiorum Viale Risorgimento 2 I-40136 Bologna Italy
the main objective of the following study is to analyze the potential offered by the integration of artificial intelligence (AI) with another methodology known in the literature and in the industrial field. TRIZ (theo... 详细信息
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