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检索条件"任意字段=Bipolar/BiCMOS Circuits and Technology Meeting"
1106 条 记 录,以下是621-630 订阅
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A low complexity 0.13 μm SiGe bicmos technology for wireless and mixed signal applications
A low complexity 0.13 μm SiGe BiCMOS technology for wireles...
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Proceedings of the 2004 IEEE bipolar/bicmos circuits and technology meeting
作者: Lanzerotti, L. Feilchenfeld, N. Coolbaugh, D. Slinkman, J. Gray, P. Sheridan, D. Higgins, J. Hodge, W. Gordon, M. Larsen, T. Gautsch, M. Lindgren, P. Murty, R. Rascoe, J. Watson, K. Stamper, T. Eshun, E. He, J. Downes, K. Rassel, R. Greco, J. Labelle, B. Sweeney, S. Stein, K. Bolam, R. Vaed, K. Orner, B. Joseph, A. St Onge, S. Dunn, J. IBM Microelectronics Division 1000 River Road Essex Junction VT 05452
We present IBM's next-generation, cost-performance-optimized bicmos technology (bicmos 8WL) which combines a state-of-the-art suite of SiGe NPNs, foundry compatible 0.13 μm CMOS, and a rich set of modular passive... 详细信息
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Fully-integrated WCDMA direct conversion SiGeC bicmos receiver
Fully-integrated WCDMA direct conversion SiGeC BiCMOS receiv...
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Proceedings of the 2004 IEEE bipolar/bicmos circuits and technology meeting
作者: Garcia, Patrice Pellat, Bruno Blanc, Jean-Pierre Persechini, Pascal Knopik, Vincent Baud, Laurent Goussin, Franck Thevenet, Davy Majcherczak, Sandrine Reaute, Fabien Richard, Oliver Conti, Patrick Szelag, Bertrand Belot, Didier STMicroelectronics Analog RF Design Group CR and D 850 Rue Jean Monnet 38926 Crolles France STMicroelectronics Advanced System Technology 39 Ch. du champs des filles CH-1228 Geneve Switzerland
This paper describes a WCDMA direct conversion receiver which has been integrated in a bicmos SiGe-Carbon process featuring 0.25um/fT=60GHz bipolar transistor. This receiver includes integrated RF-Front-End with local... 详细信息
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A modular, low-cost SiGe:C bicmos process featuring high-fT and high-BVCEO transistors
A modular, low-cost SiGe:C BiCMOS process featuring high-fT ...
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Proceedings of the 2004 IEEE bipolar/bicmos circuits and technology meeting
作者: Knoll, Dieter Heinemann, Bernd Barth, Rainer Blum, Katrin Borngräber, Johannes Drews, Jürgen Ehwald, Karl-Ernst Fischer, Gerhard Fox, Alexander Grabolla, Thomas Haak, Ulrich Höppner, Wolfgang Korndörfer, Falk Kuck, Beate Marschmeyer, Steffen Richter, Harald Rücker, Holger Schley, Peter Schmidt, Detlef Scholz, Rene Senapati, Biswanath Tillack, Bernd Winkler, Wolfgang Wolansky, Dirk Wolf, Christoph Wulf, Hans-Erich Yamamoto, Yuji Zaumseil, Peter Germany
We demonstrate a bicmos process which uses only 22 mask steps to fabricate four types of SiGe:C HBTs, in combination with a triple-well, 2.5V CMOS core and a full menu of passive elements. Key process feature is a 2-m... 详细信息
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High performance rf front end circuits using SiGe:C bicmos plus copper technologies
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APPLIED SURFACE SCIENCE 2004年 第1-4期224卷 405-409页
作者: Watanabe, G Ortiz, J Holbrook, R Motorola Semiconductor Prod Sect Wireless & Broadband Syst Grp Radio Prod Div Phoenix AZ USA
Using a first generation standard silicon germanium (SiGe):C HBT bicmos process, a personal digital cellular (PDC) LNA noice factor (NF) of 1.0 dB at 850 MHz and 1.2 dB at 1.5 GHz has been achieved. The LNA NF can be ... 详细信息
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Circuit applications of high-performance SiGe:C HBTs integrated in bicmos technology
Circuit applications of high-performance SiGe:C HBTs integra...
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1st International SiGe technology and Device meeting (ISTDM)
作者: Winkler, W Borngräber, J Heinemann, B Rücker, H Barth, R Bauer, J Bolze, D Drews, J Ehwald, KE Grabolla, T Haak, U Höppner, W Knoll, D Krüger, D Kuck, B Kurps, R Marschmeyer, M Richter, H Schley, P Schmidt, D Scholz, R Tillack, B Wolansky, D Wulf, HE Yamamoto, Y Zaumseil, P IHP D-15236 Frankfurt Germany
Carbon-doped SiGe (SiGe:C) bipolar devices have been developed and integrated in to a 0.25 mum CMOS platform. The resulting SiGe:C bicmos technology offers a wide spectrum of active and passive devices for wireless an... 详细信息
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A 43Gb/s full-rate clock transmifter in 0.18/spl mu/m SiGe bicmos technology
A 43Gb/s full-rate clock transmifter in 0.18/spl mu/m SiGe B...
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bipolar/bicmos circuits and technology meeting
作者: M. Mcghelli IBM T. J. Watson Research Center
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A wideband fully integrated 0.25/spl mu/m bicmos 5GHz medium power amplifier
A wideband fully integrated 0.25/spl mu/m BiCMOS 5GHz medium...
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bipolar/bicmos circuits and technology meeting
作者: M. Vaiana G. Gramegna M. Paparo STMicroelectronics Catania Italy
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Power semiconductor and IC technologies in audiovisual applications
Power semiconductor and IC technologies in audiovisual appli...
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bipolar/bicmos circuits and technology meeting
作者: D. Kinzer International Rectifier Corporation El Segundo CA USA
Modern class-D audio and plasma displays depend on high voltage IC technology and power transistors. 100-300 V bicmos level shifted gate drivers control 100 V trench MOSFETs and 300 V insulated gate bipolar transistor... 详细信息
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Low power consuming bicmos single-ended VCO for wireless LAN at C-band
Low power consuming BiCMOS single-ended VCO for wireless LAN...
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bipolar/bicmos circuits and technology meeting
作者: G. von Buren F. Ellinger L. Rodoni H. Jackel Electronics Laboratory Swiss Federal Institute of Technology Zurich Switzerland Electronics Laboratory Swiss Federal Institute of Technology (ETH) Zurich Switzerland
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Generation and integration of scalable bipolar compact models [HBT example]
Generation and integration of scalable bipolar compact model...
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bipolar/bicmos circuits and technology meeting
作者: D.C. Sheridan R.M. Murty K.M. Newton J.B. Johnson Microelectronics Division IBM Essex Junction VT USA
This paper investigates the methodologies for generating and integrating scalable bipolar models in the modern design environment. Additionally, fundamental bipolar parameter scaling is reviewed and demonstrated with ... 详细信息
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