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检索条件"任意字段=Advanced Etch Technology and Process Integration for Nanopatterning XII 2023"
16 条 记 录,以下是1-10 订阅
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advanced etch technology and process integration for nanopatterning xii
Advanced Etch Technology and Process Integration for Nanopat...
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advanced etch technology and process integration for nanopatterning xii 2023
The proceedings contain 22 papers. The topics discussed include: evaluation of TiN hardmask films to prevent line wiggling due to plasma-induced film stress;process optimization for shallow trench isolation etch using...
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Advances in low GWP etch gasses  12
Advances in low GWP etch gasses
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advanced etch technology and process integration for nanopatterning xii 2023
作者: Jennings, Colin Nguyen, Phong Biltek, Scott Stafford, Nathan Innovation Campus Delaware Air Liquide 200 GBC Dr NewarkDE19702 United States
Fluorinated species are ubiquitous in semiconductor manufacturing, yet are known to have global warming potentials thousands of times higher than CO2. As abatement technologies are not completely effective and add add... 详细信息
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Radical-based surface treatment and selective etch enabled by high density ICP remote plasma source  12
Radical-based surface treatment and selective etch enabled b...
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advanced etch technology and process integration for nanopatterning xii 2023
作者: Zhang, Qi Yang, Haichun Hsieh, Yueh-Ling Chen, Jiajun Yang, Jiaying Xie, Ting Wang, Shanyu Chung, Hua Mattson Technology Inc. FremontCA94538 United States
With Moore's law continues to drive IC feature size and device density, advanced technology evolves to enable not only smaller feature size but also 3D structures for logic and memory chipmakers.1 The associated p... 详细信息
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Opportunities and challenges of heterogeneous integration: from IC packaging POV  12
Opportunities and challenges of heterogeneous integration: f...
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advanced etch technology and process integration for nanopatterning xii 2023
作者: Chiang, Jeffery Wu, Paul Hsinchu Science Park Branch Powertech Technology Inc. No. 15 Lixing 3rd Rd. Hsinchu Science Park Hsinchu City30078 Taiwan
The IC assembly industry has gone a full circle over the course of 50 years. At the beginning, everything was discretely packaged, but with the introduction of integrated circuits and advancement of lithograph y techn... 详细信息
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Enabling process technologies for advanced logic devices beyond FinFET era  12
Enabling process technologies for advanced logic devices bey...
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advanced etch technology and process integration for nanopatterning xii 2023
作者: Yamamoto, Tomonari Tokyo Electron Ltd. 3-1 Akasaka 5-chome Minato-ku Tokyo107-6325 Japan
This invited talk describes the enabling process technologies for advanced logic devices beyond FinFET era. Gate-all-around (GAA) improves electrostatics over FinFET and enables continuous gate length scaling. Complem... 详细信息
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Sustainable semiconductor manufacturing: lessons for lithography and etch  12
Sustainable semiconductor manufacturing: lessons for lithogr...
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advanced etch technology and process integration for nanopatterning xii 2023
作者: Gallagher, Emily Bezard, Philippe Boakes, Lizzie Firrincieli, Andrea Rolin, Cedric Ragnarsson, Lars-Åke Imec Vzw Kapeldreef 75 Leuven Belgium
Sustainability is gaining momentum as countries and companies announce targets for net-zero carbon emissions by 2050. imec has created a bottom-up model using tool data, process recipes, and integrated wafer process f... 详细信息
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process optimization for shallow trench isolation etch using computational models  12
Process optimization for shallow trench isolation etch using...
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advanced etch technology and process integration for nanopatterning xii 2023
作者: Huang, Shuo Panneerchelvam, Prem Huard, Chad M. Sridhar, Shyam Ventzek, Peter L. G. Smith, Mark D. Kla Corporation 1200 Woodridge Ave Ann ArborMI48105 United States Kla Corporation 8834 N. Capital of Texas HW Suite 301 AustinTX78759 United States Tokyo Electron America Inc. 2400 Grove Blvd. AustinTX78741 United States Kla Corporation 1 Technology Drive MilpitasCA95035 United States
In today's advanced semiconductor process manufacturing, critical dimensions of device features have decreased to a few nanometers while the aspect ratios have increased beyond 100. The cost of process development... 详细信息
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A novel approach to etch-process-aware intensive layout retarget  12
A novel approach to etch-process-aware intensive layout reta...
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advanced etch technology and process integration for nanopatterning xii 2023
作者: Lee, Jeeyong Heo, Yangwoo Lee, Ryanggeun Kim, Sangwook Hong, Jisuk Koo, Kyoil Yim, Changmook Kim, Jungmin Lee, Sooyong Kim, Joonsung Kim, Dongho Yang, Seung-Hune Jeong, Seongtae Samsung Electronics Co. Ltd. Samsung Jeonja-ro #1 Hwasung18448 Korea Republic of
Patterning, a major process in semiconductor manufacturing, aims to transfer the design layout to the wafer. Accordingly, the "process proximity correction"method was developed to overcome the difference in ... 详细信息
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The impact of electron temperature on etch profiles in Ar/CF4 plasmas  14
The impact of electron temperature on etch profiles in Ar/CF...
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advanced etch technology and process integration for nanopatterning XIV
作者: Kim, Nayeon Park, Junyoung Choi, Jung-Eun Kim, Min-Seok Lee, MyeongJae Chung, Chin-Wook Department of Electrical Engineering Hanyang University Seoul04763 Korea Republic of Department of Physics Hanyang University Seoul04763 Korea Republic of
As high aspect ratio etching becomes increasingly essential in semiconductor manufacturing, vertical etching has gained significant importance. This study investigates the reduction of undercut in silicon (Si) pattern... 详细信息
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Understanding etch properties of advanced chemically amplified EUV resist  12
Understanding etch properties of advanced chemically amplifi...
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advanced etch technology and process integration for nanopatterning xii 2023
作者: Park, Jong Keun Aqad, Emad Cen, Yinjie Coley, Suzanne M. Cui, Li Hoelzel, Conner Naab, Benjamin D. Lee, Choongbong Rena, Rochelle Kang, Philjae Shin, You Rim Limberg, David Zhang, Lei DuPont Electronics and Industrial 455 Forest Street MarlboroughMA01752 United States DuPont Electronics and Industrial 20 Samsung 1-Ro 5-Gil Hwaseong Gyeonggi-Do18449 Korea Republic of DuPont Science and Innovation 200 Powder Mill Road WilmingtonDE19803 United States
Extreme ultraviolet (EUV) lithography technology empowers integrated circuit industry to mass produce chips with smaller pitches and higher density. Along with EUV tool advancement, significant progress has also been ... 详细信息
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