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4th International conference on Intelligent design, ICID 2023

作者： Qiang, Wei Pashkevych, K. Luo, Xiangdong Shaanxi University of Science and Technology College of Design and Art Xi'an China Kyiv National University of Technologies and Design Kyiv Ukraine

ISBN: (纸本)9798350342574

design is the first part of realizing smart manufacturing, and the study of digital twin-based footwear product design and manufacturing integration has an important impact on the subsequent parts processing, assembly, testing and operation and maintenance. In order to make the digital twin technology serve the deep integration of footwear product design and manufacturing, through the interaction and iteration of information and physics in the footwear R & D process, and ultimately realize the intelligent customized R & D mode that serves the whole life cycle of footwear products. To this end, this paper systematically analyzes the connotation of footwear product design and manufacturing integration based on digital twins;proposes a three-layer architecture of footwear product design based on digital twins;and based on the framework, discusses the key technologies of footwear product design and manufacturing integration based on digital twins from the frameworks of acquisition of footwear personalized design requirements, conceptual design mode, personalized function configuration and virtual prototype technology. © 2023 IEEE.

关键词： Product design

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Electrical Demand Analysis and System design for Medium-Density Fibreboard (MDF) manufacturing 4

Electrical Demand Analysis and System Design for Medium-Dens...

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4th International conference on Emerging Smart Technologies and Applications (eSmarTA)

作者： Osman, Said Saif, Eiad Eminoglu, Ilyas Ondokuz Mayis Univ Dept Elect & Elect Engn Samsun Turkiye Sanaa Community Coll Dept Comp & Elect Engn Sanaa Yemen

ISBN: (纸本)9798350354140;9798350354133

Medium-density fiberboard (MDF), a widely used wood composite, suffers from limited electrical conductivity, restricting its integration into electronic applications. this study addresses this limitation by analyzing the power demands of an MDF factory. the production process is divided into four operational areas, including stages of preparing wood, fibers, shaping, finishing, pressing, and handling. A consistent approach was applied to determine the required power capacity for each area. this approach involved calculating the common demand for energy for all equipment taking into account peak loads and efficiency losses. the analysis outlines the main electrical requirements for each MDF panel production process, analyzes the energy demand profile, and proposes a detailed design for the electrical system, including energy efficiency and safety considerations. the findings indicate that the following transformer capacities are required: 2500 kVA for wood preparation and energy generation, 1600 kVA for pressing and handling, and 4000 kVA for refining. Shaping and finishing also require a 2500 kVA transformer. By estimating energy needs for each production stage, this study provides valuable insights for improving the electrical infrastructure design and paves the way for cost savings and environmental benefits in MDF manufacturing across various industries.

关键词： MDF Factory Production process Electrical design Power Demand

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Modeling and Digital Twins: Insights and Strategies for Software Engineers

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IEEE SOFTWARE 2025年第2期42卷 92-96页

作者： Abrahao, Silvia Staron, Miroslaw Michael, Judith Combemale, Benoit Chechik, Marsha Univ Politecn Valencia Dept Comp Syst & Computat Software Engn Valencia 46022 Spain Chalmers Univ Technol Comp Sci & Engn Dept Interact Design & Software Engn Div SE-41296 Gothenburg Sweden Univ Gothenburg SE-41296 Gothenburg Sweden Rhein Westfal TH Aachen Chair Software Engn D-52062 Aachen Germany Univ Rennes Dept Comp Sci F-35065 Rennes France Univ Toronto Dept Comp Sci Toronto ON M5S 2E4 Canada

Software modeling and digital twins are transforming the way software engineers design, operate, and maintain complex systems. In this column, we highlight cutting-edge research presented at the ACM/IEEE 27th International conference on Model-Driven Engineering Languages and Systems (MODELS 2024) and the 1st International conference on Engineering Digital Twins (EDTconf 2024). the selected papers tackle critical challenges in improving system understanding, enhancing stakeholder communication, streamlining design and development processes, optimizing lifecycles, and enabling seamless integration of complex systems.

关键词： Software Model Driven Engineering Digital Twins Stakeholders Complex Systems Software Technology Digital Twin Complex Systems design process Systems Engineering Modeling Techniques International conference Sequence Diagram Federation Syntactic Natural Language Variety Of Sources Power Grid manufacturing Industry Application Programming Interface Automotive Industry Ethical Requirements Rule Based Approach Smart Meters Space Technology Agile Development Automotive manufacturing Semantic Interoperability Domain Specific Languages

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Research on Reliability Risk-Based Microstructure Evaluation Method for Integrated Circuits 25

Research on Reliability Risk-Based Microstructure Evaluation...

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25th International conference on Electronic Packaging Technology (ICEPT)

作者： Chen, Mian-Zhi Cai, Jin-Bao He, Sheng-Zong Liang, He Yong, Wang Kong, Ling-Ming Jun, Chen Wu, Jing-Xi Guangzhou Power Supply Bur Guangzhou Peoples R China CEPREI Lab Guangzhou Peoples R China

ISBN: (纸本)9798350353808

the reliability of design, process, inner microstructure and material used in integrated circuit is the key to determining the inherent reliability level of the device itself. With the continuous updating and iteration of integrated circuit manufacturing processes, the size of process microstructure is getting smaller and the integration degree is getting higher. As a result, issues related to circuit design layout, manufacturing process, packaging process, and material reliability have gradually become key influencing factors affecting the reliability level of integrated circuits themselves. How to conduct quality inspection and reliability evaluation on newly developed integrated circuits, effectively identify defects and weak links that affect device quality and application reliability, and fully verify the true reliability level of devices, has very important practical significance. this study proposes a reliability risk based integrated circuit microstructure evaluation method, which analyzes the key elements that affect device reliability in advance and establishes corresponding testing and evaluation items. through physical testing and verification of the device, the real reliability risks of the device can be identified and provide a basis for device design, process improvement, selection, and application design. this method aims to provide integrated circuit users with an effective means of quality inspection and reliability evaluation to ensure the inherent reliability of microelectronic devices.

关键词： integrated circuits microstructure reliability risks reliability assessments failure mechanisms process issues

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design and Implementation of a Web-based Collaborative manufacturing System Based on Knowledge Graph 4

Design and Implementation of a Web-based Collaborative Manuf...

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4th IEEE International conference on Digital Twins and Parallel Intelligence, DTPI 2024

作者： Yuan, Meng Wu, Huaiyu Shen, Zhen Han, Yunjun Zhou, Jiehan Yue, Zhijian Xiong, Gang Chinese Academy of Sciences State Key Laboratory of Multimodal Artificial Intelligence Systems Institute of Automation Beijing100190 China University of Chinese Academy of Sciences School of Artificial Intelligence Beijing100049 China Chinese Academy of Sciences Guangdong Engineering Research Center of 3D Printing and Intelligent Manufacturing Cloud Computing Center Dongguan523808 China Qingdao Academy of Intelligent Industries Intelligent Manufacturing Center Qingdao266109 China University of Oulu Faculty of Information Technology and Electrical Engineering OuluTS352 Finland

ISBN: (纸本)9798350349252

Collaborative manufacturing is central to agile, intelligent, and cloud-based manufacturing paradigms. this paper presents the design and implementation of a web-based collaborative manufacturing system based on a knowledge graph (KG). the system achieves the full spectrum of knowledge extraction, fusion, and reasoning across the industrial chain, thereby enhancing efficiency and reducing operational costs. the proposed system constructs an industrial chain KG and multi-agent systems, offering comprehensive digital services across the manufacturing value chain. It supports the integration of business processes, data, and standard information for enterprise groups, presenting collaborative manufacturing data of the industrial chain in real-time visualization. the paper further discusses a method for real-time perception of anomalies in the collaborative manufacturing process, utilizing expert knowledge and data-driven insights to construct an operational risk KG. the system's architecture, workflow, and functional design are detailed, along with application cases in visual dynamic management. the conclusion underscores the system's potential to improve supply-demand chain management and operational efficiency in collaborative manufacturing. © 2024 IEEE.

关键词： Smart manufacturing

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A Continuous Ramp Generator design for Column-Parallel CMOS Image Sensors Utilizing Novel Row-wise Noise Suppression Techniques 4

A Continuous Ramp Generator Design for Column-Parallel CMOS ...

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4th International conference on Electronic Information Engineering and Computer Communication, EIECC 2024

作者： Liu, Xiaoxuan Cao, Tianjiao Li, Haisong Li, Ting Xi'an Microelectronic Technology Institute Xi'an China

ISBN: (纸本)9798331534622

this paper presents a novel continuous ramp generator designed for single-slope ADC (SS-ADC) architecture CMOS image sensors (CIS), with the aim of reducing row-wise noise. Based on traditional continuous ramp generators, two additional sampling capacitors are used to reduce the noise in the ramp reset voltage and the integration current, which can cause irregular horizontal stripes in images, especially in low-light conditions. By employing digital correlated double sampling (DCDS) techniques, the sampling capacitors sample the reset voltage and the current source bias voltage before the ramp voltage rises, ensuring that the conditions for generating the two ramp voltages are essentially the same, thereby suppressing the impact of noise fluctuations on the count value. through the fabrication and testing of a CMOS image sensor using 350nm/55nm process, the proposed method has been proven to reduce row noise by 80%, demonstrating excellent row noise suppression performance. © 2024 IEEE.

关键词： CMOS integrated circuits

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A Coherent integration process Performed at Sub-Pulse Level for Interpulse-Intrapulse Joint Frequency Agility Waveform 4

A Coherent Integration Process Performed at Sub-Pulse Level ...

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4th International conference on Electronic Information Engineering and Computer Technology, EIECT 2024

作者： Xia, Le Wang, Fulai Pang, Chen The College of Electronic Science and Technology National University of Defense Technology Changsha China

ISBN: (纸本)9798331528850

With the advancement of waveform generator technology, waveform design has become an active anti-jamming method where frequency agility is a primary approach. While frequency agility serves to enhance the performance of the radar, it concomitantly increases the difficulty of signal processing. Focus on the problem of coherent integration in interpulse-intrapulse joint frequency agility waveform, a novel process performed at the sub-pulse level is proposed, which is based on modified non-uniform discrete Fourier transform. In addition, velocity estimation waveform design is introduced to solve the range cell migration and velocity blurring. Simulations illustrate that this process has a good performance on moving target. © 2024 IEEE.

关键词： Discrete Fourier transforms

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4th International conference on design Tools and Methods in Industrial Engineering, ADM 2024

4th International Conference on Design Tools and Methods in ...

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4th International conference on design Tools and Methods in Industrial Engineering, ADM 2024

ISBN: (纸本)9783031765933

the proceedings contain 157 papers. the special focus in this conference is on design Tools and Methods in Industrial Engineering. the topics include: the Simultaneous Effect of FFF Build Orientation on Tensile Strength, Flatness and Roughness;reasons Behind Selecting a manufacturing process: A Semi-structured Interview Study;2D Frequency-Based Topological Optimization: Machine Learning to Aid Tuning Simulation Parameters;A Short Overview of Optimization Methods for BCC, FCC and Octet Lattice Structure;advancements in design of Personalized Bone Scaffolds and Fabrication through 3D Printing;lightweighting of a Kart Connecting Rod in Additive manufacturing;design of a Local Heating System for Cost-Effective Fused Filament Fabrication of PEEK;a Multi-Criteria Analysis Method in Algorithm-Driven design;a design Method for Graded Density Components by Polylactic Acid Foaming via Material Extrusion;A New BCC Lattice Modelling Approach through a Neural Network Optimisation;design and Assessment of Functionally Graded Lattices;A Strategy Towards In Situ Monitoring and Quality Assessment of 3D Components Manufactured by FDM: Preliminary Features;integration Between AI and TRIZ for Technical Innovation;engineering design and Prototyping Methodology in Complex Environments: the In-Bore Welding Tool;machine Learning for Costing Sheet Metals;Application of a Simplified Value Analysis Methodology (VAM-2P) and CAD/CAE Tools to Agro-Industrial Product Redesign: Harvesting Trolley Case Study;Preliminary Concept design of an Innovative Under-Actuated Gripper for the Remote Handling Operations in the RFX-Mod2 Fusion Machine;Preliminary design of a General Control Architecture for the DTT Remote Handling Facility;study and Application of a New Index to Support design for Disassembly;digital Product Passports: A Framework for Developing Adaptable and Compliant Data Models.

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4th International conference on design Tools and Methods in Industrial Engineering, ADM 2024

4th International Conference on Design Tools and Methods in ...

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4th International conference on design Tools and Methods in Industrial Engineering, ADM 2024

ISBN: (纸本)9783031765964

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integration Between AI and TRIZ for Technical Innovation 4th

Integration Between AI and TRIZ for Technical Innovation

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4th International conference of the Italian Association of design Methods and Tools for Industrial Engineering

作者： Freddi, Marco Galie, Giulio Donnici, Giampiero Giusti, Irene Francia, Daniela Univ Bologna Alma Mater Studiorum Viale Risorgimento 2 I-40136 Bologna Italy

ISBN: (纸本)9783031765964;9783031765971

the main objective of the following study is to analyze the potential offered by the integration of artificial intelligence (AI) with another methodology known in the literature and in the industrial field. TRIZ (theory of Inventive Problem Solving) is here enhanced with some language-based AI (such as ChatGPT or Bard) to speed up the process of generating ideas. In this case, integration with AI finds greater potential when it is applied during the definition of the concept or product architecture. Finally, the case study of a drone developed for the collection of plastics is used as a practical example to show the pros and cons related to the integration of AI with TRIZ.

关键词： AI TRIZ Concept Product Architecture Optimization

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