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22.2 An 8.5Gb/s/pin 12Gb-LPDDR5 SDRAM with a Hybrid-Bank Architecture using Skew-Tolerant, Low-Power and Speed-Boosting Techniques in a 2nd generation 10nm DRAM Process

22.2 An 8.5Gb/s/pin 12Gb-LPDDR5 SDRAM with a Hybrid-Bank Arc...

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IEEE International conference on Solid-State Circuits (ISSCC)

作者： Hyung-Joon Chi Chang-Kyo Lee Junghwan Park Jin-Seok Heo Jaehoon Jung Dongkeon Lee Dae-Hyun Kim Dukha Park Kihan Kim Sang-Yun Kim Jinsol Park Hyunyoon Cho Sukhyun Lim YeonKyu Choi Youngil Lim Daesik Moon Geuntae Park Jin-Hun Jang Kyungho Lee Isak Hwang Cheol Kim Younghoon Son Gil-Young Kang Kiwon Park Seungjun Lee Su-Yeon Doo Chang-Ho Shin Byongwook Na Jisuk Kwon Kyung Ryun Kim Hyein Choi Seouk-Kyu Choi Soobong Chang Wonil Bae Hyuck-Joon Kwon Young-Soo Sohn Seung-Jun Bae Kwang-Il Park Jung-Bae Lee Samsung Electronics Hwaseong Korea

ISBN: (数字)9781728132051

ISBN: (纸本)9781728132068

Energy efficiency in mobile devices is a pivotal criteria from the overall system point of view. Although the 7.5Gb/s 8Gb LPDDR5 [1], with low-power schemes (internal data copy, dynamic-voltage-frequency scaling (DVFS), and a deep-sleep mode (DSM)), achieves improved energy efficiency compared to the previous LPDDR4x [2], the market demands for higher density and speed gradually increase for high-end applications including hand-held artificial intelligence (AI) and advanced driver assistance system (ADAS). To achieve higher density and speed in a power-efficient manner, this paper proposes a 8.5Gb/s 12Gb LPDDR5 with a hybrid bank architecture (split/merged bank), a skew-tolerant scheme, busbased RDBI AC, and speed-boosting techniques based on 2 nd generation 10nm DRAM process. Adopting a hybrid bank architecture and skew-tolerant scheme enables high speed and power-optimization for each bank-mode in high density memories. Moreover, bus-based RDBI AC achieves 2.1% current gain and command-based WCK control scheme achieves 36mA saving at WCK-always-on mode. The speed-boosting techniques (duty-cycle correction (DCC), an active-resonant load, and a 1-tap DFE receiver) provide improved operating speeds from 7.5Gb/s to 8.5Gb/s@VDD2H = 1.05V, where the read/write DQ valid windows are 0.60UI and 0.64UI (1UI = 118ps).

关键词： Transistors SDRAM Jitter Calibration Hybrid power systems advanced driver assistance systems

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Analysis of encapsulation the fiber Bragg sensors for biomedical applications 15

Analysis of encapsulation the fiber Bragg sensors for biomed...

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conference on Fiber Optic sensors and applications xV

作者： Nedoma, J. Fajkus, M. Jargus, J. Martinek, R. Witas, Karel Vanus, Jan Vasinek, V. VSB Tech Univ Ostrava Fac Elect Engn & Comp Sci Dept Telecommun Ostrava Czech Republic VSB Tech Univ Ostrava Fac Elect Engn & Comp Sci Dept Cybernet & Biomed Engn Ostrava Czech Republic

ISBN: (数字)9781510618206

ISBN: (纸本)9781510618206

The publication describes the use of fiber-optic Bragg sensors in biomedical applications. Fiber-optic sensors are characterized by the immunity to electromagnetic interference (EMI) and by the electrical passivity. Currently, these types of sensors are increasingly being used in biomedical applications, for example, for measuring the temperature or the heart and respiratory rate of the human body. It is very important to encapsulate these types of sensors because encapsulation itself has a major effect on the sensor functionality. This publication describes a comparison of two materials - polymer polydimethylsiloxane (PDMS) and fiberglass (fiberglass is a composite material made up of glass fiber (fabric) and cured synthetic resin). The comparison was conducted by a series of laboratory experiments with ten volunteers with their written consent. Acquired data were compared by the Bland-Altman method.

关键词： Fiber Bragg Grating (FBG) sensor Vital Sign Monitoring Respiratory Rate (RR) Heart Rate (HR)

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Stencil Printing and Flip-Chip Bonding for Assembly of Pixelated x-ray Detectors using PCB-type Interposer and Flexible Printed Circuit Boards

Stencil Printing and Flip-Chip Bonding for Assembly of Pixel...

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European Microelectronics and Packaging conference, EMPC

作者： Andreas Schneider Simon P. Cross Matthew D. Wilson Matthew C. Veale Matthew Hart Paul Seller Marcello Borri Dan Beckett John D. Lipp Rutherford Appleton Laboratory Technology Harwell Campus UK Research and Innovation Science and Technology Facilities Council Didcot UK Daresbury Laboratory SciTech Daresbury Keckwick Lane UK Research and Innovation Science and Technology Facilities Council Daresbury Warrington UK

In recent years multi-layered Flexible Printed Circuit (FPC) boards have advanced considerably in complexity, allowing versatile designs for electronic packaging applications which require interconnect through-via [1]. This makes these boards also attractive for interposers (pitch-convertors) in x-ray detector applications where pixelated sensors are connected to readout Application-Specific Integrated Circuits (ASIC) in order to match different pixel-pitches between sensor and ASIC. Thin boards with total thickness of approx. 140μm are also available and desirable for low radiation absorption of detector packaging in high-energy particle experiments (e.g. CMOS imaging sensor for particle tracker [2,3]). These x-ray detector sensors and ASIC are based on a wide range of materials (Si, Cd(Zn)Te, GaAs). The mismatch in thermal expansion of these different materials is a major challenge. Bonding of sensors and ASIC to flexible boards increases the risk of distortion of the assembly, with potential delamination of components from the board. The paper describes the bonding processes. Stencil printing is used to form an array of dots from electrically conductive adhesive on the sensor, interposer or FPC. ASIC and interposer board are studded with a similar array of gold studs using a ball bonding technique. Subsequently flip-chip bonding is used to bond a studded component to an array of adhesive dots on the printed counterpart. Optimal bonding parameters are evaluated using shear testing and analysis of contact area. The flatness of boards is analysed. Bonded devices are tested for their electronic functionality as x-ray detectors.

关键词： Detectors Bonding Flip-chip devices Silicon sensor arrays Wires

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Backside illuminated CMOS-TDI line scan sensor for space applications 11

Backside illuminated CMOS-TDI line scan sensor for space app...

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conference on sensors and systems for Space applications xI

作者： Cohen, Omer Ofer, Oren Abramovich, Gil Ben-Ari, Nimrod Gershon, Gal Brumer, Maya Shay, Adi Shamay, Yaron SemiCond Devices SCD POB 2250 IL-3102102 Haifa Israel

ISBN: (数字)9781510617940

ISBN: (纸本)9781510617940

A multi-spectral backside illuminated Time Delayed Integration Radiation Hardened line scan sensor utilizing CMOS technology was designed for continuous scanning Low Earth Orbit small satellite applications. The sensor comprises a single silicon chip with 4 independent arrays of pixels where each array is arranged in 2600 columns with 64 TDI levels. A multispectral optical filter whose spectral responses per array are adjustable per system requirement is assembled at the package level. A custom 4T Pixel design provides the required readout speed, low-noise, very low dark current, and high conversion gains. A 2-phase internally controlled exposure mechanism improves the sensor's dynamic MTF. The sensor high level of integration includes on-chip 12 bit per pixel analog to digital converters, on-chip controller, and CMOS compatible voltage levels. Thus, the power consumption and the weight of the supporting electronics are reduced, and a simple electrical interface is provided. An adjustable gain provides a Full Well Capacity ranging from 150,000 electrons up to 500,000 electrons per column and an overall readout noise per column of less than 120 electrons. The imager supports line rates ranging from 50 to 10,000 lines/sec, with power consumption of less than 0.5W per array. Thus, the sensor is characterized by a high pixel rate, a high dynamic range and a very low power. To meet a Latch-up free requirement RadHard architecture and design rules were utilized In this paper recent electrical and electro-ptical measurements of the sensor's Flight Models will be presented for the first time.

关键词： sensors CMOS sensors Image sensors Sun Silicon Line scan sensors Optical filters Back illuminated sensors Earth observing sensors Line scan image sensors Multispectral imaging Space sensors

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Aspects concerning the optimal development of robotic systems architecture for waste sorting tasks 8

Aspects concerning the optimal development of robotic system...

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8th International conference on advanced Concepts in Mechanical Engineering (ACME)

作者： Hancu, O. Rad, C. R. Lapusan, C. Brisan, C. Tech Univ Cluj Napoca Dept Mechatron & Machine Dynam Cluj Napoca Romania

In the last decade waste has become a real problem and therefore measures are needed to stimulate the transition from waste as a problem towards waste as a resource. Robotics technology together with advanced recognition sensor are key enabler technologies that will play an important role in this transition and it is expected to significantly increase the sorting efficiency of some waste streams and replace/complement the labour-intensive manual sorting. In this context, this paper presents aspects concerning the optimal selection of robotic systems architecture for sorting solid recyclable waste streams transported with conveyor belts. An optimization algorithm based on different performance criteria to choose the best robotic system architecture is detailed in the paper too. The numerical results can be a good starting point for other researchers in the field of smart waste management solutions.

关键词： Belt conveyors

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Minimize Residual Energy of the 3-D Underwater sensor Networks with Non-uniform Node Distribution to Prolong the Network Lifetime 13th

Minimize Residual Energy of the 3-D Underwater Sensor Networ...

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13th European-Alliance-for-Innovation (EAI) International conference on Collaborative Computing - Networking, applications and Worksharing (CollaborateCom)

作者： Shi, Gaotao Zeng, Jia Liu, Chunfeng Li, Keqiu Tianjin Univ Sch Comp Sci & Technol Tianjin Peoples R China Tianjin Key Lab Adv Networking TANK Tianjin Peoples R China

ISBN: (纸本)9783030009168;9783030009151

Underwater sensor networks (UWSNs) have caused wide-spread concern of academia due to their wide range of applications. Efficient energy depletion and avoiding energy holes are the important issues. In this paper, we study on the theoretical aspects of the non-uniform node distribution strategy in the 3-D underwater environment, which aim to mitigate the energy holes and balance energy depletion of nodes in the 3-D underwater sensor networks. Based on extensive analysis and theoretical proofs, the absolute balanced energy depletion in the whole underwater sensor networks is not achievable, while the maximized balanced energy depletion except for the nodes in the outermost AGR (Annular Globular Region) is possible. Furthermore, we propose a non-uniform distribution routing algorithm based the minimum energy consumption called MEC to address the energy hole problems and prolong the network lifetime. Extensive simulations show that the network achieves a high energy efficiency, less than 5% of total initial energy is wasted and the network lifetime is prolonged more than 400% compared with the uniform node distribution strategy.

关键词： Underwater sensor networks Energy holes Minimize residual energy Non-uniform node distribution Load balancing

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Development in EFG sapphire at II-VI Optical systems 3

Development in EFG sapphire at II-VI Optical Systems

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conference on advanced Optics for Defense applications - UV through LWIR III

作者： Seitz, M. Peterson, G. II VI Opt Syst 36570 Briggs Rd Murrieta CA 92563 USA

ISBN: (数字)9781510617667

ISBN: (纸本)9781510617667

Large sapphire crystals are currently being grown at II-VI Optical systems with dimensions of approximately 12 '' x 36 '' x 0.300 '' thick via an Edge Defined Film Fed Growth (EFG) method. These crystals are being used to make large sapphire windows for aerospace applications which require high strength and optical performance in the visible to mid-wave infrared regions. In the following paper, II-VI OS will present material data for their EFG sapphire and compare it to that for sapphire grown via the HEM approach, a method which is also used at II-VI OS. Reported data includes index homogeneity evaluated over the entire grown crystal. Other properties to be presented are equibiaxial flexural strength, index of refraction, Knoop hardness, thermal expansion coefficient and modulus of elasticity. The results presented herein will demonstrate that the material performance of sapphire grown at II-VI OS by either method is entirely comparable.

关键词： sapphire EFG edge defined film fed growth homogeneity optical properties material properties HEM heat exchanger method

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Securing Cloud Storage Brokerage systems Through Threat Models 32

Securing Cloud Storage Brokerage Systems Through Threat Mode...

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32nd IEEE International conference on advanced Information Networking and applications (AINA)

作者： Torkura, Kennedy A. Sukmana, Muhammad I. H. Meinig, Michael Kayem, Anne V. D. M. Cheng, Feng Meinel, Christoph Graupner, Hendrik Univ Potsdam Hasso Plattner Inst Potsdam Germany Bundesdruckerei GmbH Berlin Germany

ISBN: (纸本)9781538621950

Cloud storage brokerage is an abstraction aimed at providing value-added services. However, Cloud Service Brokers are challenged by several security issues including enlarged attack surfaces due to integration of disparate components and API interoperability issues. Therefore, appropriate security risk assessment methods are required to identify and evaluate these security issues, and examine the efficiency of countermeasures. A possible approach for satisfying these requirements is employment of threat modeling concepts, which have been successfully applied in traditional paradigms. In this work, we employ threat models including attack trees, attack graphs and Data Flow Diagrams against a Cloud Service Broker (CloudRAID) and analyze these security threats and risks. Furthermore, we propose an innovative technique for combining Common Vulnerability Scoring System (CVSS) and Common Configuration Scoring System (CCSS) base scores in probabilistic attack graphs to cater for configuration-based vulnerabilities which are typically leveraged for attacking cloud storage systems. This approach is necessary since existing schemes do not provide sufficient security metrics, which are imperatives for comprehensive risk assessments. We demonstrate the efficiency of our proposal by devising CCSS base scores for two common attacks against cloud storage: Cloud Storage Enumeration Attack and Cloud Storage Exploitation Attack. These metrics are then used in Attack Graph Metric-based risk assessment. Our experimental evaluation shows that our approach caters for the aforementioned gaps and provides efficient security hardening options. Therefore, our proposals can be employed to improve cloud security.

关键词： Cloud-Security Threat Models Security Metrics Security Risk Assessment Secure Configuration

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In-Line Microfiber-Assisted Mach-Zehnder Interferometer for Microfluidic Highly Sensitive Measurement of Salinity

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IEEE sensorS JOURNAL 2018年第21期18卷 8767-8772页

作者： xie, Nanjie Zhang, Hao Liu, Bo Liu, Haifeng Liu, Ting Wang, Chao Nankai Univ Inst Modern Opt Tianjin Key Lab Optoelect Sensor & Sensing Networ Tianjin 300350 Peoples R China Univ Kent Sch Engn & Digital Arts Canterbury CT2 7NT Kent England

We present a microfluidic U-shaped micro-cavity sensor by splicing a segment of a microfiber of a few hundred micrometers in length tapered from a single-mode fiber (SMF) between two SMFs with a predesigned lateral offset for highly sensitive salinity measurement. The proposed sensing probe serves as an in-line microfiber-assisted Mach-Zehnder interferometer (MAMZI) with an ultra-high refractive index sensitivity of 10(4) nm/RIU. Three Mach-Zehnder interferometer structures with different cavity lengths of 351.82, 242.56, and 181.31 mu m are fabricated, by which microfluidic sensing systems are established for in-line measurement of sodium chloride (NaCl) solution. Experimental results indicate that the detection limit of NaCl solution is as low as 4 x 10(-3) wt% and the response time is less than 15 s, which would make the MAMZI-based microfluidic measuring system play an important role in label-free biological and chemical detection applications.

关键词： Microfluidic sensing salinity sensor fiber-optic interferometer Mach-Zehnder interferometer microfiber

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Bioinspired Artificial sensory Nerve Based on Nafion Memristor

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advanced FUNCTIONAL MATERIALS 2019年第20期29卷 1808783-1808783页

作者： Zhang, Chen Ye, Wen Bin Zhou, Kui Chen, Hong-Ye Yang, Jia-Qin Ding, Guanglong Chen, xiaoli Zhou, Ye Zhou, Li Li, Fengjiao Han, Su-Ting Shenzhen Univ Coll Elect Sci & Technol Shenzhen 518060 Peoples R China Shenzhen Univ Inst Adv Study Shenzhen 518060 Peoples R China Shenzhen Univ Coll Chem & Environm Engn Shenzhen 518060 Peoples R China

Bioinspired artificial haptic neuron system has received much attention in the booming artificial intelligence industry for its broad range of high-impact applications such as personal healthcare monitoring, electronic skins, and human-machine interfaces. An artificial haptic neuron system is designed by integrating a piezoresistive sensor and a Nafion-based memristor for the first time in this paper. The piezoresistive sensor serves as a sensory receptor to transform mechanical stimuli into electric signals, and the Nafion-based memristor serves as the synapse to further process the information. The pyramid-structured sensor exhibits excellent sensitivity (6.7 x 10(7) kPa(-1) in 1-5 kPa and 3.8 x 10(5) kPa(-1) in 5-50 kPa) and durability (>7000 cycles), while the memristor realizes fundamental synaptic functions under low power consumption (10-200 pJ) and remains stable for over 10(4) consecutive tests. The integrated system can detect tactile stimuli encoded with temporal information, such as the count, frequency, duration and speed of the external force. As a proof-of-concept, English characters recognition with high accuracy can be achieved on the system under a supervised learning method. This work shows promising potential in bioinspired sensing systems owing to the high performance, excellent durability, and simple fabrication procedure.

关键词： biomimetic device memristor Nafion piezoresistive pressure sensor

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