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Multimodal Human Detection using RGB, Thermal and LiDAR modalities for Robotic Perception

Multimodal Human Detection using RGB, Thermal and LiDAR moda...

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IEEE International conference on Automation Science and Engineering (CASE)

作者： Kennedy O. S. Mota Luís Garrote Cristiano Premebida Department of Electrical and Computer Engineering Institute of Systems and Robotics University of Coimbra Portugal

ISBN: (数字)9798350358513

ISBN: (纸本)9798350358520

People detection is a relevant research topic in artificial perception with wide range of applications from security, surveillance, robotics to autonomous driving. Overcoming challenges in this field involves advanced algorithms, combination of machine learning approaches, as well as the use of sensory data e.g., from cameras and LiDARs. This work addresses the problem of people detection using YOLO, a state-of-the-art object detection method, trained on three distinct data sources LiDAR, RGB (color) and ‘thermal’ (long-wave infra-red) images. The rationale for combining multiple-sensory representation relies on the assumption that each sensor has its own advantages and disadvantages, but together they normally complement each other - specially in real-world conditions. LiDAR contributes to a physically-interpretable mapping of the environment, providing precise information regarding size/dimension and location of the objects, while RGB and thermal provide relevant textural features. The sensors have been calibrated w.r.t. each other thus, allowing the LiDAR’s point-clouds to be projected into the image plane, followed by an up-sampling step, to create dense-depth maps (DM) that enable direct use of the YOLO framework. To support the experiments, a new multi-sensory dataset has been collected using a mobile robot. Besides single-modality models, this paper also explores early and late-fusion strategies. Finally, the new dataset has been made available in a Github repository 1 .

关键词： YOLO Laser radar Machine learning algorithms Surveillance Soft sensors Thermal engineering Robot vision systems Security Mobile robots Software development management

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Rosella: A Self-Driving Distributed Scheduler for Heterogeneous Clusters

Rosella: A Self-Driving Distributed Scheduler for Heterogene...

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International conference on Mobile Ad-hoc and sensor Networks, MSN

作者： Qiong Wu Zhenming Liu William & Mary

ISBN: (纸本)9781665406697

Large-scale interactive web services and advanced AI applications make sophisticated decisions in real-time, based on executing a massive amount of computation tasks on thousands of servers. Task schedulers, which often operate in heterogeneous and volatile environments, require high throughput, i.e., scheduling millions of tasks per second, and low latency, i.e., incurring minimal scheduling delays for millisecond-level tasks. Scheduling is further complicated by other users’ workloads in a shared system, other background activities, and the diverse hardware configurations inside *** present Rosella, a new self-driving, distributed approach for task scheduling in heterogeneous clusters. Rosella automatically learns the compute environment and adjusts its scheduling policy in real-time. The solution provides high throughput and low latency simultaneously because it runs in parallel on multiple machines with minimum coordination and only performs simple operations for each scheduling decision. Our learning module monitors total system load and uses the information to dynamically determine optimal estimation strategy for the backends’ compute-power. Rosella generalizes power-of-two-choice algorithms to handle heterogeneous workers, reducing the max queue length of O(logn) obtained by prior algorithms to O(logn). We evaluate Rosella with a variety of workloads on a 32-node AWS cluster. Experimental results show that Rosella significantly reduces task response time, and adapts to environment changes quickly.

关键词： Processor scheduling Web services Heuristic algorithms Clustering algorithms Throughput Dynamic scheduling Real-time systems

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Intelligent control and asset management: An event-based control road map

Intelligent control and asset management: An event-based con...

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International conference on Event-based Control, Communication, and Signal Processing (EBCCSP)

作者： James H. Taylor University of New Brunswick Fredericton New Brunswick Canada

My students and I have participated in a seven-year effort to produce an advanced supervisory control system called ICAM, a system for Intelligent Control and Asset Management, with specific focus on petroleum industry applications. By design, however, ICAM was devised to be widely applicable in a variety of automation and manufacturing arenas. We adopted a multi-agent architecture to implement ICAM, and divided ICAM's functionality among the various agents to execute different specific tasks. Most agents were, by nature, computationally intensive; these were implemented as MATLAB ® routines. The Supervisor (or “master agent”), on the other hand, was meant to incorporate the “intelligence” of ICAM, so it was created in the G2 expert system shell. We also assumed that a wireless sensor and actuator network (WSAN) would be incorporated in the system under control, including links comprising control loops. Several important lessons were learned in the course of this project. First, we found it easier and more efficient to distribute much of the intelligence in the agents rather than the Supervisor, and secondly, that implementing the Supervisor as an expert system in G2 made the operation of ICAM very slow and cumbersome, due to the excessive overhead involved. We have concluded that replacing the expert system Supervisor with a top-level event-based controller will make ICAM considerably more effective, efficient, and easier to extend and maintain.

关键词： MATLAB Mathematical model Process control Data models Actuators Wireless communication Expert systems

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A diagnostic approach for electro-mechanical actuators in aerospace systems

A diagnostic approach for electro-mechanical actuators in ae...

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IEEE conference on Aerospace

作者： Edward Balaban Prasun Bansal Paul Stoelting Abhinav Saxena Kai F. Goebel Simon Curran NASA Ames Research Center Moffett Field CA USA NASA Ames Research Center Mission Critical Technologies Inc. Moffett Field CA USA Moog Inc. East Aurora NY USA NASA Ames Research Center Research Institute for Advanced Computer Science Moffett Field CA USA

Electro-mechanical actuators (EMA) are finding increasing use in aerospace applications, especially with the trend towards all all-electric aircraft and spacecraft designs. However, electro-mechanical actuators still lack the knowledge base accumulated for other fielded actuator types, particularly with regard to fault detection and characterization. This paper presents a thorough analysis of some of the critical failure modes documented for EMAs and describes experiments conducted on detecting and isolating a subset of them. The list of failures has been prepared through an extensive Failure Modes and Criticality Analysis (FMECA) reference, literature review, and accessible industry experience. Methods for data acquisition and validation of algorithms on EMA test stands are described. A variety of condition indicators were developed that enabled detection, identification, and isolation among the various fault modes. A diagnostic algorithm based on an artificial neural network is shown to operate successfully using these condition indicators and furthermore, robustness of these diagnostic routines to sensor faults is demonstrated by showing their ability to distinguish between them and component failures. The paper concludes with a roadmap leading from this effort towards developing successful prognostic algorithms for electromechanical actuators.

关键词： Actuators Fault detection Failure analysis Aircraft Space vehicles Data acquisition Testing Fault diagnosis Artificial neural networks Robustness

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Impact of printed circuit board technology on thermal performance of high-power LED assembly - experimental results

Impact of printed circuit board technology on thermal perfor...

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Electronics System-Integration Technology conference, ESTC

作者： Johann Nicolics Gregor Langer Ferdinand Lutschounig Kurt-Jürgen Lang Rainer Huber AEM Department of Applied Electronic Materials ISAS Institute of Sensor and Actuator Systems University of Technology Vienna Wien Austria Austria Technologie und Systemtechnik AG Leoben Austria AT and S Klagenfurt Leiterplatten GmbH Klagenfurt Austria Osram Opto Semiconductors GmbH and Company Regensburg Germany

In the last half decade LED technology has undoubtedly made its most rapid progresses leading to an enormous growth of illumination applications. Though, this advancement is based on a series of quantum steps in improvement of efficiency, removal of the remaining power loss is a major concern in further developments. In our paper we compare LED demonstrator assemblies with three different types of high-power LEDs mounted on different types of printed circuit boards. The thermal performance of the respective combination is investigated. We found that in a power loss range of a few Watts a satisfying solution can frequently be attained by application of conventional glass fiber epoxy based PCB technology with advanced thermal design (improved heat-spreading capability by thermal pads and thermal vias). For dissipating higher power loss, however, the insulated metal substrates turned out to be superior with respect to their polymer-based counterparts, particularly if the PCB itself has to fulfil cooler or heat spreader function. Moreover, some aspects of the dynamic thermal behavior of different demonstrator boards assembled with the same LED type were studied by recording temperature changes on the LED surface during the heating-up phase.

关键词： Light emitting diodes Temperature measurement Thermal resistance Copper Thermal conductivity Assembly Junctions

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Probabilistic Visibility-Aware Trajectory Planning for Target Tracking in Cluttered Environments

Probabilistic Visibility-Aware Trajectory Planning for Targe...

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American Control conference (ACC)

作者： Han Gao W. Pengying S. Yao Kangjie Zhou M. Ji Hangxin Liu Chang Liu Department of Advanced Manufacturing and Robotics College of Engineering Peking University National Key Laboratory of General Artificial Intelligence Beijing Institute for General Artificial Intelligence (BIGAI)

ISBN: (数字)9798350382655

ISBN: (纸本)9798350382662

Target tracking has numerous significant civilian and military applications, and maintaining the visibility of the target plays a vital role in ensuring the success of the tracking task. Existing visibility-aware planners primarily focus on keeping the target within the limited field of view of an onboard sensor and avoiding obstacle occlusion. However, the negative impact of system uncertainty is often neglected, rendering the planners delicate to uncertainties in practice. To bridge the gap, this work proposes a model predictive control (MPC)-based trajectory planner for real-time visibility-aware and safe target tracking in the presence of system uncertainty. For more accurate target motion prediction, we introduce the concept of belief-space probability of detection (BPOD) to measure the predictive visibility of the target under stochastic robot and target states. An Extended Kalman Filter variant incorporating BPOD is developed to predict target belief state under uncertain visibility within the planning horizon. To reach real-time trajectory planning, we propose a computationally efficient algorithm to uniformly calculate both BPOD and the chance-constrained collision risk by utilizing linearized signed distance function (SDF), and subsequently solve the MPC problem by sequential convex programming. Extensive simulation results with benchmark comparisons show the capacity of the proposed approach to robustly maintain the visibility of the target under high system uncertainty. The practicality of the proposed trajectory planner is validated by real-world experiments.

关键词： Uncertainty Target tracking Trajectory planning Stochastic systems Simulation Stochastic processes Robot sensing systems

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Enhanced Omnidirectional Image Reconstruction Algorithm and Its Real-Time Hardware

Enhanced Omnidirectional Image Reconstruction Algorithm and ...

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Euromicro Symposium on Digital System Design

作者： Abdulkadir Akin Elif Erdede Hossein Afshari Alexandre Schmid Yusuf Leblebici Microelectronic System Laboratory Swiss Federal Institute of Technology Lausanne Lausanne Switzerland Faculty of Engineering and Natural Sciences Sabanci University Istanbul Turkey

Omnidirectional stereoscopy and depth estimation are complex problems of image processing to which the Panoptic camera offers a novel solution. The Panoptic camera is a biologically-inspired vision sensor made of multiple cameras. It is a polydioptric system mimicking the eyes of flying insects where multiple imagers, each with a distinct focal point, are distributed over a hemisphere. Recently, the omnidirectional image reconstruction algorithm (OIR) and its real-time hardware implementation have been proposed for the Panoptic camera. This paper presents an enhanced omnidirectional image reconstruction algorithm (EOIR) and its real-time implementation. The proposed EOIR algorithm provides improved realistic omnidirectional images and residuals compared to OIR. As a processing core of EOIR, 57% of the available slice resources in a Virtex 5 FPGA are consumed. The proposed platform provides the high bandwidth required to simultaneously process data originating from 40 cameras, and reconstruct omnidirectional images of 256x1024 pixels at 25 fps. This proposed hardware and algorithmic enhancements enable advanced real-time applications including omnidirectional image reconstruction, 3D model construction and depth estimation.

关键词： Cameras Image reconstruction Image resolution Hardware Real-time systems Interpolation Algorithm design and analysis

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Integrating NVIDIA Jetson Nano as a Data Server in IIoT Ecosystems: A Case Study

Integrating NVIDIA Jetson Nano as a Data Server in IIoT Ecos...

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IEEE International conference on Consumer Electronics-Taiwan (ICCE-TW)

作者： Adriel Vasques Andrey R. R. Bessa José E.B.S. Linhares Mateus O. Silva Gustavo M. Torres Matheus S. Uchôa Myke D.M. Valadão Edma V.C.U. Mattos Antônio M.C. Pereira Agemilson P. Silva Allan C. Brito Rômulo S.F. Waldir S.S. Celso B. Carvalho Federal University of Amazonas and Center for R&D in Elec. and Inf. Tech. (UFAM/CETELI) AM Brazil ENVISION/TPV Group Technology Limited AM Brazil

ISBN: (数字)9798350386844

ISBN: (纸本)9798350386851

This study introduces an advanced Industrial Internet of Things (IIoT) system for efficient data collection and processing in industrial settings. By incorporating LoRaWAN sensors, MQTT brokers, and NVIDIA Jetson Nano operating system based on Ubuntu. The proposed system enhances data transmission reliability, optimizes machine learning data flow, and reinforces data security. These improvements significantly boost operational efficiency and setting the base for efficient data collection by optimizing operational flows in automated industrial environments. Furthermore, the proposed can be used in a data acquisition context to create machine learning models for predictive maintenance applications or anomaly detection in industrial assets, even if the AAS stage is still under development.

关键词： Data security Biological system modeling Machine learning Data collection sensor systems Data models sensors

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Integrated System Development for 3-D VLSI

Integrated System Development for 3-D VLSI

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Electronic Components and Technology conference (ECTC)

作者： L. Schaper S. Burkett M. Gordon L. Cai Y. Liu G. Jampana I. U. Abhulimen Electrical Engineering University of Arkansas Fayetteville AR USA Mechanical Engineering University of Arkansas Fayetteville AR USA

A great deal of work has been done in creating 3-D VLSI by wafer stacking and through silicon via (TSV) processing for dense Z-axis interconnects. Various methods for wafer attachment have been used, including polymer glue, oxide-oxide bonding, and direct metallic bonding. Yet these wafer attachment methods may not be the best way to assemble 3-D systems from VLSI elements. systems consist of more than silicon ICs. Many systems, particularly those designed for RF or sensor applications, may need to assemble both III-V and silicon layers with TSVs, remove significant amounts of heat, provide integrated decoupling and power distribution, and avoid cumulative yield issues by pretesting individual die layers before assembly. Typically, each layer may be a miniature subsystem, so that Z-axis interconnect demand can be satisfied by connections on 100-200 μm pitch. This paper describes an advanced 3-D packaging concept using die stacking rather than wafer bonding. To deal with the CTE mismatch of different materials, compliant copper posts are used to join individual layers. The copper is also used to form a fluid dam around the resulting channel between each pair of die. Circulating fluid is pumped through these channels for heat removal. Sequential attachment of pretested layers is accomplished by forming copper/tin intermetallics. Decoupling and power distribution are provided by thin film capacitors between copper distribution planes on dedicated silicon layers. The results of process development on the various aspects of this approach will be presented. TSVs of 20 μm diameter on 100 μm pitch have been fabricated in wafers thinned to 100 μm thick. Copper posts 30 μm in diameter and 80 μm high have been demonstrated. The results of tests on via and post daisy chains will be presented. Decoupling layers based on thin-film Ta 2 O 5 dielectric capacitors will be described. The design of a complete test vehicle intended to demonstrate the integration of these methods will

关键词： Very large scale integration Copper Silicon Wafer bonding Assembly systems Stacking Radio frequency Power distribution Packaging Capacitors

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Bow-Free Tri-Component Assembly for Aerospace Optoelectronics applications: Predicted Thermal Stresses

Bow-Free Tri-Component Assembly for Aerospace Optoelectronic...

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IEEE Aerospace conference

作者： Ephraim Suhir Laurent Bechou Johann Nicolics Sung-Mo Kang ERS Co. Los Altos CA USA Portland State University Portland OR USA Universite de Bordeaux CNRS 5218 Talence Cedex France Institute of Sensor and Actuator Systems Vienna University of Technology Wien Austria Korea Advanced Institute of Science and Technology S.Korea

There is an obvious incentive for using bow-free (temperature change insensitive) assemblies in aerospace optoelectronics: elevated bow might lead to the reduction or even to the total loss in the coupling efficiency. A bi-material bi-component assembly cannot be made bow-free: the total bending moment is never zero in such an assembly. To become bow-free, an assembly comprised of dissimilar materials should contain at least three components in order to produce forces that would lead to a zero resultant bending moment. The induced stresses in a bow-free assembly could be, however, high and, if appreciable inelastic stresses occur, the bow-free condition might be compromised. Accordingly, the objective of the present analysis is to obtain a bow-free condition for a tri-component tri-material assembly and to develop analytical predictive stress models for the evaluation of the interfacial shearing and peeling stresses, as well as for the normal stresses acting in the cross-sections of the assembly components. Analytical (mathematical) modeling enables one to better understand the physics of possible failures and to design a reliable product. The carried out numerical examples have indicated that all the three stress categories could be rather high and on the same order of magnitude. The developed models could be of help in the analysis and design of bow-free opto-electronics assemblies for aerospace applications. The models could be employed in other areas of applied science and engineering, when there is an incentive for using bow-free assemblies and to quantify the induced stresses. The future work should include thorough accelerated testing to establish the allowable level of the induced stresses.

关键词： Assembly Stress Shearing Strain Bonding Thermal force Reliability

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