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conference on advanced sensors and Monitors for Process Industries and the Environment

作者： Tavassoli, B Shahnazi, K Adv Thermal Solut Inc Newton MA 02461 USA

ISBN: (纸本)0819429961

A new technology that uses a single sensor for temperature and velocity measurements in non-isothermal fluids is presented in this paper. The system is a multi-channel scanner designed for measuring velocity and temperature in applications where single - or multi- point measurements are required. This unit uses 12-bit data acquisition system along with digital circuitry for measuring both velocity and temperature (0 to 10000 ft/min, -20 to 140 degrees C) with the same sensor. These unique sensors are designed to be low profile to minimize flow disturbance. Of the salient points of the new system is elimination of measurement error as seen in dual sensor systems used in the same application. Dual sensor induced errors can be in excess of 20% that are caused when these sensors are: used in non-isothermal flows. This technology provides an accurate and easy to use, vehicle for mapping the temperature and velocity of flows in multitude of environments.

关键词： thermal measurements velocity measurement thermistor thermocouple sensors multi-channel point measurements velocity and temperature

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High temperature silicon-on-insulator pressure sensor technology 3

High temperature silicon-on-insulator pressure sensor techno...

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3rd European conference on High Temperature Electronics, HITEN 1999

作者： Johnson, Russell L. Honey well-SSEC 12001 Stale Highway 55 PlymouthMN55441 United States

ISBN: (纸本)0780357957

In this paper the recent development of a high sensitivity high temperature Silicon-On-Insulator (SOI) piezoresistive sensor technology that provides pressure sensing, temperature sensing, and feedback and bias resistor networks all integrated on a single miniature chip that measures only 0.23 cm software (90 mils square) is reported. This advanced sensor technology also provides sheet resistivities of approximated 3 times greater than conventional bulk silicon sensors while maintaining the same dopant concentration of the p-Type resistor elements. The new chip design features a high impedance 30 Kω pressure bridge which provides a full scale output of 200 milli-volt per volt of excitation. This corresponds to a ΔR/R gage factor of 0.20. Also featured is a high impedance 60 Kω temperature bridge with an output sensitivity of 1.2 milli-volt per °C per volt of excitation. This high temperature SOI sensor technology complements Honeywell's HTMOS high temperature electronics product line which provides both analog devices (including quad amplifiers and switches, fluxes, A/D's, and voltage references) and digital devices (including SRAMs, microcontrollers and clock generators) with operation up to 300°C. This dual capability of high temperature sensors and high temperature electronics provides all the required functional blocks needed for designing complete sensor systems for an array of high temperature applications. © 1999 IEEE.

关键词： High temperature applications

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Turbomachinery prognostics and health management via eddy current sensing: current developments

IEEE Aerospace Applications Conference Proceedings

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IEEE Aerospace applications conference Proceedings 1999年 3卷 1-9页

作者： Dowell, Michael Sylvester, Garrett Advanced Technology Systems Arlington VA United States

This paper describes selected aspects of an ongoing program of prognostics and health management for jet engines and other turbomachinery. The primary enabling technology developed to date is a magnetic sensor relying for its operation on high-frequency eddy currents actively induced in passing fan or turbine blades. We summarize the sensor principles, sketch the processing approach used to extract health-related information from the sensor output, illustrate the sensor performance with results from engine tests, and describe the near-term and continuing prognostics and health management program in which the sensor is integrated.

关键词： sensors

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Optimal reconstruction of mode shapes using nonuniform strain sensor spacing

Optimal reconstruction of mode shapes using nonuniform strai...

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IEEE/ASME (AIM) International conference on advanced Intelligent Mechatronics

作者： E. Dyllong A. Kreuder Department of Computer Science Gerhard Mercator University of Duisburg Duisburg Germany Department of Electromechanical Systems Design Gerhard Mercator University of Duisburg Duisburg Germany

In this paper, a theoretical and practical technique for the reconstruction of the static and dynamic deflection curves of a cantilever beam with one free end is presented. In practice a limited number of strain sensors is used, so the sensor layout is important for the accuracy of the result. A new approach for finding an optimized number and placement of FBG strain sensors is described, and it is shown that five well placed readings suffice to precisely reconstruct the modes up to the 3rd which are significant in lots of applications. The method is validated by comparing dynamic shape estimations with experimental results.

关键词： Shape Capacitive sensors Optical fiber sensors Structural beams Fiber gratings Bragg gratings Spline sensor phenomena and characterization Optical arrays sensor arrays

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Multisensor industrial inspection and grading using ELSA

Multisensor industrial inspection and grading using ELSA

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IEEE/ASME (AIM) International conference on advanced Intelligent Mechatronics

作者： M.D. Naish E.A. Croft Computer Integrated Manufacturing Laboratory Department of Mechanical and Industrial Engineering University of Toronto Toronto ONT Canada Industrial Automation Laboratory Department of Mechanical Engineering University of British Columbia Vancouver BC Canada

The Extended Logical sensor Architecture (ELSA) has been developed for industrial applications, particularly, the on-line grading and classification of non-uniform food products. This architecture addresses a number of issues specific to industrial inspection including modularity, scalability, and design by non-expert users. To address these needs, the sensors are encapsulated by a logical sensor model, providing robustness and flexibility. The construction methodology is based upon the object model which represents object classifications through combinations of primary features weighted by fuzzy membership functions. The features guide the selection of sensors and processing routines; the classifications determine the rulebase used by the inference engine for process decisions.

关键词： Inspection sensor systems Mechanical sensors Machinery production industries Machine vision Manufacturing industries Quality assurance Automation Multisensor systems Laboratories

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A review of high-level multisensor fusion: approaches and applications

A review of high-level multisensor fusion: approaches and ap...

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International conference on Multisensor Fusion and Integration for Intelligent systems (MFI)

作者： R.C. Luo K.L. Su Intelligent Automation Laboratory Department of Electrical Engineering National Chung Cheng University Chiayi Taiwan

The potential advantages in multisensor fusion can be obtained more accurately, concerning feature that are impossible to perceive with individual sensors, as well as in less time, and at a lower cost. The characterization most commonly encountered in the rapidly growing multisensor fusion literature based on levels of detail in the information is that of the now well known triple low level (data level), medium level (feature level) and high level (decision level). The development of high-level multisensor fusion representations is very important, in the construction of advanced intelligent systems. The paper begins with a review on the fundamental principles about high-level multisensor fusion, together with some of the applications. Finally, we compare the decision algorithms in the high-level multisensor fusion.

关键词： sensor fusion Inference algorithms Intelligent sensors Bayesian methods Humans Intelligent systems sensor systems Automation Laboratories sensor phenomena and characterization

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Development of automatic steel coil recognition system for automated crane

Development of automatic steel coil recognition system for a...

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IEEE/ASME (AIM) International conference on advanced Intelligent Mechatronics

作者： K. Nishibe N. Fujiwara Engineering Research Laboratory Hitachi Kiden Kogyo Limited Japan Mechanical Systems Engineering Kanazawa University Japan

An automatic steel coil recognition system with two types of laser-assisted range sensor has been developed for full automated crane operation in the steel coil yard. Performance tests of recognizing full scale model coils were carried out by mounting the recognition system on a full size crane. As a result, recognition accuracy of coil center position, coil diameter and width were confirmed to be /spl plusmn/20 mm, which is enough fur practical applications. This recognition system was delivered to commercial operations in the steel maker, and has been operated regularly.

关键词： Steel Cranes Coils sensor systems Laser noise Shape measurement Automatic control Shape control Optical control Costs

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Development of automatic steel coil recognition system for automated crane

IEEE/ASME International Conference on Advanced Intelligent M...

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IEEE/ASME International conference on advanced Intelligent Mechatronics, AIM 1999年 742-746页

作者： Nishibe, Kunihiko Fujiwara, Naofumi Hitachi Kiden Kogyo Ltd Japan

An automatic steel coil recognition system with two types of laser-assisted range sensor has been developed for full automated crane operation in the steel coil yard. Performance tests of recognizing full scale model coils were carried out by mounting the recognition system on a full size crane. As a result, recognition accuracy of coil center position, coil diameter and width were confirmed to be ±20 mm, which is enough for practical applications. This recognition system was delivered to commercial operations in the steel maker, and has been operated regularly.

关键词： Pattern recognition systems

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advanced in-situ particle monitor for Applied Materials implanter applications

Advanced in-situ particle monitor for Applied Materials impl...

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International conference on Ion Implantation Technology Proceedings

作者： J. Simmons M. Hilkene M. Scottney-Castle D.W. Wagner J. Mitchell Implant Division Applied Materials Austin TX USA Particle Measuring Systems Inc. Boulder CO USA

In-situ particle monitors offer significant benefits in cost of ownership for ion implant applications. Particle excursions and out-of-control conditions are detected and alarmed as they occur, minimizing the potential for scrapping future product runs. Applied Materials are now qualifying an advanced technology in-situ particle sensor for the xR80 series and xR200S (9500 series) implanters. Utilizing Particle Measuring systems, Inc. Technology, this system directly addresses the historical limitations with in-situ particle monitors. Electronic and thermally sensitive components are kept out of the processor chamber. Very high optical power is generated in the sensor, detecting particles as small as 0.08 /spl mu/m at velocities up to 10 m/s. Testing to date indicates this sensor offers excellent performance in monitoring particle excursions and a good correlation to small particles counted on wafers.

关键词： Monitoring Optical sensors Optical resonators Implants Optical scattering Particle measurements Thermal degradation Coatings Optical materials Power generation

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Semiconductor developments for automotive systems

Semiconductor developments for automotive systems

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IEEE conference on Vehicular Technology (VTC)

作者： R. Bannatyne Motorola Transportation Systems Group Austin TX USA

The paper defines how complex automotive electronics has become and how advanced semiconductor technology is being developed to simplify the development of these systems. In order to handle the increasing processing bandwidth required, and to interface effectively with the many sensors and actuators on the modern motor vehicle, significant advances are being made in semiconductor technology. The types of systems which are becoming more complex are defined along with the reasons for becoming so. "System chips" are now being developed which can integrate together different types of semiconductor technology in order to reduce chipcount, size and increase performance and reliability. Analog, digital, power and even sensor technology is being merged in order to address the advanced automotive requirements. Examples are given of system chips and their impact on advanced automotive applications. Smart sensors are being developed which will make integrating many sensors simpler than ever before. The smart sensors will allow easier sharing of information between related systems such as chassis control systems (braking, steering, collision avoidance, etc.). The concept and application of such smart sensors is discussed. Several other advances in semiconductors for automotive applications are discussed such as Flash NV memory, power consumption issues and vehicular electronic communication protocols. The impact of these technologies on simplifying development of complex systems is made clear.

关键词： Automotive engineering Intelligent sensors Automotive applications Automotive electronics Paper technology Bandwidth Actuators Vehicles Semiconductor device reliability Power system reliability

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