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检索条件"任意字段=Bipolar/BiCMOS Circuits and Technology Meeting"
1104 条 记 录,以下是531-540 订阅
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Above IC RF MEMS and BAW filters: fact or fiction?
Above IC RF MEMS and BAW filters: fact or fiction?
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bipolar/bicmos circuits and technology meeting
作者: P. Ancey STMicroelectronics Crolles France
In the above IC integration, components are directly built monolithically upon or within the chip itself. The paper describes the works relative to bulk acoustic wave filter and RF MEMS (micro-switch and electromechan... 详细信息
来源: 评论
SiGe bicmos for Analog, High-Speed Digital and Millimetre-Wave Applications Beyond 50 GHz
SiGe BiCMOS for Analog, High-Speed Digital and Millimetre-Wa...
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bipolar/bicmos circuits and technology meeting
作者: S.P. Voinigescu T. Chalvatzis K.h.k. Yau A. Hazneci A. Garg S. Shahramian T. Yao M. Gordon T.O. Dickson E. Laskin S.T. Nicolson A.C. Carusone L. Tchoketch-Kebir O. Yuryevich G. Ng B. Lai P. Liu ECE Department University of Toronto Toronto ONT Canada
This paper explores the application of SiGe bicmos technology to mm-wave transceiver with analog and digital signal processing. A review of 10 - 80Gb/s SERDES performance across 3 SiGe bicmos and CMOS technology nodes... 详细信息
来源: 评论
MEMS-Based Reconfigurable Multi-band bicmos Power Amplifier
MEMS-Based Reconfigurable Multi-band BiCMOS Power Amplifier
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bipolar/bicmos circuits and technology meeting
作者: A.J.M. De Graauw P.G. Steeneken C. Chanlo J. Dijkhuis S. Pramm A. Van Bezooijen H.K.J. ten Dolle F. Van Straten P. Lok Philips Semiconductors Nijmegen The Netherlands Philips Research Laboratories Eindhoven The Netherlands
This paper presents a small dual-band 0.9GHz/1.8GHz inverse class F power amplifier with load-switch functionality using a single bicmos amplifier line-up with a MEMS based reconfigurable matching network. The realize... 详细信息
来源: 评论
Experimental Study of Metallic Emitter SiGeC HBTs
Experimental Study of Metallic Emitter SiGeC HBTs
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bipolar/bicmos circuits and technology meeting
作者: A. Chantre F. Aniel N. Zerounian D. Dutartre F. Saguin B. Vandelle G. Borot C. Richard M. Proust P. Chevalier L. Rubaldo F. Judong B. Barbalat Institut d'Electronique Fondamentale Orsay France STMicroelectronics Crolles Cedex France
This paper deals with the integration of a metallic emitter in a high-speed SiGe HBT technology. An innovative integration process called PRETCH is detailed, along with static and high-frequency electrical results. Ha... 详细信息
来源: 评论
Miniaturized Quad-Band Front-End Module for GSM using Si bicmos and passive integration technologies
Miniaturized Quad-Band Front-End Module for GSM using Si BiC...
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bipolar/bicmos circuits and technology meeting
作者: A.J.M. de Graauw A. van Bezooijen C. Chanlo A. den Dekker J. Dijkhuis S. Pramm H.K.J. ten Dolle Philips Semiconductors Innovation Center RF Nijmegen The Netherlands
The paper presents a highly miniaturized front end module (FEM) for GSM. The module consists of pure silicon bicmos RF power amplifier (PA) chip, a bicmos die for bias/control functions and a pHEMT switch die, all fli... 详细信息
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High Performances 3D Damascene MIM Capacitors Integrated in Copper Back-End Technologies
High Performances 3D Damascene MIM Capacitors Integrated in ...
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bipolar/bicmos circuits and technology meeting
作者: S. Cremer C. Richard D. Benoit C. Besset J.-p. Manceau A. Farcy C. Perrot N. Segura M. Marin S. Becu S. Boret M. Thomas S. Guillaumet A. Bonnard P. Delpech S. Bruyere STMicroelectronics France L2MP Marseilles France
RF and analog designs require high performances MIM capacitors. In order to continue downscaling of MIM devices, we have developed and integrated a 3D damascene MIM capacitor in the copper back-end of a 0.13 mum BICMO... 详细信息
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High-Performance bicmos Technologies without Epitaxially-Buried Subcollectors and Deep Trenches
High-Performance BiCMOS Technologies without Epitaxially-Bur...
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International SiGe technology and Device meeting, ISTDM
作者: B. Heinemann R. Barth D. Knoll H. Rucker B. Tillack W. Winkler IHP Frankfurt Germany
This paper describes the architecture of the bicmos processes highlighting the modular scheme for the integration of the bipolar modules into a common CMOS platform. HBT design issues associated with the implanted col... 详细信息
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Introduction to the 2002 bipolar/bicmos circuits and technology meeting
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IEEE JOURNAL OF SOLID-STATE circuits 2003年 第9期38卷 1545-1546页
作者: Fox, RM Univ Florida Dept Elect & Comp Engn Gainesville FL 32611 USA
来源: 评论
Notice of Violation of IEEE Publication Principles: A SiGe bicmos 9.75/10.6GHz Frequency Synthesizer for DBS Satellite LNB Down-Converters Using Half-Rate Oscillators
Notice of Violation of IEEE Publication Principles: A SiGe B...
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bipolar/bicmos circuits and technology meeting
作者: A. Maxim M. Gheorghe C. Turinici Integrated Products Austin TX USA
Notice of Violation of IEEE Publication Principles "A SiGe bicmos 9.75/10.6GHz Frequency Synthesizer for DBS Satellite LNB Down-Converters Using Half-Rate Oscillators" by Maxim, A.; Gheorghe, M.; Turinici, C...
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p-i-n Diodes for Monolithic Millimeter Wave bicmos Applications
p-i-n Diodes for Monolithic Millimeter Wave BiCMOS Applicati...
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International SiGe technology and Device meeting, ISTDM
作者: Bradley A. Orner Qizhi Liu Jeffrey Johnson Robert Rassel Xuefeng Liu David Sheridan Alvin Joseph Brian Gaucher IBM Systems and Technology Group 1000 River Road Essex Junction Vermont 05452 IBM Essex Junction VT USA IBM Thomas J. Watson Research Center Yorktown Heights NY USA
An integrated p-i-n diode for use in SiGe bicmos technology applications has been developed. The device may be used into the MMW frequency range
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