咨询与建议

限定检索结果

文献类型

  • 970 篇 会议
  • 136 篇 期刊文献

馆藏范围

  • 1,106 篇 电子文献
  • 0 种 纸本馆藏

日期分布

学科分类号

  • 662 篇 工学
    • 495 篇 电气工程
    • 244 篇 电子科学与技术(可...
    • 95 篇 计算机科学与技术...
    • 86 篇 信息与通信工程
    • 85 篇 材料科学与工程(可...
    • 29 篇 软件工程
    • 16 篇 控制科学与工程
    • 14 篇 仪器科学与技术
    • 11 篇 化学工程与技术
    • 7 篇 冶金工程
    • 6 篇 光学工程
    • 5 篇 动力工程及工程热...
    • 4 篇 建筑学
    • 2 篇 力学(可授工学、理...
    • 2 篇 轻工技术与工程
    • 1 篇 机械工程
    • 1 篇 土木工程
    • 1 篇 测绘科学与技术
    • 1 篇 航空宇航科学与技...
  • 136 篇 理学
    • 117 篇 物理学
    • 23 篇 数学
    • 12 篇 化学
    • 4 篇 统计学(可授理学、...
    • 1 篇 系统科学
  • 35 篇 管理学
    • 34 篇 管理科学与工程(可...
    • 6 篇 工商管理
  • 6 篇 经济学
    • 6 篇 应用经济学
  • 1 篇 法学
    • 1 篇 社会学
  • 1 篇 医学
    • 1 篇 临床医学

主题

  • 505 篇 bicmos integrate...
  • 209 篇 silicon germaniu...
  • 168 篇 heterojunction b...
  • 153 篇 cmos technology
  • 137 篇 germanium silico...
  • 100 篇 bipolar transist...
  • 91 篇 radio frequency
  • 86 篇 cmos integrated ...
  • 75 篇 cmos process
  • 59 篇 implants
  • 59 篇 voltage
  • 52 篇 bicmos
  • 48 篇 isolation techno...
  • 40 篇 silicon
  • 38 篇 sige
  • 34 篇 power amplifiers
  • 34 篇 bicmos technolog...
  • 34 篇 mos devices
  • 33 篇 gain
  • 33 篇 capacitance

机构

  • 31 篇 ihp
  • 29 篇 stmicroelectroni...
  • 10 篇 stmicroelect f-3...
  • 10 篇 school of electr...
  • 9 篇 ibm thomas j. wa...
  • 9 篇 imec leuven
  • 9 篇 auburn univ dept...
  • 8 篇 ihp d-15236 fran...
  • 8 篇 texas instrument...
  • 7 篇 philips research...
  • 7 篇 georgia inst tec...
  • 7 篇 ibm corp thomas ...
  • 6 篇 microelectronics...
  • 6 篇 stmicroelectroni...
  • 6 篇 ihp technol pk 2...
  • 6 篇 central research...
  • 6 篇 ibm microelectro...
  • 5 篇 stmicroelectroni...
  • 5 篇 texas tech univ ...
  • 5 篇 nxp semicond res...

作者

  • 22 篇 cressler john d.
  • 21 篇 p. chevalier
  • 20 篇 b. heinemann
  • 19 篇 d. knoll
  • 18 篇 r. barth
  • 17 篇 a. chantre
  • 16 篇 b. tillack
  • 14 篇 w. winkler
  • 13 篇 h. rucker
  • 13 篇 chevalier p.
  • 13 篇 p. schley
  • 12 篇 g. avenier
  • 12 篇 t. yamazaki
  • 11 篇 d. harame
  • 10 篇 s. marschmeyer
  • 10 篇 john d. cressler
  • 10 篇 dai fa foster
  • 10 篇 j. dunn
  • 10 篇 a. fox
  • 10 篇 s. decoutere

语言

  • 1,106 篇 英文
检索条件"任意字段=Bipolar/BiCMOS Circuits and Technology Meeting"
1106 条 记 录,以下是511-520 订阅
排序:
A SiGe bicmos 9.75/10.6GHz frequency synthesizer for DBS satellite LNB down-converters using half-rate oscillators
A SiGe BiCMOS 9.75/10.6GHz frequency synthesizer for DBS sat...
收藏 引用
2006 bipolar/bicmos circuits and technology meeting
作者: Maxim, A. Gheorghe, M. Turinici, C. Integrated Products 8713 Cobblestone Austin TX 78735
A fully-integrated frequency synthesizer for DBS satellite front-ends was realized in a low cost 50GHz fT SiGe bicmos process. Two half-rate VCOs followed by Gilbert frequency doublers generate the 9.75/10.6 GHz LO si... 详细信息
来源: 评论
An integrated 60 GHz receiver front-end in SiGe:C bicmos
An integrated 60 GHz receiver front-end in SiGe:C BiCMOS
收藏 引用
Topical meeting on Silicon Monolithic Integrated circuits in RF Systems
作者: Sun, YM Herzel, F Wang, L Borngräber, J Winkler, W Kraemer, R IHP Dept Circuit Design Technol Pk 25 D-15236 Frankfurt Germany
This paper presents a fully differential 60 GHz receiver front-end in SiGe:C technology. It comprises a differential LNA and a Gilbert mixer. The measured down-conversion gain is 28 dB. In the 57-64 GHz band the in-ba... 详细信息
来源: 评论
A low-voltage broadband feedforward-linearized BJT mixer
A low-voltage broadband feedforward-linearized BJT mixer
收藏 引用
bipolar/bicmos circuits and technology meeting
作者: Lim, Su-Tarn Long, John R. Delft Univ Technol DIMES Elect Res Lab NL-2628 CD Delft Netherlands
A low-voltage, feedforward-linearized bipolar mixer realizes an input IP3 of + 14.3 dBm and an input IP2 of + 54.5 dBm at 2.4 GHz. Conversion (power) gain over the 1-6 GHz RF input range is 12.4 +/- 0.35 dB, while the... 详细信息
来源: 评论
Substrate Current Injection and Latchup in Complementary Vertical bipolar Processes
Substrate Current Injection and Latchup in Complementary Ver...
收藏 引用
bipolar/bicmos circuits and technology meeting
作者: Andy Strachan Advanced Process Technology Development National Semiconductor Corporation Santa Clara CA USA
Challenges and solutions for substrate current injection and latchup phenomena in complementary bicmos technologies are described. The vertical PNP presents specific challenges that differ from CMOS or NPN-only bicmos... 详细信息
来源: 评论
A RF lateral BJT on SOI for realization of RF SOI-bicmos technology
A RF lateral BJT on SOI for realization of RF SOI-BiCMOS tec...
收藏 引用
2006 Topical meeting on Silicon Monolithic Integrated circuits in RF Systems
作者: Sun, I.-Shan Michael Ng, Wai Tung Mochizuki, Hidenori Kanekiyo, Koji Kobayashi, Takaaki Toita, Masato Imai, Hisaya Ishikawa, Akira Tamura, Satoru Takasuka, Kaoru Asahi Kasei Microsystems Co. Ltd. Atsugi AXT Maintower Atsugi Kanagawa 243-0021 Japan University of Toronto Dept. of Elec. and Comp. Engineering 10 King's College Rd. Toronto Ont. M5S 3G4 Canada
This work presents a lateral RF BJT built on SOI-CMOS compatible substrate. The primary motivation is to realize a SOI-bicmos technology suitable for low power RF and mixed-signal SoC. This novel LBJT structure relies... 详细信息
来源: 评论
Integrated bicmos 10 GHz S-Parameter Module
Integrated BiCMOS 10 GHz S-Parameter Module
收藏 引用
bipolar/bicmos circuits and technology meeting
作者: Jangsup Yoon Robert M. Fox William R. Eisenstadt Department of Electrical and Computer Engineering University of Florida Gainesville FL USA
The paper presents integrated bicmos 10 GHz s-parameter measurement circuits for performing RF/microwave signal gain and phase detection. Potential applications include embedded IC test and production IC test
来源: 评论
Demonstration of three-dimensional 35nF/mm2 MIM Capacitor integrated in bicmos circuits
Demonstration of three-dimensional 35nF/mm2 MIM Capacitor in...
收藏 引用
bipolar/bicmos circuits and technology meeting
作者: J.c. Giraudin F. Badets J.p. Blanc E. Chataigner A. Bajolet T. Jagueneau C. Rossato P. Delpech STMicroelectronics Crolles France IMEP Grenoble France
This paper summarizes the electrical characterization of MIM capacitor realized in three-dimensional. High density of 35nF/mm 2 is obtained with low leakage current. Its integration in bicmos technology is demonstrat... 详细信息
来源: 评论
Lithography for the 32-nm Node and Beyond
Lithography for the 32-nm Node and Beyond
收藏 引用
bipolar/bicmos circuits and technology meeting
作者: J. N. Burghartz M. Irmscher F. Letzkus J. Kretz D. Resnick Institute for Microelectronics Stuttgart Stuttgart Germany Qimonda Dresden GmbH and Company OHG Dresden Germany Molecular Imprints Inc. Austin TX USA
This review article presents, discusses and compares three emerging photo lithography techniques for use in future bicmos fabrication processes: EUV lithography, e-beam direct write, and nano imprint. Specific challen... 详细信息
来源: 评论
Turn-On Voltage Control in BSCR and LDMOS-SCR by the Local Blocking Junction Connection
Turn-On Voltage Control in BSCR and LDMOS-SCR by the Local B...
收藏 引用
bipolar/bicmos circuits and technology meeting
作者: V.A. Vashchenko P.J. Hopper Semiconductor Drive National Semiconductor Corporation Santa Clara CA USA
The problem of local ESD protection of power arrays is addressed at the device level. A wide voltage range of the pulsed dV/dt turn-on is achieved using a local blocking junction connection. The approach is experiment... 详细信息
来源: 评论
High RF performances asymmetric spacer NLDMOS integration in a 0.25μm SiGe:C bicmos technology
High RF performances asymmetric spacer NLDMOS integration in...
收藏 引用
bipolar/bicmos circuits and technology meeting
作者: Bertrand Szelag Dorothee Muller Jocelyne Mourier Caroline Arnaud Halim Bilgen Fabienne Judong Alexandre Giry Denis Pache Agustin Monroy STMicroelectronics Centre Commun de Microélectronique de Crolles Crolles France STMicroelectronics Centre Commun de Microélectronique de Crolles France
An asymmetrical spacer LDMOSFET integrated in a 0.25μm bicmos technology is presented. Improved RF performances are obtained with this new architecture: f T close to 35GHz with BVds larger than 15V. Process integrat... 详细信息
来源: 评论