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Complex Event Processing in Web Streams with Ontology-Based Abstraction Layers for Smart City Frameworks

Complex Event Processing in Web Streams with Ontology-Based ...

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Trends in Quantum Computing and Emerging Business Technologies (TQCEBT), International conference on

作者： M Hari KrishnA Manjunatha Rakesh Kumar Navdeep Singh Ashwani Kumar Adnan Allawi Ftaiet Institute of Aeronautical Engineering Hyderabad Department of Mechanical Engineering New Horizon College of Engineering Bangalore Department of Computer Engineering & Applications GLA University Mathura Lovely Professional University Phagwara Lloyd Institute of Engineering & Technology Greater Noida Uttar Pradesh College of Technical Engineering National University of Science and Technology Dhi Qar Iraq

ISBN: (数字)9798350384277

ISBN: (纸本)9798350384284

Smart cities embody the integration of information technology, urban infrastructure, and citizen engagement to optimize city functions and drive economic growth. A critical component in achieving this integration is the ability to process complex events in real-time, particularly from diverse web streams. This paper introduces a novel framework for Complex Event Processing (CEP) in web streams by employing ontology-based abstraction layers, aiming to enhance the interpretability and interoperability of heterogeneous data sources within smart city frameworks. The proposed approach uses a layered architecture where the bottom layer deals with raw data streams from various sources, including IoT devices, social media, and sensor networks. The middle layer employs an ontology-based model to abstract and enrich the raw data, providing a unified and semantic representation. This representation facilitates the identification and correlation of complex events, which are pertinent to city management and planning. The top layer involves the application of advanced data mining techniques to predict, detect, and respond to urban events in a timely and efficient manner. Through this methodology, the framework addresses the challenges of scalability, semantic heterogeneity, and real-time processing needs inherent in smart city applications. Empirical evaluations demonstrate the efficacy of the approach in various urban scenarios, showing promising improvements over existing methods. This work lays a foundational architecture for future research and development in smart city technologies, aiming to make urban areas more livable, sustainable, and efficient.

关键词： Smart cities Social networking (online) Scalability Soft sensors Ontologies Real-time systems Service-oriented architecture

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Evaluating QoS Performance in Multi-User High Speed Wireless Networks with Adaptive Spectrum Allocation

Evaluating QoS Performance in Multi-User High Speed Wireless...

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Paradigm Shift in Information Technologies with Innovative applications in Global Scenario (ICPSITIAGS), IEEE International conference on

作者： Ravindra Kumar Rakesh Kumar Yadav Rajesh Pandian Vinithra Banu. T Ganesh C. Shelke Maheswaran S Department of Civil Engineering Vivekananda Global University Jaipur India Maharishi School of Engineering and Technology Maharishi University of Information Technology UP India Department of Computer Science and Engineering Jain (Deemed to be University) Bangalore Karnataka India Department of Mechanical Engineering Prince Shri Venkateshwara Padmavathy Engineering College Chennai Department of Information Technology Vishwakarma Institute of Information Technology Pune INDIA Department of Electronics and Communication Engineering Kongu Engineering College Erode Tamil Nadu INDIA

ISBN: (数字)9798350329773

ISBN: (纸本)9798350329780

The technical information of the paper attention at the improvement and assessment of an advanced adaptive spectrum allocation (ASA) algorithm for multi-consumer high pace wireless networks. The algorithm makes use of an efficient time-domain slot allocation mechanism to exploit the traits of modern-day Wi-Fi MAC protocols. The aim of the algorithm is to improve the first-class of provider (Qu's) overall performance in multi-consumer surroundings by coordinating the scheduler and the radio get entry to community (RAN). Three predominant overall performance metrics are used to assess the overall performance of the proposed ASA set of rules. The primary is a person consumer's spectral efficiency which measures the overall throughput of the system as a characteristic of the quantity of customers. The second is an aggregated throughput that looks at the overall ability of the network and the way it is dispensed among the customers. The ultimate metric measures the delay skilled by means of the customers whilst having access to the community. The paper also addresses issues associated with channel sensing, admission manage, and premier scheduling of the Wi-Fi hyperlinks. The simulation outcomes display that the proposed algorithm plays higher than other options just like the round robin and FIFO schemes.

关键词： Wireless sensor networks Adaptive systems Spectral efficiency Wireless networks Quality of service Throughput Delays

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SonoPanel 1-3 piezocomposite hydrophone-actuator panels

SonoPanel 1-3 piezocomposite hydrophone-actuator panels

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OCEANS

作者： R. Gentilman D. Fiore W. Serwatka H. Pham B. Pazol C. Near L. Bowen Materials Systems Inc. Littleton MA USA

A cost-effective technology has been developed for producing 1-3 piezoelectric ceramic/polymer composites for active and passive sonar applications. SonoPanel 1-3 piezocomposite transducers consist of an array of piezoelectric ceramic rods in a compliant polymer matrix. The standard composite consists of 15 volume percent PZT-SH rods 1.1 mm diameter/spl times/6.3 mm long in a matrix of soft polyurethane. Stiff face plates are then bonded to the 1-3 composite sheet for stress amplification when used as a sensor and to enhance the surface response uniformity when used as an actuator. Many variations on this composite design have been produced. The key technology in piezocomposite manufacturing is the PZT ceramic injection molding process. Using this process, an entire array of piezoelectric ceramic rods are molded in one operation using specially designed tooling. The process eliminates the need for handling thousands of individual PZT rods during composite manufacturing. Several thousand components with excellent piezoelectric properties and part-to-part reproducibility have been manufactured. The piezocomposite fabrication process has been successfully scaled up for low volume manufacturing. More than thirty 250/spl times/250 mm SonoPanel transducers have been produced and evaluated. The transducers have been tested by the Naval Research Laboratory and others, with high receiving voltage sensitivity and transmitting voltage response as well as symmetrical beam patterns. advanced panels for active surface control are also being developed by incorporating actuators, pressure sensors, and velocity sensors.

关键词： Ceramics Piezoelectric transducers Manufacturing processes Polymers Actuators Voltage Active matrix technology Sonar applications Bonding Stress

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Through mold via technology for multi-sensor stacking

Through mold via technology for multi-sensor stacking

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Electronics Packaging Technology conference (EPTC)

作者： T. Braun M. Bründel K.-F. Becker R. Kahle K. Piefke U. Scholz F. Haag V. Bader S. Voges T. Thomas R. Aschenbrenner K.-D. Lang Fraunhofer Institute for Reliability and Microintegration Berlin Germany Robert Bosch GmbH Stuttgart Germany Microperipheric Center Technical University Berlin Germany

ISBN: (纸本)9781467345538

With the increasing market of handheld electronics e.g. smartphones and tablet PCs also an increasing demand for highly miniaturized multi-sensor packages shows up. One application scenario here would be an electronic compass allowing indoor navigation in complex buildings with a smartphone. These applications of highly miniaturized heterogeneous system integration lead to a need for new packaging technologies which also allow large area processing and 3D integration with potential for low cost applications. Large area mold embedding is one major packaging trend in this area. This paper describes the use of advanced molding techniques for multi-chip embedding in combination with large area and low cost redistribution technology derived from printed circuit board manufacturing with focus on integration of through mold vias for package stacking. The use of compression molding equipment with liquid or granular epoxy molding compounds for the targeted integration process flow is a technological approach that has been developed to allow large area embedding of single chips but also of multiple chips or heterogeneous systems on wafer scale. Embedding area today is typically in the size range of 8” to 12” in diameter, while future developments will deal with panel sizes up to 470 × 370 mm 2 . The wiring of the embedded components in this novel type of SiP is done using PCB manufacturing technologies, i.e. a resin coated copper (RCC) film is laminated over the embedded components - whichever no matter which shape they are: a compression molded wafer or a larger rectangular area or a Molded Array Package (MAP). Interconnects are formed by laser drilling to die pads and electroplating - all of them making use of standard PCB processes. Also through vias for z-axis interconnection, a standard features in PCB manufacturing, can be integrated in the proposed process flow for mold embedding in combination with RCC based redistribution. These vias were laser drilled after RCC lami

关键词： Materials Application specific integrated circuits Acceleration Lasers Vehicles Metallization Reliability

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Joint Unscented Kalman Filter for State and Parameter Estimation in Vehicle Dynamics

Joint Unscented Kalman Filter for State and Parameter Estima...

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conference on Control applications

作者： Mark Wielitzka Matthias Dagen Tobias Ortmaier Research Assistent Institute of Mechatronic Systems Leibniz Universit?t Hannover 30167 Hanover Germany Senior Research Engineer Institute of Mechatronic Systems Institute Director Institute of Mechatronic Systems

ISBN: (纸本)9781479977970

advanced driver assistance systems in modern vehicles have gained interest in the past decades. For most of these systems accurate knowledge about the current driving state, describing the vehicle's stability, and certain parameters is beneficial for improved performance. Especially, a robust estimation of the vehicle's side-slip angle, and, furthermore, knowledge about some influential system parameters, like the vehicle's mass or its moment of inertia, has vast potential to improve the state estimation's accuracy and, therefore, improve the assistance system's performance. In this paper an online estimation of the vehicle's side-slip angle and additional estimation of the mass and moment of inertia, separately and simultaneously is presented using the joint Unscented Kalman Filter. The state estimation results are validated by comparing to measurements taken on a VW Golf vii. The parameter estimation results are verified by comparing to results obtained using a global offline identification algorithm.

关键词： certain parameters beneficial improved

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KOKON - Automotive High Frequency Technology at 77/79GHz

KOKON - Automotive High Frequency Technology at 77/79GHz

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37th European Microwave conference (EUMC 2007), vol.4

作者： Robert Schneider Hans-Ludwig Blocher Karl M. Strohm Daimler Chrysler Group Research and Advanced Engineering GR/EAP Ulm Germany

In future all automotive long and short range radar systems in Europe have to operate in the frequency range 76-81 GHz due to the European radar frequency regulation. For the development of future low-cost, high-performance and highly reliable radar systems the joint project KOKON was initiated. This contribution introduces the objectives of KOKON and presents current results achieved including sensor specification with respect to automotive applications, chip technology development, and realization of first sensor prototypes.

关键词： Automotive engineering sensor systems sensor phenomena and characterization Ultra wideband radar Radar cross section Radio spectrum management Europe Frequency control Prototypes Safety

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Integrated System Development for 3-D VLSI

Integrated System Development for 3-D VLSI

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Electronic Components and Technology conference (ECTC)

作者： L. Schaper S. Burkett M. Gordon L. Cai Y. Liu G. Jampana I. U. Abhulimen Electrical Engineering University of Arkansas Fayetteville AR USA Mechanical Engineering University of Arkansas Fayetteville AR USA

A great deal of work has been done in creating 3-D VLSI by wafer stacking and through silicon via (TSV) processing for dense Z-axis interconnects. Various methods for wafer attachment have been used, including polymer glue, oxide-oxide bonding, and direct metallic bonding. Yet these wafer attachment methods may not be the best way to assemble 3-D systems from VLSI elements. systems consist of more than silicon ICs. Many systems, particularly those designed for RF or sensor applications, may need to assemble both III-V and silicon layers with TSVs, remove significant amounts of heat, provide integrated decoupling and power distribution, and avoid cumulative yield issues by pretesting individual die layers before assembly. Typically, each layer may be a miniature subsystem, so that Z-axis interconnect demand can be satisfied by connections on 100-200 μm pitch. This paper describes an advanced 3-D packaging concept using die stacking rather than wafer bonding. To deal with the CTE mismatch of different materials, compliant copper posts are used to join individual layers. The copper is also used to form a fluid dam around the resulting channel between each pair of die. Circulating fluid is pumped through these channels for heat removal. Sequential attachment of pretested layers is accomplished by forming copper/tin intermetallics. Decoupling and power distribution are provided by thin film capacitors between copper distribution planes on dedicated silicon layers. The results of process development on the various aspects of this approach will be presented. TSVs of 20 μm diameter on 100 μm pitch have been fabricated in wafers thinned to 100 μm thick. Copper posts 30 μm in diameter and 80 μm high have been demonstrated. The results of tests on via and post daisy chains will be presented. Decoupling layers based on thin-film Ta 2 O 5 dielectric capacitors will be described. The design of a complete test vehicle intended to demonstrate the integration of these methods will

关键词： Very large scale integration Copper Silicon Wafer bonding Assembly systems Stacking Radio frequency Power distribution Packaging Capacitors

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Wireless sensor Data Acquisition Design for Engineering applications

Wireless Sensor Data Acquisition Design for Engineering Appl...

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4th International conference on Circuits and systems for Communications (ICCSC 2008), vol.2

作者： Adam Lewis A. Abdelgawad N. F. Tzeng Center for Advanced Computer Studies University of Louisiana Lafayette Lafayette LA USA

Wireless sensor data acquisition (WSDA) is preferred over its wired counterpart due to its easier deployment and simpler maintenance. These characteristics make WSDA attractive to a wide array of engineering applications. This article deals with a framework for WSDA comprised of both legacy sensors and modern sensors commonly found in the oil and gas sector. The framework includes three components: a wireless receiving and transmission (ReT) module, a signal conditioning and digitizing (CoD) module, and a management and control (MaC) module. One ReT module implementation based on TinyOS and Crossbow MICA2 motes has been completed with a goal to integrate different legacy sensors usually found in an oilfield via the aid of proper CoD module implementations. This framework design and its module implementations serve as the basis for fast WSDA prototyping that is key to the oil and gas sector. The WSDA framework is readily applicable to other engineering applications where legacy and modern sensors co-exist.

关键词： Wireless sensor networks Data acquisition Data engineering Design engineering Acoustic sensors Production sensor phenomena and characterization Temperature sensors Programmable control Application software

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The impact of SARA for further advances in Automotive Microwave Sensing

The impact of SARA for further advances in Automotive Microw...

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37th European Microwave conference (EUMC 2007), vol.4

作者： Gerhard Rollmann Hans-Ludwig Bloecher GR-Consulting Tamm Germany Group Research & Advanced Engineering DaimlerChrysler Aerospace Ulm Germany

During the next years, the number of wireless sensor and communication systems used in cars for ubiquitous applications will increase significantly. The operational frequencies will span from the Low Frequency range (9kHz) up to the mmWave (79GHz) range, the bandwidth from narrowband band to Ultra-Wide Band (UWB). Increasingly, however, the electromagnetic spectrum represents a scarce natural resource of strategic national socio-economic importance. Careful international spectrum engineering and regulation is required, in order to ensure coexistence between existing and planned services. Automotive applications traditionally have used free and unlicensed ISM (Industrial, Scientific, Medical) bands, which will be overcrowded in the future. Therefore, the automotive industry needs dedicated frequency allocations for future applications. UWB is one of the most promising new concepts for automotive applications. The SARA (Short range Automotive Radar frequency Allocation) group was founded by the automotive industry in 2001, a newcomer in the field of frequency management SARA's activities focused on international frequency regulation and standardization of UWB automotive short range radar (SRR) for advanced driver assistance and safety applications. As a result of successful SARA activities, the market introduction of these sensors started with the Mercedes-Benz S-class in 2005, followed by BMW's introduction of SRR in 2007 in the 5-series. The SARA group has expanded the focus of its activity from UWB SRR to general frequency needs for automotive radar. With this new focus, SARA has become the Strategic Automotive Radar Frequency Allocation group. This contribution gives an overview on actual and planned wireless sensing systems used in cars and on the necessary spectrum resources for the technologies to be applied. Finally, the current and planned activities of the SARA group are outlined.

关键词： Automotive engineering Radio spectrum management Frequency Wireless sensor networks Automotive applications Ultra wideband radar Wireless communication sensor systems and applications Bandwidth Narrowband

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AGRIFOG: Fog-Assisted IOT Enabled Agriculture Monitoring System

AGRIFOG: Fog-Assisted IOT Enabled Agriculture Monitoring Sys...

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Social and Sustainable Innovations in Technology and Engineering (SASI-ITE), International conference on

作者： Prashanth Ragam Hemanth Katikala Muniraj Parvathi Primilla Ch. Lakshmi Pranathi K Kavinesh Ajith Jubilson E Vellore Institute Of Technology Amaravathi Andhra Pradesh India

ISBN: (数字)9798350360790

ISBN: (纸本)9798350360806

In response to the evolving landscape of agriculture, this report introduces a Fog-enabled IoT agriculture monitoring system aimed at transforming precision farming. The system’s architecture integrates an ESP32 microcontroller interfacing with soil moisture and DHT11 sensors, establishing a resilient network for real-time data acquisition and transmission. Leveraging MQTT communication protocols, the ESP32 seamlessly interacts with a Raspberry Pi Fog node, enabling local real-time analysis and control actions. The integration with the Google Drive API ensures secure cloud storage and periodic synchronization, facilitating historical analysis and visualization. The system’s scalability and affordability are demonstrated through ESP32 firmware development using the Arduino IDE, presenting a practical solution for widespread adoption. The assessment of the system’s performance involved evaluating latency and traffic metrics. With a recorded latency of 0.393 milliseconds, the system exhibits remarkable responsiveness to requests, ensuring efficient interactions with the Google Drive API. Simultaneously, the traffic rate of 0.131 requests per second indicates a moderate level of activity between the application and the cloud platform, underscoring the system’s efficiency in handling data interactions. This Fog-enabled IoT agriculture monitoring system addresses inherent flaws in traditional IoT applications. By incorporating Fog computing, the system overcomes latency challenges, ensuring real-time responsiveness crucial for precision farming. Field tests have substantiated the system’s efficacy in providing timely and reliable data for informed decision-making in agricultural practices. Future directions for system enhancement include the incorporation of advanced machine learning techniques and additional sensors such as $\mathbf{p H}$, light intensity, NPK, and airflow sensors. Thes additions aim to broaden the range of monitored parameters offering nuanced insights

关键词： Cloud computing Protocols Microcontrollers Soil moisture Real-time systems sensor systems sensors

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